IP Library › Assignment 022714/0890
Patent Assignment
Reel/Frame 022714/0890

Assignment of Assignor's Interest

Recorded: 2009-05-21 Received: 2009-05-21 Pages: 27
Assignor
Assignee
KIWI STONE ACQUISITION CORPORATION
28013 ARASTRADERO ROAD, LOS ALTOS HILLS, CA, 94022, UNITED STATES
Covered Properties (98)
Splitter/Combiner Circuit
Application: 12/184,655 →
Monitoring and Control System for Blood Processing
Application: 12/168,192 →
Printed circuit board assembly
Application: 12/144,886 →
Chip Package for Semiconductor Devices
Application: 12/138,298 →
Vertical Transistor with Integrated Isolation
Application: 12/138,273 →
Power Divider Integrated Circuit
Application: 12/113,880 →
Mechanically Tunable Printed Resonator
Application: 12/113,873 →
Multiple Layer Metal Integrated Circuits and Method for Fabricating Same
Application: 12/057,783 →
Hermetically Sealed Device with Transparent Window and Method of Manufacturing Same
Application: 12/058,021 →
Pin Diode with Improved Power Limiting
Application: 12/048,821 →
Stroboscopic Led Light Source for Blood Processing Apparatus
Application: 11/867,816 →
Circulator/Isolator Housing with Inserts
Application: 11/903,730 →
Constant Phase Digital Attenuator with on-Chip Matching Circuitry
Application: 11/859,130 →
Tunable Dielectric Resonator Circuit
Application: 11/855,431 →
Grid Antenna
Application: 11/855,394 →
Series-Shunt Switch with Thermal Terminal
Application: 11/823,228 →
Series/Shunt Switch and Method of Control
Application: 11/821,204 →
Blood Component Processing System, Apparatus, and Method
Application: 11/727,550 →
Methods for Separation of Particles
Application: 11/680,506 →
Methods and Apparatus for Blood Component Separation
Application: 11/611,567 →
Methods and Apparatus for Blood Component Separation
Application: 11/611,682 →
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Application: 11/608,559 →
Extracorporeal Blood Processing Apparatus with Pump Balancing
Application: 11/563,898 →
System and method for solder bump plating
Application: 11/602,736 →
Splitter/Combiner Circuit
Application: 11/599,541 →
Low Profile Antennas and Devices
Application: 11/537,616 →
Multiband Antennas and Devices
Application: 11/532,942 →
Extracorporeal Blood Processing Methods with Return-Flow Alarm
Application: 11/530,122 →
Extracorporeal Blood Processing Methods with Multiple Alarm Levels
Application: 11/530,111 →
Centrifuge for Processing a Blood Product with a Bag Set Having a Processing Bag
Application: 11/461,593 →
Fixed tiltable antenna device
Application: 11/486,681 →
High Power Shunt Switch with High Isolation and Ease of Assembly
Application: 11/455,067 →
Surface mount component RF test fixture
Application: 11/411,387 →
Fluid Separation Devices, Systems and/or Methods Using a Centrifuge and Roller Pump
Application: 11/307,451 →
Centrifugal Separation Apparatus and Method for Separating Fluid Components
Application: 11/348,524 →
Grounding Attachment Assembly
Application: 11/317,563 →
Quick-Attach Automotive Antenna Mounting Assembly
Application: 11/304,419 →
Surface Mount Package
Application: 11/136,249 →
Blood Processing Information System with Blood Loss Equivalency Tracking
Application: 10/908,227 →
Apparatus for Producing Blood Component Products
Application: 11/044,887 →
Stroboscopic Led Light Source for Blood Processing Apparatus
Application: 10/905,353 →
Method of Making Heterojunction P-I-N Diode
Application: 10/915,579 →
Light Emitting Diode Package
Application: 10/914,361 →
Ferrite Circulator Having Alignment Members
Application: 10/894,812 →
Monitoring and Control System for Blood Processing
Application: 10/884,877 →
Combined Matching and Filter Circuit
Application: 10/872,947 →
Apparatus and Method for Detecting Radio Frequency Transmission Power Levels
Application: 10/868,123 →
Extra-Corporeal Blood Processing Method and Apparatus Based on Donor Characteristics
Application: 10/709,196 →
Handset Radiofrequency Front End Module in Fine Pitch Quad Flat No Lead (Fqfp-N) Package
Application: 10/813,489 →
Apparatus, Methods and Articles of Manufacture for Power Amplifier Control in a Communication System
Application: 10/813,464 →
Non-Magnetic, Hermetically-Sealed Micro Device Package
Application: 10/797,457 →
Methods of Manufacture for a Low Control Voltage Switch
Application: 10/791,243 →
Apparatus and Method for Separating a Volume of Composite Liquid into at Least Two Components
Application: 10/783,831 →
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Application: 10/737,375 →
Surface Mount Package for a High Power Light Emitting Diode
Application: 10/696,005 →
Extracorporeal Blood Processing Methods and Apparatus
Application: 10/681,035 →
Apparatus, Methods and Articles of Manufacture for a Multi-Band Switch
Application: 10/660,355 →
Series/Shunt Switch and Method of Control
Application: 10/648,022 →
Methods and Apparatuses for Blood Component Separation
Application: 10/648,559 →
High Voltage Semiconductor Device
Application: 10/470,481 →
Increasing Performance of Planar Inductors Used in Broadband Applications
Application: 10/456,224 →
Individually Biased Transistor High Frequency Switch
Application: 10/442,764 →
Apparatus and Articles of Manufacture for an Automotive Antenna Mounting Gasket
Application: 10/435,243 →
Apparatus Methods and Articles of Manufacture for Packaging an Integrated Circuit with Internal Matching
Application: 10/427,330 →
Blood Component Processing System, Apparatus, and Method
Application: 10/414,475 →
Inductor Topologies and Decoupling Structures for Filters Used in Broadband Applications, and Design Methodology Thereof
Application: 10/403,343 →
Apparatus, Methods and Articles of Manufacture for a Low Control Voltage Switch
Application: 10/391,259 →
Apparatus, Methods, and Articles of Manufacture for a Switch Having Sharpened Control Voltage
Application: 10/390,957 →
Above Resonance Isolator/Circulator and Method of Manufacture Thereof
Application: 10/383,718 →
Dual Band Power Amplifier with Improved Isolation
Application: 10/366,062 →
Methods and Apparatus for Separation of Particles
Application: 10/310,528 →
Compact Non-Linear Hbt Array
Application: 10/260,476 →
Serial Control of Radio Frequency Integrated Circuits
Application: 10/244,652 →
Diode with Improved Switching Speed
Application: 10/185,128 →
Quick-Attach Automotive Antenna Mounting Assembly
Application: 10/164,117 →
Package for Integrated Circuit with Internal Matching
Application: 10/142,250 →
Heterojunction P-I-N Diode and Method of Making the Same
Application: 10/139,067 →
High Quality Factor (Q) Planar Spiral Inductor Based Catv Diplexer and Telephony Module
Application: 10/113,660 →
Hermetic Electric Component Package
Application: 10/109,351 →
Method and Mold for Manufacture of a Solid Molded Article, and a Solid Molded Article Manufactured According to the Method
Application: 10/103,086 →
Method of Rf Grounding Glass Mounted Antennas to Automotive Metal Frames
Application: 10/090,391 →
Multi-Band Antenna Using an Electrically Short Cavity Reflector
Application: 10/090,208 →
Housing assembly for multi-element surface-mount or drop-in circulator or isolator
Application: 10/067,583 →
Cascaded Circulators with Common Ferrite and Common Element Matching Structure
Application: 10/067,605 →
Quadrature Hybrid and Improved Vector Modulator in a Chip Scale Package Using Same
Application: 10/055,278 →
Power Amplifier with Base and Collector Straps
Application: 10/004,309 →
Quick-Attach, Single-Sided Automotive Antenna Attachment Assembly
Application: 09/972,807 →
Microstrip Antenna with Improved Low Angle Performance
Application: 09/966,221 →
Printed Circuit Board (Pcb)
Application: 09/966,236 →
Leadframe-Based Chip Scale Package
Application: 09/966,222 →
Fet Structures Having Symmetric and/or Distributed Feedforward Capacitor Connections
Application: 09/966,189 →
Compact Multi-Band Antenna
Application: 09/966,235 →
Digital Attenuator with Combined Bits
Application: 09/953,995 →
In-Situ Method for Producing a Hydrogen Terminated Hydrophobic Surface on a Silicon Wafer
Application: 09/952,050 →
Low Distortion Broadband Amplifier Using Gaas Phemt Devices
Application: 09/925,762 →
Ferrite-Circuit Aligning Frame
Application: 09/881,470 →
Enhancement and Depletion-Mode Phemt Device Having Two Ingap Etch-Stop Layers
Application: 09/861,037 →
Scalable N X M, Rf Switching Matrix Architecture
Application: 09/859,264 →