IP Library Granted Patent US 6,894,585
Granted Patent B2
US 6,894,585 · App. 10/113,660 · Granted May 17, 2005

High quality factor (Q) planar spiral inductor based CATV diplexer and telephony module

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Quick Facts
Patent No.
US 6,894,585
App. No.
10/113,660
Granted
May 17, 2005
Kind
B2
Abstract

A cable television diplexer and telephony module that can be employed in CATV data transmission systems to enhance performance levels and reduce manufacturing costs. The cable television diplexer and telephony module includes a printed circuit board substrate, and a diplexer having a low pass filter section and a high pass filter section, each of which has components mounted on the substrate. The respective low pass and high pass filter sections of the diplexer include one or more high Q value planar spiral inductors. Each spiral inductor includes a narrow track of metal disposed on the substrate and wound around a center to form a circular spiral curve having a plurality of turns. The spiral inductor may be fabricated on the substrate of the cable television diplexer and telephony module, or on a separate substrate, using a standard PCB fabrication process.

Claims (21)

1. A radio frequency input/output module comprising:

a first printed circuit board; and

filter circuitry disposed on the first printed circuit board and configured to receive at least one radio frequency input signal and transmit at least one radio frequency output signal, the filter circuitry including at least one high quality factor value inductor, the high quality factor value inductor comprising a planar spiral inductor fabricated using a standard printed circuit board fabrication process on a second printed circuit board separate from the first printed circuit board.

2. The radio frequency input/output module of claim 1 wherein the first printed circuit board includes at least one hole and the high quality factor value inductor is disposed on the first printed circuit board such that the inductor is in registration with the hole.

3. The radio frequency input/output module of claim 1 wherein the high quality factor value inductor includes at least one narrow track of metal disposed on at least one side of the first printed circuit board.

4. The radio frequency input/output module of claim 3 wherein the narrow track of metal of the inductor is wound around a center via to form a circular spiral curve having a plurality of turns.

5. The radio frequency input/output module of claim 4 wherein the track of metal is disposed on a first side of the first printed circuit board, the track of metal having an inner end connected to the center via, and wherein the center via is configured to allow electrical connection to the inner end of the metal track from a second side of the first printed circuit board.

6. The radio frequency input/output module of claim 5 wherein the track of metal further has an outer end, the outer end being connected to a second via, and wherein the second via is configured to allow electrical connection to the outer end of the metal track from the first side or the second side of the first printed circuit board.

7. The radio frequency input/output module of claim 1 wherein the second printed circuit board has a lower dielectric constant than the first printed circuit board.

8. A method of fabricating a radio frequency input/output module including one or more spiral inductors, comprising the steps of:

fabricating a first printed circuit board according to a predetermined layout of the radio frequency input/output module;

forming a plurality of holes at predetermined locations in the first printed circuit board, each hole having a predetermined radius;

fabricating a second printed circuit board to include at least one spiral inductor, each spiral inductor having an outer radius approximately equal to the hole radius;

separating the spiral inductor from the second printed circuit board; and

positioning the spiral inductor on the first printed circuit board so that the spiral inductor is in registration with the respective hole formed in the first printed circuit board.

9. The method of claim 8 wherein the step of fabricating the printed circuit boards is performed using a standard printed circuit board fabrication process.

10. The method of claim 8 wherein the second printed circuit board has a lower dielectric constant than the first printed circuit board.

11. A radio frequency input/output module, comprising:

a first printed circuit board; and

filter circuitry disposed on the first printed circuit board and configured to receive at least one radio frequency input signal and transmit at least one radio frequency output signal, the filter circuitry including a plurality of high quality factor value inductors, the plurality of high quality factor value inductors comprising a planar circular spiral inductor fabricated using a standard printed circuit board fabrication process, a first subset of the plurality of high quality factor value inductors fabricated on the first printed circuit board and a second subset of the plurality of high quality factor value inductors fabricated on a second printed circuit board and placed on the first printed circuit board.

12. A radio frequency input/output module of claim 11 , wherein the first printed circuit board includes a plurality of holes for receiving the second subset of the plurality of high quality factor value inductors.

Assignments (3)
SECURITY INTEREST Recorded May 9, 2014
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.; MINDSPEED TECHNOLOGIES, INC.; BROOKTREE CORPORATION
To: GOLDMAN SACHS BANK USA
Reel/Frame 032859/0374 →
RELEASE OF SECURITY INTEREST Recorded May 8, 2014
From: JPMORGAN CHASE BANK, N.A.
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 032857/0032 →
SECURITY AGREEMENT Recorded Sep 30, 2013
From: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031314/0183 →