Non-magnetic, hermetically-sealed micro device package
View Patent ↗A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions; and (c) overlaying a palladium layer on the tungsten layer.
1. A process for preparing an electronic package comprising:
providing a ceramic housing defining an internal cavity for receiving a micro device and having at least one interface portion;
treating said housing to form a tungsten layer on said interface portion; and
overlaying a palladium layer on said tungsten layer on said interface portion to render it a solderable interface portion suitable for soldering to another component;
disposing said micro device in said cavity, and
placing a lid on said housing along said solderable interface portion and exposing said housing to temperatures sufficient to reflow said palladium layer to form a solder seal between said housing and said lid.
2. The process of claim 1 , wherein said tungsten layer is formed by applying tungsten to said interface portion using a thick film technique.
3. The process of claim 2 , wherein said tungsten layer is formed using a high temperature co-fired ceramic technique.
4. The process of claim 1 , wherein said tungsten layer is a about 0.0005″to about 0.001 5″thick.
5. The process of claim 1 , wherein said palladium layer is applied to said tungsten layer elecirolytically.
6. The process of claim 5 , wherein said palladium layer is about 25micro-inches to about 150 micro-inches thick.
7. The process of claim 1 , further comprising applying a protective coating to said palladium layer.
8. The process of claim 7 , wherein said solderable interface portion consists essentially of said tungsten layer, said palladium layer, and said protective coating.