Patent Assignment
Reel/Frame 032857/0032
Release of Security Interest
Recorded: 2014-05-08
Pages: 29
Assignor
JPMORGAN CHASE BANK, N.A.
Executed: 2014-05-08
Assignee
M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
100 CHELMSFORD STREET, LOWELL, MASSACHUSETTS, 01851
Covered Properties
(186)
Multiple Fet Device Having Direct-Coupled Stages for Improved Microwave Operation
Patent:
4,749,959 →
Application:
06/933,799 →
Microstrip Balun Having Improved Bandwidth
Patent:
4,739,289 →
Application:
06/933,820 →
Automatic Level Control System for Broadband Cable Systems
Patent:
4,835,494 →
Application:
07/183,814 →
Method and Means for Measuring Operating Temperature of Semiconductor Devices by Monitoring Rf Characteristics
Patent:
5,027,064 →
Application:
07/340,611 →
Surface Mount Package for R.F. Devices
Patent:
5,117,068 →
Application:
07/570,121 →
Non-Destructive Semiconductor Wafer Probing System Using Laser Pulses to Generate and Detect Millimeter Wave Signals
Patent:
5,142,224 →
Application:
07/690,329 →
Monolithic Gallium Arsenide Phased Array Using Integrated Gold Post Interconnects
Patent:
5,262,794 →
Application:
07/732,269 →
Electronic Attenuator
Patent:
5,281,928 →
Application:
07/966,305 →
Method for Making a Mesa Type Pin Diode
Patent:
5,268,310 →
Application:
07/981,278 →
Mesa Type Pin Diode
Patent:
5,343,070 →
Application:
08/101,893 →
Circuit Element Having at Least Two Physically Separated Coil-Layers
Patent:
5,844,451 →
Application:
08/201,623 →
Reactive Ion Etched Assisted Gold Post Process
Patent:
5,683,936 →
Application:
08/380,163 →
Process for Producing a Glass-Coated Article
Patent:
5,639,325 →
Application:
08/381,735 →
Fixed Value Fiber Optic Attenuator with Index Matching Material
Patent:
5,581,649 →
Application:
08/430,611 →
Heterolithic Microwave Integrated Impedance Matching Circuitry and Method of Manufacture
Patent:
5,696,466 →
Application:
08/569,616 →
Process to Preserve Silver Metal While Forming Integrated Circuits
Patent:
5,672,282 →
Application:
08/591,063 →
Process for Reducing Bond Resistance in Semiconductor Devices and Circuits
Patent:
5,877,037 →
Application:
08/640,290 →
Metal-Semiconductor Field Effect Transistor Having Reduced Control Voltage and Well Controlled Pinch Off Voltage
Patent:
5,698,875 →
Application:
08/641,299 →
Surface Mount Package with Heat Transfer Feature
Patent:
5,679,979 →
Application:
08/646,802 →
Mixer with Two Diodes Including Dc Coupled If
Patent:
5,852,771 →
Application:
08/663,762 →
Floating Fet Mixer
Patent:
5,697,092 →
Application:
08/676,767 →
Reduced Parasitic Capacitance Semiconductor Devices
Patent:
5,883,422 →
Application:
08/698,744 →
Method of Fabricating a Silicon Bjt
Patent:
5,716,859 →
Application:
08/741,444 →
Transistor Based Frequency Multiplier
Patent:
5,815,014 →
Application:
08/753,627 →
Integrated Circuit Having a Parasitic Resonance Filter
Patent:
5,917,233 →
Application:
08/801,286 →
Heterolithic Microwave Integrated Circuits
Patent:
6,114,716 →
Application:
08/845,726 →
Method of Fabricating Heterolithic Microwave Integrated Circuits
Patent:
6,150,197 →
Application:
08/845,727 →
Two Layer Hermetic-Like Coating Process for on-Wafer Encapsulation of Gaas Mmic's
Patent:
5,914,508 →
Application:
08/863,759 →
Separation of Thermal and Electrical Paths in Flip Chip Ballasted Power Heterojunction Bipolar Transistors
Patent:
5,939,739 →
Application:
08/866,478 →
Ultrahig Vacum Deposition of Silicon (Si-Ge) on Hmic Substrates
Patent:
5,976,941 →
Application:
08/870,219 →
Heterolithic Voltage Controlled Oscillator
Patent:
6,014,064 →
Application:
08/890,534 →
Method of Fabricating Polysilicon Based Resistors in Si-Ge Heterojunction Devices
Patent:
6,040,225 →
Application:
08/920,639 →
Ballasting of High Power Silicon-Germanium Heterojunction Bipolar Transistors
Patent:
6,130,471 →
Application:
08/920,640 →
Integrated Emitter Drain Bypass Capacitor for Microwave/Rf Power Device Applications
Patent:
5,841,184 →
Application:
08/933,644 →
Switched Amplifying Device
Patent:
6,127,886 →
Application:
08/960,903 →
Lateral Conduction Fet Devices with Grounded Source Terminals
Application:
08/985,118 →
Process for Manufacturing Composite Glass/Si Substrates for Microwave Integrated Circuit Fabrication
Patent:
6,191,048 →
Application:
09/001,828 →
Glass-Coated Substrates for High Frequency Applications
Patent:
6,379,785 →
Application:
09/001,950 →
Two Layer Hermetic-Like Coating for on-Wafer Encapsulation of Gaas Mmic's Having Flip-Chip Bonding Capabilities
Patent:
6,137,125 →
Application:
09/019,627 →
Ldmos Structure with via Grounded Source
Patent:
6,297,533 →
Application:
09/070,048 →
Method and Apparatus for Microwave Predistorter Linearizer with Electronic Tuning
Patent:
6,016,076 →
Application:
09/092,323 →
Process for Selective Recess Etching of Epitaxial Field Effect Transistors with a Novel Etch-Stop Layer
Patent:
6,060,402 →
Application:
09/121,160 →
Class of High Hyperpolarizability Organic Chromophores and Process for Synthesizing the Same
Patent:
6,067,186 →
Application:
09/122,806 →
Integrated Circuit Having a Parasitic Resonance Filter
Patent:
6,229,201 →
Application:
09/136,857 →
Apparatus and Method for Efficiently Implementing a Satellite Transceiver System
Patent:
6,052,568 →
Application:
09/138,851 →
Reduced Parasitic Capacitance Semiconductor Devices
Patent:
6,310,394 →
Application:
09/139,685 →
Heterojunction Bipolar Transistor Having Improved Heat Dissipation
Patent:
6,051,871 →
Application:
09/166,673 →
Process for Fabricating Double Recess Pseudomorphic High Electron Mobility Transistor Structures
Patent:
6,242,293 →
Application:
09/193,907 →
INAGA1-Xp Etch Stop Layer for Double Recess Pseudomorphic High Electron Mobility Transistor Structures
Patent:
6,307,221 →
Application:
09/195,478 →
Inverting Charge Pump
Patent:
6,021,056 →
Application:
09/211,587 →
Integrated Global Positioning System Receiver
Patent:
6,272,349 →
Application:
09/255,590 →
Silicon Power Bipolar Junction Transistor with an Integrated Linearizer
Patent:
6,262,631 →
Application:
09/276,397 →
Structure and Process for Improving High Frequency Isolation in Semiconductor Substrates
Patent:
6,642,559 →
Application:
09/291,494 →
Temperature and Process Compensating Circuit and Controller for an Rf Power Amplifier
Patent:
6,194,968 →
Application:
09/307,689 →
Power Sensing Apparatus for Power Amplifiers
Patent:
6,198,351 →
Application:
09/307,913 →
Dual Band Tuning
Patent:
6,862,437 →
Application:
09/450,912 →
Sterically stabilized second-order nonlinear optical chromophores and devices incorporating the same
Patent:
6,361,717 →
Application:
09/488,422 →
Ultraminiature Fiber Optic Pressure Transducer and Method of Fabrication
Patent:
6,506,313 →
Application:
09/495,983 →
Method of Fabricating a Variable Capacity Diode Having a Hyperabrupt Junction Profile
Patent:
6,559,024 →
Application:
09/538,115 →
Sterically Stabilized Second-Order Nonlinear Optical Chromophores with Improved Stability and Devices Incorporating the Same
Patent:
6,616,865 →
Application:
09/546,930 →
Sterically stabilized polyene-bridged second-order nonlinear optical chromophores and devices incorporating the same
Patent:
6,348,992 →
Application:
09/551,685 →
Switched amplifying device
Patent:
6,351,183 →
Application:
09/564,019 →
Multilayer Spiral Inductor and Integrated Circuits Incorporating the Same
Patent:
6,429,504 →
Application:
09/571,909 →
Solder-Coated Articles Useful for Substrate Attachment
Patent:
6,781,065 →
Application:
09/590,406 →
Polymers Containing Polyene-Based Second-Order Nonlinear Optical Chromophores and Devices Incorporating the Same
Patent:
6,652,779 →
Application:
09/679,937 →
Techniques for Electrode Poling of Electro-Optic Polymers to Eliminate Poling Induced Optical Loss and Poling Induced Damage to Electro-Optic Chromophores
Patent:
6,558,585 →
Application:
09/704,955 →
Scalable N X M, Rf Switching Matrix Architecture
Enhancement and Depletion-Mode Phemt Device Having Two Ingap Etch-Stop Layers
Second-Order Nonlinear Optical Chromophores Containing Dioxine and/or Bithiophene as Conjugate Bridge and Devices Incorporating the Same
Low Distortion Broadband Amplifier Using Gaas Phemt Devices
In-Situ Method for Producing a Hydrogen Terminated Hydrophobic Surface on a Silicon Wafer
Patent:
6,821,908 →
Application:
09/952,050 →
Digital Attenuator with Combined Bits
Patent:
6,489,856 →
Application:
09/953,995 →
Fet Structures Having Symmetric and/or Distributed Feedforward Capacitor Connections
Patent:
6,426,525 →
Application:
09/966,189 →
Microstrip Antenna with Improved Low Angle Performance
Application:
09/966,221 →
Publication:
US 2002/0149520
Leadframe-Based Chip Scale Package
Compact Multi-Band Antenna
Printed Circuit Board (Pcb)
Patent:
6,414,246 →
Application:
09/966,236 →
Quick-Attach, Single-Sided Automotive Antenna Attachment Assembly
Photonic Rf Phase Shifter with Mitigated Rf Power Fluctuation and Devices Incorporating the Same
Power Amplifier with Base and Collector Straps
System and Method for Wavelength Conversion Using Traveling-Wave Polymers for Wdm Applications
Back Biased Electro-Optical Modulator
Ultra-High Speed, Active Polymer-Silica Hybrid, Single Control Voltage Mmi-Based 1-by-N Packet Switch and Wg-Based Wdm Packet Router/Tdm Converter and Methods of Making Same
Quadrature Hybrid and Improved Vector Modulator in a Chip Scale Package Using Same
Housing assembly for multi-element surface-mount or drop-in circulator or isolator
Application:
10/067,583 →
Publication:
US 2003/0030501
Tapered Waveguide Interconnection Structure and Method of Fabricating the Same
Multi-Band Antenna Using an Electrically Short Cavity Reflector
Method of Rf Grounding Glass Mounted Antennas to Automotive Metal Frames
Method and Mold for Manufacture of a Solid Molded Article, and a Solid Molded Article Manufactured According to the Method
Hermetic Electric Component Package
High Quality Factor (Q) Planar Spiral Inductor Based Catv Diplexer and Telephony Module
Heterojunction P-I-N Diode and Method of Making the Same
Package for Integrated Circuit with Internal Matching
Quick-Attach Automotive Antenna Mounting Assembly
Method for Suppressing Distortion in Mach-Zehnder Optical Modulators with a Chirped or Variable Operating Wavelength
Diode with Improved Switching Speed
Serial Control of Radio Frequency Integrated Circuits
Compact Non-Linear Hbt Array
Frequency Adjustable Oscillator and Methods of Operation
Dual Band Power Amplifier with Improved Isolation
Apparatus, Methods, and Articles of Manufacture for a Switch Having Sharpened Control Voltage
Apparatus, Methods and Articles of Manufacture for a Low Control Voltage Switch
Inductor Topologies and Decoupling Structures for Filters Used in Broadband Applications, and Design Methodology Thereof
Apparatus Methods and Articles of Manufacture for Packaging an Integrated Circuit with Internal Matching
Frame Structure for High-Temperature Denitration Apparatus
Apparatus and Articles of Manufacture for an Automotive Antenna Mounting Gasket
Individually Biased Transistor High Frequency Switch
Increasing Performance of Planar Inductors Used in Broadband Applications
High Voltage Semiconductor Device
Apparatus, methods and articles of manufacture for flexible antennas
Application:
10/607,395 →
Publication:
US 2004/0189543
Ultra-High Speed, Active Polymer-Silica Hybrid, Single Control Voltage Mmi-Based 1-by-N Packet Switch and Wg-Based Wdm Packet Router/Tdm Converter and Methods of Making Same
Series/Shunt Switch and Method of Control
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Surface Mount Package for a High Power Light Emitting Diode
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Methods of Manufacture for a Low Control Voltage Switch
Non-Magnetic, Hermetically-Sealed Micro Device Package
Apparatus, Methods and Articles of Manufacture for Power Amplifier Control in a Communication System
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Apparatus and method for detecting radio frequency transmission power levels
Application:
10/820,564 →
Publication:
US 2005/0227641
Surface-mount chip-scale package
Application:
10/862,710 →
Publication:
US 2005/0269695
Apparatus and Method for Detecting Radio Frequency Transmission Power Levels
Combined Matching and Filter Circuit
Light Emitting Diode Package
Method of Making Heterojunction P-I-N Diode
Connection Arrangement for Micro Lead Frame Plastic Packages
Surface Mount Package
Quick-Attach Automotive Antenna Mounting Assembly
Grounding Attachment Assembly
Surface mount component RF test fixture
Application:
11/411,387 →
Publication:
US 2007/0247179
High Power Shunt Switch with High Isolation and Ease of Assembly
Fixed tiltable antenna device
Application:
11/486,681 →
Publication:
US 2007/0109197
Multiband Antennas and Devices
Low Profile Antennas and Devices
Splitter/Combiner Circuit
System and method for solder bump plating
Application:
11/602,736 →
Publication:
US 2008/0116077
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Series/Shunt Switch and Method of Control
Series-Shunt Switch with Thermal Terminal
Grid Antenna
Application:
11/855,394 →
Publication:
US 2009/0073066
Tunable Dielectric Resonator Circuit
Application:
11/855,431 →
Publication:
US 2009/0073065
Constant Phase Digital Attenuator with on-Chip Matching Circuitry
Application:
11/859,130 →
Publication:
US 2009/0079489
Wafer Scale Integrated Thermal Heat Spreader
Application:
11/927,109 →
Publication:
US 2009/0108437
Pin Diode with Improved Power Limiting
Multiple Layer Metal Integrated Circuits and Method for Fabricating Same
Application:
12/057,783 →
Publication:
US 2009/0243088
Hermetically Sealed Device with Transparent Window and Method of Manufacturing Same
Application:
12/058,021 →
Publication:
US 2009/0242923
Mechanically Tunable Printed Resonator
Application:
12/113,873 →
Publication:
US 2009/0273406
Power Divider Integrated Circuit
Application:
12/113,880 →
Publication:
US 2009/0273413
Vertical Transistor with Integrated Isolation
Application:
12/138,273 →
Publication:
US 2009/0309155
Chip Package for Semiconductor Devices
Application:
12/138,298 →
Publication:
US 2009/0309199
Printed circuit board assembly
Application:
12/144,886 →
Publication:
US 2009/0316372
Splitter/Combiner Circuit
Application:
12/184,655 →
Publication:
US 2009/0051463
Surface Mount Package
Application:
12/566,744 →
Publication:
US 2010/0018047
Splitter/Combiner Circuit
Application:
12/574,098 →
Publication:
US 2010/0171566
Structure of a Phemt Transistor Capable of Nanosecond Switching
Combined Matching and Filter Circuit
Constant Phase Digital Attenuator with on-Chip Matching Circuitry
Multiband Antennas and Devices
Digitally Controlled High Q Factor Capacitor
Integrated Gps Receiver and Cellular Transceiver Module for Automotive Bus Applications
Novel Triplexer Topology
Broadside-Coupled Transformers with Improved Bandwidth
Power Amplifier with Improved Bandwidth
High Linear Voltage Variable Attenuator (Vva)
INXGA1-XASYP1-Y Quaternary Etch Stop for Improved Chemical Resistivity of Gallium Arsenide Field Effect Transistors
Patent:
8,288,253 →
Application:
13/173,006 →
Field Effect Transistor with Dual Etch-Stop Layers for Improved Power, Performance and Reproducibility
Patent:
8,288,260 →
Application:
13/173,015 →
Electrically Measurable on-Chip Ic Serial Identifier and Methods for Producing the Same
20V to 250V High Current Asic Pin Diode Driver
Switch Configuration for Default-on N-Way Active Splitters
Interlocking Type Solder Connections for Alignment and Bonding of Wafers and/or Substrates
BROADBAND INTEGRATED SINGLE ENDED TO DIFFERENTIAL ACTIVE BALUN WITH AN n-WAY POWER SPLITTER, DC POWER SHUTDOWN CIRCUIT, AND /OR A DEFAULT-ON PORT
Patent:
9,401,770 →
Application:
13/557,717 →
GaN HEMT POWER TRANSISTOR PULSE LEVELING CIRCUIT
Patent:
8,786,342 →
Application:
13/563,155 →
Monolithic Transmit/Receive Module Driver
Patent:
8,933,727 →
Application:
13/592,816 →
Multi-Finger Hemt Layout Providing Improved Third Order Intercept Point and Saturated Output Power Performance
Application:
13/617,925 →
Multi-Finger Hemt Layout Providing Improved Third Order Intercept Point and Saturated Output Power Performance
Patent:
8,872,190 →
Application:
13/644,612 →
Monolithic Integrated Power Regulation for Power Detection and/or Bias Control
Patent:
8,829,997 →
Application:
13/658,140 →
Laminate-Based Voltage-Controlled Oscillator
Patent:
9,209,744 →
Application:
13/765,915 →
Blind via Edge Castellation
Patent:
9,538,636 →
Application:
13/803,081 →
Barrier for Preventing Eutectic Break-Through in Through-Substrate Vias
Patent:
10,147,642 →
Application:
13/870,161 →
Step Connectors in Test Fixture for Packaged Device Measurement
Patent:
9,063,172 →
Application:
13/895,617 →
Broadband Amplifier Topology with Current Shutdown
Patent:
9,444,416 →
Application:
13/920,258 →
Distributed Transconductance Amplifier
Patent:
9,013,237 →
Application:
13/927,593 →
Active Field Effect Transistor Limiter
Patent:
8,937,501 →
Application:
13/943,041 →
High Frequency Monolithic Microwave Integrated Circuit Connection
Patent:
8,970,017 →
Application:
14/016,431 →
Esd Protection Circuit for Cascode Amplifiers
Patent:
9,093,966 →
Application:
14/028,984 →
20V to 250V High Current Asic Pin Diode Driver
Application:
61/525,982 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Sep 30, 2013
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031314/0183 →
Security Interest
May 9, 2014
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.; MINDSPEED TECHNOLOGIES, INC.; BROOKTREE CORPORATION
To: GOLDMAN SACHS BANK USA
Reel/Frame 032859/0374 →
Assignment of Assignor's Interest
Dec 11, 2015
From: MINDSPEED TECHNOLOGIES, INC.
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 037274/0238 →
Change of Name
Jun 23, 2016
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 039139/0826 →