Multi-finger HEMT layout providing improved third order intercept point and saturated output power performance
View Patent ↗A semiconductor device including a plurality of source pads, a plurality of drain fingers, a plurality of gate fingers, a drain combiner connected to the plurality of drain fingers, and a gate combiner connected to the plurality of gate fingers. The plurality of source pads generally comprises a pair of end source pads and one or more inner source pads. Each end source pad is configured to have added inductance. Each of the drain fingers is generally disposed between two of the plurality of source pads. Each of the gate fingers is generally disposed between a respective source pad and a respective drain finger.
1. A semiconductor device comprising;
a plurality of source pads comprising (i) a pair of end source pads each comprising an air bridge coupling structure connected to a ground via and (ii) one or more inner source pads, wherein each end source pad is configured to have added inductance;
a plurality of drain fingers, each disposed between two of said plurality of source pads;
a plurality of gate fingers, each disposed between a respective source pad and a respective drain finger;
a drain combiner connected to said plurality of drain fingers; and
a gate combiner connected to said plurality of gate fingers.
2. The semiconductor device according to claim 1 , wherein said air bridge coupling structure passes over a ground pad coupled to said ground via and said air bridge coupling structure is separated from said ground pad by air.
3. The semiconductor device according to claim 1 , wherein said air bridge coupling structure passes over a ground pad coupled to said ground via and said air bridge coupling structure is separated from said ground pad by a layer of an insulator material other than air.
4. The semiconductor device according to claim 1 , wherein said air bridge coupling structure passes over a ground pad coupled to said ground via and said air bridge coupling structure is separated from said ground pad by a layer of silicon nitride (SiN).
5. The semiconductor device according to claim 1 , wherein connections between said plurality of drain fingers and said drain combiner are configured to equalize an electrical distance between said plurality of drain fingers and a drain terminal of said semiconductor device.
6. The semiconductor device according to claim 5 , wherein two or more of said drain fingers are connected to said drain combiner via air bridge coupling structures.
7. The semiconductor device according to claim 1 , wherein connections between said plurality of gate fingers and said gate combiner are configured to equalize an electrical distance between said plurality of gate fingers and a gate terminal of said semiconductor device.
8. The semiconductor device according to claim 7 , wherein two or more of said gate fingers are connected to said gate combiner via air bridge coupling structures.
9. The semiconductor device according to claim 1 , wherein:
two or more of said drain fingers are connected to said drain combiner by air bridge coupling structures; and
two or more of said gate fingers are connected to said gate combiner by air bridge coupling structures.
10. The semiconductor device according to claim 1 , wherein said semiconductor device is a multi-finger high electron mobility transistor (HEMT).
11. The semiconductor device according to claim 10 , wherein said semiconductor device has n fingers and n is an integer greater than two.
12. The semiconductor device according to claim 1 , wherein one or more path lengths of said gate combiner are adjusted to equalize gate drive phases.
13. The semiconductor device according to claim 1 , wherein one or more path lengths of said drain combiner are adjusted to equalize drain drive phases.
14. A method of fabricating a multi-finger semiconductor device comprising the steps of:
forming a plurality of source pads comprising a pair of end source pads and one or more inner source pads, wherein each end source pad has an adjacent ground pad; and
forming an air bridge coupling structure connecting each end source pad with the adjacent ground pad, wherein each air bridge coupling structure is configured to provide added inductance to the respective end source pad.
15. A semiconductor device comprising:
a plurality of source pads comprising a pair of end source pads and one or more inner source pads, wherein each end source pad is configured to have added inductance;
a plurality of drain fingers, each disposed between two of said plurality of source pads;
a plurality of gate fingers, each disposed between a respective source pad and a respective drain finger;
a drain combiner connected to said plurality of drain fingers, wherein two or more of said drain fingers are connected to said drain combiner by air bridge coupling structures; and
a gate combiner connected to said plurality of gate fingers, wherein two or more of said gate fingers are connected to said gate combiner by air bridge coupling structures.