Patent Assignment
Reel/Frame 031314/0183
Security Agreement
Recorded: 2013-09-30
Pages: 14
Assignor
M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Executed: 2013-09-26
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 SOUTH DEARBORN, CHICAGO, ILLINOIS, 60603
Covered Properties
(117)
Circuit Element Having at Least Two Physically Separated Coil-Layers
Patent:
5,844,451 →
Application:
08/201,623 →
Reactive Ion Etched Assisted Gold Post Process
Patent:
5,683,936 →
Application:
08/380,163 →
Process for Producing a Glass-Coated Article
Patent:
5,639,325 →
Application:
08/381,735 →
Fixed Value Fiber Optic Attenuator with Index Matching Material
Patent:
5,581,649 →
Application:
08/430,611 →
Process for Reducing Bond Resistance in Semiconductor Devices and Circuits
Patent:
5,877,037 →
Application:
08/640,290 →
Surface Mount Package with Heat Transfer Feature
Patent:
5,679,979 →
Application:
08/646,802 →
Floating Fet Mixer
Patent:
5,697,092 →
Application:
08/676,767 →
Reduced Parasitic Capacitance Semiconductor Devices
Patent:
5,883,422 →
Application:
08/698,744 →
Heterolithic Microwave Integrated Circuits
Patent:
6,114,716 →
Application:
08/845,726 →
Method of Fabricating Heterolithic Microwave Integrated Circuits
Patent:
6,150,197 →
Application:
08/845,727 →
Two Layer Hermetic-Like Coating Process for on-Wafer Encapsulation of Gaas Mmic's
Patent:
5,914,508 →
Application:
08/863,759 →
Switched Amplifying Device
Patent:
6,127,886 →
Application:
08/960,903 →
Lateral Conduction Fet Devices with Grounded Source Terminals
Application:
08/985,118 →
Two Layer Hermetic-Like Coating for on-Wafer Encapsulation of Gaas Mmic's Having Flip-Chip Bonding Capabilities
Patent:
6,137,125 →
Application:
09/019,627 →
Ldmos Structure with via Grounded Source
Patent:
6,297,533 →
Application:
09/070,048 →
Process for Selective Recess Etching of Epitaxial Field Effect Transistors with a Novel Etch-Stop Layer
Patent:
6,060,402 →
Application:
09/121,160 →
Class of High Hyperpolarizability Organic Chromophores and Process for Synthesizing the Same
Patent:
6,067,186 →
Application:
09/122,806 →
Reduced Parasitic Capacitance Semiconductor Devices
Patent:
6,310,394 →
Application:
09/139,685 →
Process for Fabricating Double Recess Pseudomorphic High Electron Mobility Transistor Structures
Patent:
6,242,293 →
Application:
09/193,907 →
INAGA1-Xp Etch Stop Layer for Double Recess Pseudomorphic High Electron Mobility Transistor Structures
Patent:
6,307,221 →
Application:
09/195,478 →
Integrated Global Positioning System Receiver
Patent:
6,272,349 →
Application:
09/255,590 →
Temperature and Process Compensating Circuit and Controller for an Rf Power Amplifier
Patent:
6,194,968 →
Application:
09/307,689 →
Power Sensing Apparatus for Power Amplifiers
Patent:
6,198,351 →
Application:
09/307,913 →
Dual Band Tuning
Patent:
6,862,437 →
Application:
09/450,912 →
Sterically stabilized second-order nonlinear optical chromophores and devices incorporating the same
Patent:
6,361,717 →
Application:
09/488,422 →
Ultraminiature Fiber Optic Pressure Transducer and Method of Fabrication
Patent:
6,506,313 →
Application:
09/495,983 →
Sterically Stabilized Second-Order Nonlinear Optical Chromophores with Improved Stability and Devices Incorporating the Same
Patent:
6,616,865 →
Application:
09/546,930 →
Sterically stabilized polyene-bridged second-order nonlinear optical chromophores and devices incorporating the same
Patent:
6,348,992 →
Application:
09/551,685 →
Switched amplifying device
Patent:
6,351,183 →
Application:
09/564,019 →
Multilayer Spiral Inductor and Integrated Circuits Incorporating the Same
Patent:
6,429,504 →
Application:
09/571,909 →
Polymers Containing Polyene-Based Second-Order Nonlinear Optical Chromophores and Devices Incorporating the Same
Patent:
6,652,779 →
Application:
09/679,937 →
Techniques for Electrode Poling of Electro-Optic Polymers to Eliminate Poling Induced Optical Loss and Poling Induced Damage to Electro-Optic Chromophores
Patent:
6,558,585 →
Application:
09/704,955 →
Scalable N X M, Rf Switching Matrix Architecture
Enhancement and Depletion-Mode Phemt Device Having Two Ingap Etch-Stop Layers
Second-Order Nonlinear Optical Chromophores Containing Dioxine and/or Bithiophene as Conjugate Bridge and Devices Incorporating the Same
Low Distortion Broadband Amplifier Using Gaas Phemt Devices
In-Situ Method for Producing a Hydrogen Terminated Hydrophobic Surface on a Silicon Wafer
Patent:
6,821,908 →
Application:
09/952,050 →
Digital Attenuator with Combined Bits
Patent:
6,489,856 →
Application:
09/953,995 →
Fet Structures Having Symmetric and/or Distributed Feedforward Capacitor Connections
Patent:
6,426,525 →
Application:
09/966,189 →
Leadframe-Based Chip Scale Package
Photonic Rf Phase Shifter with Mitigated Rf Power Fluctuation and Devices Incorporating the Same
Power Amplifier with Base and Collector Straps
System and Method for Wavelength Conversion Using Traveling-Wave Polymers for Wdm Applications
Back Biased Electro-Optical Modulator
Ultra-High Speed, Active Polymer-Silica Hybrid, Single Control Voltage Mmi-Based 1-by-N Packet Switch and Wg-Based Wdm Packet Router/Tdm Converter and Methods of Making Same
Quadrature Hybrid and Improved Vector Modulator in a Chip Scale Package Using Same
Tapered Waveguide Interconnection Structure and Method of Fabricating the Same
Multi-Band Antenna Using an Electrically Short Cavity Reflector
Method of Rf Grounding Glass Mounted Antennas to Automotive Metal Frames
Method and Mold for Manufacture of a Solid Molded Article, and a Solid Molded Article Manufactured According to the Method
Hermetic Electric Component Package
High Quality Factor (Q) Planar Spiral Inductor Based Catv Diplexer and Telephony Module
Heterojunction P-I-N Diode and Method of Making the Same
Package for Integrated Circuit with Internal Matching
Quick-Attach Automotive Antenna Mounting Assembly
Method for Suppressing Distortion in Mach-Zehnder Optical Modulators with a Chirped or Variable Operating Wavelength
Diode with Improved Switching Speed
Serial Control of Radio Frequency Integrated Circuits
Compact Non-Linear Hbt Array
Apparatus, Methods, and Articles of Manufacture for a Switch Having Sharpened Control Voltage
Apparatus, Methods and Articles of Manufacture for a Low Control Voltage Switch
Inductor Topologies and Decoupling Structures for Filters Used in Broadband Applications, and Design Methodology Thereof
Apparatus Methods and Articles of Manufacture for Packaging an Integrated Circuit with Internal Matching
Apparatus and Articles of Manufacture for an Automotive Antenna Mounting Gasket
Individually Biased Transistor High Frequency Switch
Increasing Performance of Planar Inductors Used in Broadband Applications
High Voltage Semiconductor Device
Ultra-High Speed, Active Polymer-Silica Hybrid, Single Control Voltage Mmi-Based 1-by-N Packet Switch and Wg-Based Wdm Packet Router/Tdm Converter and Methods of Making Same
Series/Shunt Switch and Method of Control
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Methods of Manufacture for a Low Control Voltage Switch
Non-Magnetic, Hermetically-Sealed Micro Device Package
Apparatus, Methods and Articles of Manufacture for Power Amplifier Control in a Communication System
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Combined Matching and Filter Circuit
Method of Making Heterojunction P-I-N Diode
High Power Shunt Switch with High Isolation and Ease of Assembly
Multiband Antennas and Devices
Low Profile Antennas and Devices
Splitter/Combiner Circuit
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Series/Shunt Switch and Method of Control
Series-Shunt Switch with Thermal Terminal
Wafer Scale Integrated Thermal Heat Spreader
Application:
11/927,109 →
Publication:
US 2009/0108437
Pin Diode with Improved Power Limiting
Structure of a Phemt Transistor Capable of Nanosecond Switching
Combined Matching and Filter Circuit
Constant Phase Digital Attenuator with on-Chip Matching Circuitry
Multiband Antennas and Devices
Digitally Controlled High Q Factor Capacitor
Integrated Gps Receiver and Cellular Transceiver Module for Automotive Bus Applications
Novel Triplexer Topology
Broadside-Coupled Transformers with Improved Bandwidth
Power Amplifier with Improved Bandwidth
High Linear Voltage Variable Attenuator (Vva)
INXGA1-XASYP1-Y Quaternary Etch Stop for Improved Chemical Resistivity of Gallium Arsenide Field Effect Transistors
Patent:
8,288,253 →
Application:
13/173,006 →
Field Effect Transistor with Dual Etch-Stop Layers for Improved Power, Performance and Reproducibility
Patent:
8,288,260 →
Application:
13/173,015 →
Electrically Measurable on-Chip Ic Serial Identifier and Methods for Producing the Same
20V to 250V High Current Asic Pin Diode Driver
Switch Configuration for Default-on N-Way Active Splitters
Interlocking Type Solder Connections for Alignment and Bonding of Wafers and/or Substrates
BROADBAND INTEGRATED SINGLE ENDED TO DIFFERENTIAL ACTIVE BALUN WITH AN n-WAY POWER SPLITTER, DC POWER SHUTDOWN CIRCUIT, AND /OR A DEFAULT-ON PORT
Patent:
9,401,770 →
Application:
13/557,717 →
GaN HEMT POWER TRANSISTOR PULSE LEVELING CIRCUIT
Patent:
8,786,342 →
Application:
13/563,155 →
Monolithic Transmit/Receive Module Driver
Patent:
8,933,727 →
Application:
13/592,816 →
Multi-Finger Hemt Layout Providing Improved Third Order Intercept Point and Saturated Output Power Performance
Application:
13/617,925 →
Multi-Finger Hemt Layout Providing Improved Third Order Intercept Point and Saturated Output Power Performance
Patent:
8,872,190 →
Application:
13/644,612 →
Monolithic Integrated Power Regulation for Power Detection and/or Bias Control
Patent:
8,829,997 →
Application:
13/658,140 →
Laminate-Based Voltage-Controlled Oscillator
Patent:
9,209,744 →
Application:
13/765,915 →
Blind via Edge Castellation
Patent:
9,538,636 →
Application:
13/803,081 →
Barrier for Preventing Eutectic Break-Through in Through-Substrate Vias
Patent:
10,147,642 →
Application:
13/870,161 →
Step Connectors in Test Fixture for Packaged Device Measurement
Patent:
9,063,172 →
Application:
13/895,617 →
Broadband Amplifier Topology with Current Shutdown
Patent:
9,444,416 →
Application:
13/920,258 →
Distributed Transconductance Amplifier
Patent:
9,013,237 →
Application:
13/927,593 →
Active Field Effect Transistor Limiter
Patent:
8,937,501 →
Application:
13/943,041 →
High Frequency Monolithic Microwave Integrated Circuit Connection
Patent:
8,970,017 →
Application:
14/016,431 →
Esd Protection Circuit for Cascode Amplifiers
Patent:
9,093,966 →
Application:
14/028,984 →
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 6, 2013
From: COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 029764/0808 →
Assignment of Assignor's Interest
Feb 6, 2013
From: COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 029764/0968 →
Assignment of Assignor's Interest
Aug 22, 2013
From: PACIFIC WAVE INDUSTRIES, INC.
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 031063/0909 →
Confirmatory Assignment
Aug 22, 2013
From: UNIVERSITY OF SOUTHERN CALIFORNIA
To: PACIFIC WAVE INDUSTRIES, INC.
Reel/Frame 031075/0811 →
Assignment of Assignor's Interest
Sep 3, 2013
From: DALTON, LARRY R.; FETTERMAN, HAROLD R.; WANG, FANG; STEIER, WILLIAM
To: PACIFIC WAVE INDUSTRIES, INC.
Reel/Frame 031126/0286 →
Release of Security Interest
May 8, 2014
From: JPMORGAN CHASE BANK, N.A.
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 032857/0032 →
Security Interest
May 9, 2014
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.; MINDSPEED TECHNOLOGIES, INC.; BROOKTREE CORPORATION
To: GOLDMAN SACHS BANK USA
Reel/Frame 032859/0374 →
Assignment of Assignor's Interest
May 29, 2015
From: JORDAN, DAVID FREDERICK
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 035742/0531 →
Assignment of Assignor's Interest
Aug 14, 2015
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
To: ROADSCAPE AUTOMOTIVE, INC.
Reel/Frame 036328/0293 →
Release of Security Interest
Aug 17, 2015
From: GOLDMAN SACHS BANK USA
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC
Reel/Frame 036342/0912 →
Assignment of Assignor's Interest
Sep 10, 2015
From: AUTOLIV ROADSCAPE AUTOMOTIVE, INC.
To: AUTOLIV ASP, INC
Reel/Frame 036529/0820 →
Assignment of Assignor's Interest
Dec 11, 2015
From: MINDSPEED TECHNOLOGIES, INC.
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 037274/0238 →
Change of Name
Jun 23, 2016
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 039139/0826 →
Change of Name
Aug 9, 2016
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
To: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 039634/0365 →
Assignment of Assignor's Interest
Jun 4, 2018
From: AUTOLIV ASP, INC
To: VEONEER US INC.
Reel/Frame 046116/0750 →
Assignment of Assignor's Interest
Sep 12, 2022
From: VEONEER, US INC.
To: VEONEER US LLC
Reel/Frame 061060/0397 →
Corrective Assignment to Correct the Address of Assignee Previously Recorded on Reel 061060 Frame 0397. Assignor(S) Hereby Confirms the Assignment.
Feb 23, 2023
From: VEONEER, US INC.
To: VEONEER US LLC
Reel/Frame 063454/0941 →