WAFER SCALE INTEGRATED THERMAL HEAT SPREADER
Various embodiments are directed to providing an electronic device with an integrated thermal heat spreader. In one embodiment, an electronic device may comprise an integrated circuit fabricated on a substrate and a heat spreader integrated with the electronic device after fabrication of the integrated circuit. The heat spreader may comprise one or more layers of composite plating material including solid particles incorporated into a metal plating material. The composite plating material may be patterned to the substrate to define the heat spreader. Other embodiments are described and claimed.
1 . An electronic device comprising:
an integrated circuit fabricated on a substrate; and
a heat spreader integrated with the electronic device after fabrication of the integrated circuit, the heat spreader comprising one or more layers of composite plating material including solid particles incorporated into a metal plating material, the composite plating material patterned to the substrate to define the heat spreader.
2 . The electronic device of claim 1 , the heat spreader having a controlled expansion rate wherein a coefficient of thermal expansion (CTE) of the composite plating material substantially matches a CTE of the substrate.
3 . The electronic device of claim 2 , the heat spreader comprising multiple layers of different composite plating materials, the multiple layers providing an average CTE that substantially matches the CTE of the substrate.
4 . The electronic device of claim 1 , the composite plating material deposited in selected regions of the substrate.
5 . The electronic device of claim 4 , the selected regions corresponding to one or more of active areas of the electronic device, thermal mesas, and through-wafer vias.
6 . The electronic device of claim 1 , the solid particles comprising at least one of Diamond, Silicon Carbide (SiC), Beryllium (Be), Beryllium oxide (BeO), Carbon fiber, and Carbon Nanotube.
7 . The electronic device of claim 1 , the metal plating material comprising at least one of Copper (Cu), Aluminum (Al), Gold (Au), Silver (Ag), Tin (Sn), Nickel (Ni), Chromium (Cr), Tungsten (W), Molybdenum (Mo), and an alloy.
8 . An apparatus comprising:
a plurality of dies fabricated on a single wafer; and
a plurality of photoresist masks defining a patterning for depositing a controlled expansion rate composite plating metallization to fabricate a plurality of heat spreaders corresponding to the dies.
9 . The apparatus of claim 8 , the plurality of photoresist masks defining saw streets between heat spreaders.
10 . The apparatus of claim 8 , the plurality of photoresist masks defining patterning within one or more heat spreaders.
11 . The apparatus of claim 8 , wherein a coefficient of thermal expansion (CTE) of the composite plating metallization substantially matches a CTE of the wafer.
12 . The apparatus of claim 11 , the composite plating metallization comprising multiple layers of different composite plating materials, the multiple layers providing an average CTE that substantially matches the CTE of the substrate.
13 . The apparatus of claim 8 , the composite plating metallization deposited in selected regions of the wafer.
14 . The apparatus of claim 13 , the selected regions corresponding to one or more of active areas of the dies, thermal mesas, and through-wafer vias.
15 . The apparatus of claim 8 , the composite plating metallization including solid particles comprising at least one of Diamond, Silicon Carbide (SiC), Beryllium (Be), Beryllium Oxide (BeO), Carbon Fiber, and Carbon Nanotube.
16 . The apparatus of claim 8 , the composite plating metallization including metal plating material comprising at least one of Copper (Cu), Aluminum (Al), Gold (Au), Silver (Ag), Tin (Sn), Nickel (Ni), Chromium (Cr), Tungsten (W), Molybdenum (Mo), and an alloy.
17 . A method comprising:
defining patterning on a wafer for a plurality of heat spreaders;
depositing controlled expansion rate composite plating metallization according to the patterning; and
dicing the wafer to form a plurality of heat spreaders.
18 . The method of claim 17 , further comprising fabricating a plurality of dies on the wafer.
19 . The method of claim 17 , further comprising defining a saw street between heat spreaders.
20 . The method of claim 17 , further comprising defining patterning within one or more heat spreaders.
21 . The method of claim 17 , further comprising layering composite films to control the expansion rate.
22 . The method of claim 21 , the composite films comprising different composite plating materials providing an average CTE that substantially matches the CTE of the substrate.
23 . The method of claim 17 , further comprising depositing the composite plating metallization in selected regions corresponding to one or more of active areas of the electronic device, thermal mesas, and through-wafer vias.
24 . The method of claim 17 , the composite plating metallization including solid comprising at least one of Diamond, Silicon Carbide (SiC), Beryllium (Be), Beryllium Oxide (BeO), Carbon Fiber, and Carbon Nanotube.
25 . The method of claim 17 , the composite plating metallization including metal plating material comprising at least one of Copper (Cu), Aluminum (Al), Gold (Au), Silver (Ag), Tin (Sn), Nickel (Ni), Chromium (Cr), Tungsten (W), Molybdenum (Mo), and an alloy.