Granted Patent B2

US 7,402,842 · App. 10/914,361 · Granted Jul 22, 2008

Abstract

Claims (28)

1. A light emitting diode package comprising:

a sub-mount portion; and

a frame portion extending from the sub-mount portion, the frame portion having angled walls and configured to receive a light emitting diode therein, and wherein each of the sub-mount portion and frame portion are formed from silicon wafers bonded together.

2. A light emitting diode package in accordance with claim 1 further comprising a cavity formed by the frame portion and configured for mounting at least one light emitting diode therein.

3. A light emitting diode package in accordance with claim 1 wherein the angled walls are configured at an angle of about 54.7 degrees to redirect light emitted from a light emitting diode mounted in the frame portion.

4. A light emitting diode package in accordance with claim 1 wherein the sub-mount portion comprises a surface-mount chip-scale package.

5. A light emitting diode package in accordance with claim 1 further comprising a metalized surface on the angled walls.

6. A light emitting diode package in accordance with claim 1 wherein at least one of the frame portion and a light emitting diode within the frame portion is overcoated.

7. A light emitting diode package in accordance with claim 6 wherein the overcoating forms a generally planar layer over the frame portion.

8. A light emitting diode package in accordance with claim 1 wherein a distance between a lower edge of a light emitting diode within the frame portion and a lower edge of the angled walls is about ten microns.

9. A light emitting diode package in accordance with claim 1 wherein a plurality of frame portions forming a plurality of cavities are etched within a silicon wafer, and wherein the plurality of cavities are each configured to receive therein at least one light emitting diode.

10. A light emitting diode assembly comprising:

a sub-mount portion formed from a silicon substrate and defining a surface mount package for mounting light emitting diodes thereon; and

a plurality of frame portions etched from a silicon wafer and forming a plurality of cavities defined by angled walls, the plurality of cavities each configured to receive at least one of the light emitting diodes therein and wherein at least one of the plurality of cavities includes a plurality of light emitting diodes therein.

11. A light emitting diode assembly in accordance with claim 10 wherein a distance between a lower edge of the light emitting diode and a lower edge of the angled walls is between about five microns and about thirty microns.

12. A light emitting diode assembly in accordance with claim 10 further comprising a metalized surface on the angled walls.

13. A light emitting diode assembly in accordance with claim 10 further comprising an overcoating layer on one of the frame portion and light emitting diode.

14. A light emitting diode assembly in accordance with claim 10 wherein at least one of a shape and size of the cavity is configured based on one of a shape and size of the light emitting diode.

15. A light emitting diode assembly in accordance with claim 10 wherein the angled walls are configured at an angle of between about 45 degrees and about 65 degrees.

16. A method of manufacturing a package for a light emitting diode, said method comprising:

forming at least one sub-mount portion for mounting a light emitting diode thereon, the sub-mount portion having at least one protection element integrated therewith;

forming separately at least one frame portion defining a cavity for receiving the light emitting diode therein, the frame portion having angled walls; the at least one frame portion attached to the at least one sub-mount portion; and

forming a package for a light emitting diode from the at least one sub-mount portion and at least one frame portion, and wherein the at least one sub-mount portion and at least one frame portion are formed from silicon material.

17. A method in accordance with claim 16 further comprising encapsulating at least one of the frame portion and the light emitting diode.

18. A method in accordance with claim 16 further comprising forming a mirrored surface on the angled walls.

19. A method in accordance with claim 16 further comprising mounting the sub-mount portion to a printed circuit board.

20. A method in accordance with claim 16 wherein the angled walls are configured at an angle of about 54.7 degrees and configured to redirect light emitted from a light emitting diode within the frame portion.

21. A method in accordance with claim 16 wherein the angled walls are configured at an angle of between about 45 degrees and about 65 degrees.

Assignments (10)