RFIC die-package configuration
View Patent ↗A RFIC includes a die and a package. The die contains a radio frequency (RF) input/output (I/O) section, an RF-to-baseband conversion section, and a baseband processing section. The package includes a plurality of connections for connecting to the die. The die is positioned within the package to minimize adverse affects of parasitics components of coupling the RFIO section to an antenna. The positioning of the die within the package may be offset from the center of the package and/or positioned at the edge of the package.
1. A radio frequency integrated circuit (RFIC) comprises:
a die containing a radio frequency (RF) input/output (I/O) section; and
a package having pluralities of connections, wherein each connection of the RF I/O section is connected to a corresponding one of the pluralities of connections to connect the RF I/O section to an off-die antenna, wherein the die is positioned off centered within the package to minimize coupling distance between the RF I/O section and the off die antenna.
2. The RFIC of claim 1 , wherein the plurality of connections comprises a plurality of solder balls of a ball grid array package and the each connection of the RF I/O section including a plurality of solder balls of a ball grid array.
3. The RFIC of claim 1 further comprises positioning the die at an edge of the package.
4. The RFIC of claim 1 , wherein the die further comprises:
a radio frequency to baseband conversion section operably coupled to the RF I/O section.
5. The RFIC of claim 4 , wherein the die further comprises:
a baseband processing section operably coupled to the radio frequency to baseband conversion section.