Leadframe-based chip scale package
View Patent ↗An improved leadframe-based CSP and a method of forming the leadframe-based CSP are provided. The leadframe-based CSP includes a leadframe including a die attach pad and a plurality of wire bonding pads, at least one aperture disposed in the die attach pad, at least one die on the die attach pad, at least one bonding wire for electrically connecting the die and the wire bonding pads, and a mold compound for encapsulating the die and the bonding wire to form a chip package, wherein the mold compound is formed in the aperture.
1. A chip scale package comprising:
a lead frame including at least a die attach pad for connection directly to a circuit board, a plurality of wire bonding pads peripherally located thereon, and at least one aperture formed fully through said die attach pad to separate said the die attach pad into different sections;
at least one die having a first surface and an opposing second surface and being mounted on a section of said die attach pad such that substantially the entire opposing second surface contacts said die attach pad, thereby forming a grounding path which is confined to said section and leads from said at least one die, through said section, and to said circuit board;
at least one bonding wire for electrically connecting said at least one die and at least one of said plurality of wire bonding pads; and
a mold compound, wherein said mold compound encapsulates said at least one die and said at least one bonding wise to form a chip scale package, and wherein the mold compound resides in said the at least one aperture.
2. The chip package of claim 1 , wherein said aperture is formed using a full etch process.
3. The chip package of claim 1 , wherein the shape of said aperture is one of the following a rectangle, a square, an oval, a triangle, a circle, or a combination thereof.
4. The chip package of claim 1 , wherein the chip package is a leadframe-based Chip Scale Package.
5. The chip package of claim 1 , wherein said the aperture includes a plurality of apertures formed around said the at least one die.
6. The chip package of claim 5 , wherein said the at least one die comprises at least a first and a second die, and at least one of said the plurality of apertures is disposed between said first die and said the second die.
7. A method for improving radio frequency grounding in a high dynamic range device comprising operating a chip scale package at radio frequency (RF), said chip scale package comprising:
a leadframe including at least a die attach pad for connection directly to a circuit board, and a plurality or wire bonding pads peripherally located thereon, and at least one aperture formed fully through said die attach and to separate said die attach pad into different sections;
at least one die having a first surface and an opposing second surface and being mounted on a section of said die attach pad such that substantially the entire opposing second surface contacts said die attach pad, thereby forming an RF grounding path which is confined to said section and leads from said at least one die, through said section, and to said circuit board;
at least one bonding wire for electrically connecting said at least one die and at least one of said plurality of wire bounding pads; and
a mold compound, wherein said mold compound encapsulates said at least one die and said at least one bonding wire to form a chip scale package, and wherein the mold compound resides in said least one aperture.