Surface mount package for a high power light emitting diode
View Patent ↗A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.
1. A semiconductor package comprising:
an electrically insulating substrate layer;
a non-conductive layer disposed on the electrically insulating substrate layer; and,
a reflector layer disposed on the non-conductive layer,
wherein the electrically insulating substrate layer includes at least one first metallized portion on a first surface thereof and at least one second metallized portion on a second surface thereof, said second surface opposite said first surface, and
wherein the reflector layer is made of a metal with a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of a material of the electrically insulating substrate layer.
2. The semiconductor package of claim 1 , wherein the reflector layer includes a conical portion.
3. The semiconductor package of claim 1 , wherein the non-conductive layer is made of glass.
4. The semiconductor package of claim 3 , wherein the glass has a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.
5. The semiconductor package of claim 4 , wherein the glass and the material of the electrically insulating substrate layer both have a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the metal reflector layer.
6. The semiconductor package of claim 1 , wherein the reflector layer is made of a material comprising metal, said reflector layer material having a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.
7. The semiconductor package of claim 1 , wherein the reflector layer is made of a metal-composite material comprising metal and at least one other material, said metal-composite material having a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.
8. The semiconductor package of claim 1 , wherein the reflector layer is made of a metal-alloy, said metal-alloy having a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.
9. A light emitting device comprising:
an electrically insulating substrate layer with at least one light emitting diode disposed thereon;
a non-conductive layer disposed on the electrically insulating substrate layer; and,
a reflector layer disposed on the non-conductive layer,
wherein the electrically insulating substrate layer includes at least one first metallized portion on a first surface thereof and at least one second metallized portion on a second surface thereof, said second surface opposite said first surface, and
wherein the reflector layer is made of a metal with a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of a material of the electrically insulating substrate layer.
10. The light emitting device of claim 9 , wherein one of the at least one first and second metallized portions are coupled to the light emitting diode.
11. The light emitting device of claim 9 , wherein the reflector layer is made of a material comprising metal, said reflector layer material having a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.
12. The light emitting device of claim 9 , wherein the reflector layer is made of a metal-composite material comprising metal and at least one other material, said metal-composite material having a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.
13. The light emitting device of claim 9 , wherein the reflector layer is made of a metal-alloy, said metal-alloy having a coefficient of thermal expansion which is matched to a coefficient of thermal expansion of the material of the electrically insulating substrate layer.