Patent Assignment
Reel/Frame 027015/0444
Security Agreement
Recorded: 2011-10-04
Received: 2011-10-04
Pages: 14
Assignor
M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Executed: 2011-09-30
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 SOUTH DEARBORN, CHICAGO, IL, 60603, UNITED STATES
Covered Properties
(64)
Electrically Measurable on-Chip Ic Serial Identifier and Methods for Producing the Same
Application:
13/222,138 →
Field Effect Transistor with Dual Etch-Stop Layers for Improved Power, Performance and Reproducibility
Application:
13/173,015 →
INXGA1-XASYP1-Y Quaternary Etch Stop for Improved Chemical Resistivity of Gallium Arsenide Field Effect Transistors
Application:
13/173,006 →
High Linear Voltage Variable Attenuator (Vva)
Application:
13/161,782 →
Power Amplifier with Improved Bandwidth
Application:
13/157,602 →
Broadside-Coupled Transformers with Improved Bandwidth
Application:
13/096,371 →
Novel Triplexer Topology
Application:
13/080,945 →
Integrated Gps Receiver and Cellular Transceiver Module for Automotive Bus Applications
Application:
12/961,998 →
Digitally Controlled High Q Factor Capacitor
Application:
12/729,440 →
Multiband Antennas and Devices
Application:
12/728,422 →
Constant Phase Digital Attenuator with on-Chip Matching Circuitry
Application:
12/725,533 →
Combined Matching and Filter Circuit
Application:
12/701,837 →
Structure of a Phemt Transistor Capable of Nanosecond Switching
Application:
12/643,088 →
Pin Diode with Improved Power Limiting
Application:
12/048,821 →
Series-Shunt Switch with Thermal Terminal
Application:
11/823,228 →
Series/Shunt Switch and Method of Control
Application:
11/821,204 →
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Application:
11/608,559 →
Splitter/Combiner Circuit
Application:
11/599,541 →
Low Profile Antennas and Devices
Application:
11/537,616 →
Multiband Antennas and Devices
Application:
11/532,942 →
High Power Shunt Switch with High Isolation and Ease of Assembly
Application:
11/455,067 →
Grounding Attachment Assembly
Application:
11/317,563 →
Surface Mount Package
Application:
11/136,249 →
Method of Making Heterojunction P-I-N Diode
Application:
10/915,579 →
Light Emitting Diode Package
Application:
10/914,361 →
Combined Matching and Filter Circuit
Application:
10/872,947 →
Apparatus and Method for Detecting Radio Frequency Transmission Power Levels
Application:
10/868,123 →
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Application:
10/813,489 →
Apparatus, Methods and Articles of Manufacture for Power Amplifier Control in a Communication System
Application:
10/813,464 →
Non-Magnetic, Hermetically-Sealed Micro Device Package
Application:
10/797,457 →
Methods of Manufacture for a Low Control Voltage Switch
Application:
10/791,243 →
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Application:
10/737,375 →
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Application:
10/660,355 →
Series/Shunt Switch and Method of Control
Application:
10/648,022 →
High Voltage Semiconductor Device
Application:
10/470,481 →
Increasing Performance of Planar Inductors Used in Broadband Applications
Application:
10/456,224 →
Individually Biased Transistor High Frequency Switch
Application:
10/442,764 →
Frequency Adjustable Oscillator and Methods of Operation
Application:
10/344,154 →
Apparatus and Articles of Manufacture for an Automotive Antenna Mounting Gasket
Application:
10/435,243 →
Apparatus Methods and Articles of Manufacture for Packaging an Integrated Circuit with Internal Matching
Application:
10/427,330 →
Inductor Topologies and Decoupling Structures for Filters Used in Broadband Applications, and Design Methodology Thereof
Application:
10/403,343 →
Apparatus, Methods and Articles of Manufacture for a Low Control Voltage Switch
Application:
10/391,259 →
Apparatus, Methods, and Articles of Manufacture for a Switch Having Sharpened Control Voltage
Application:
10/390,957 →
Dual Band Power Amplifier with Improved Isolation
Application:
10/366,062 →
Compact Non-Linear Hbt Array
Application:
10/260,476 →
Serial Control of Radio Frequency Integrated Circuits
Application:
10/244,652 →
Diode with Improved Switching Speed
Application:
10/185,128 →
Quick-Attach Automotive Antenna Mounting Assembly
Application:
10/164,117 →
Package for Integrated Circuit with Internal Matching
Application:
10/142,250 →
Heterojunction P-I-N Diode and Method of Making the Same
Application:
10/139,067 →
High Quality Factor (Q) Planar Spiral Inductor Based Catv Diplexer and Telephony Module
Application:
10/113,660 →
Hermetic Electric Component Package
Application:
10/109,351 →
Method and Mold for Manufacture of a Solid Molded Article, and a Solid Molded Article Manufactured According to the Method
Application:
10/103,086 →
Method of Rf Grounding Glass Mounted Antennas to Automotive Metal Frames
Application:
10/090,391 →
Multi-Band Antenna Using an Electrically Short Cavity Reflector
Application:
10/090,208 →
Quadrature Hybrid and Improved Vector Modulator in a Chip Scale Package Using Same
Application:
10/055,278 →
Power Amplifier with Base and Collector Straps
Application:
10/004,309 →
Leadframe-Based Chip Scale Package
Application:
09/966,222 →
Fet Structures Having Symmetric and/or Distributed Feedforward Capacitor Connections
Application:
09/966,189 →
Digital Attenuator with Combined Bits
Application:
09/953,995 →
In-Situ Method for Producing a Hydrogen Terminated Hydrophobic Surface on a Silicon Wafer
Application:
09/952,050 →
Low Distortion Broadband Amplifier Using Gaas Phemt Devices
Application:
09/925,762 →
Enhancement and Depletion-Mode Phemt Device Having Two Ingap Etch-Stop Layers
Application:
09/861,037 →
Scalable N X M, Rf Switching Matrix Architecture
Application:
09/859,264 →