IP Library › Granted Patent US 7,595,453
Granted Patent B2
US 7,595,453 · App. 11/136,249 · Granted Sep 29, 2009

Surface mount package

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Quick Facts
Patent No.
US 7,595,453
App. No.
11/136,249
Granted
Sep 29, 2009
Kind
B2
Abstract

A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.

Claims (6)

1. A surface mount package comprising:

a first lead frame;

a second lead frame configured to be electrically connected to the first lead frame and forming a metal frame structure having a cavity for receiving therein a surface mounted device; and

a ceramic layer between the first and second lead frames, the ceramic layer configured to electrically isolate a positive side and a negative side of the lead frames.

2. A surface mount package in accordance with claim 1 further comprising an opening in the second lead frame and a corresponding opening in the ceramic layer.

3. A surface mount package in accordance with claim 1 wherein the first lead frame comprises a gap configured to electrically isolate the positive side and the negative side of the lead frames.

Assignments (1)
RELEASE OF SECURITY INTEREST Recorded May 8, 2014
From: JPMORGAN CHASE BANK, N.A.
To: M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
Reel/Frame 032857/0032 →