Dual stage pre-heater
A system for electronic component processing, including: a frame configured to hold a printed circuit board; a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board; a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises: a first stage configured to direct heat over a wide area of the printed circuit board; and a second stage configured to heat a focused region of the printed circuit board adjacent to the electronic component.
1. A system for electronic component processing, comprising:
a frame configured to hold a printed circuit board;
a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board;
a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and
a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises:
a first stage configured to direct heat over a wide area of the printed circuit board; and
a second stage configured to heat a focused region of the printed circuit board adjacent to the electronic component.
2. The system of claim 1 , wherein each of the first and second stages of the dual-stage pre-heater comprise forced air convection heaters.
3. The system of claim 2 , wherein each of the first and second stages of the dual-stage pre-heater are positioned below the printed circuit board, and wherein first stage of the pre-heater is configured to generally uniformly heat the printed circuit board, and wherein the second stage of the pre-heater is configured to heat a focused region of the printed circuit board directly below the electronic component.
4. The system of claim 1 , wherein each of the first and second stages of the dual-stage pre-heater are independently controllable.
5. The system of claim 2 , wherein the first and second stages of the pre-heater are positioned to supply heated air flow concentric to one another.
6. The system of claim 5 , further comprising:
a focusing chamber connected to the output of the second stage of the pre-heater.
7. The system of claim 6 , wherein the focusing chamber is conical shaped.
8. The system of claim 2 , wherein the dual-stage pre-heater further comprises:
a bowl, wherein each of the first and second stages of the pre-heater supply air flow into the bowl such that air flows in a vortex in the bowl.
9. The system of claim 8 , wherein the bowl has two chambers, and wherein each of the first and second stages of the pre-heater supply air flow into the one of the chambers of the bowl.
10. The system of claim 2 , wherein each of the first and second stages of the dual-stage pre-heater have dedicated heating elements and blowers.
11. The system of claim 2 , wherein the heater in the tool head supplies less than 60% of the total heat directed towards the printed circuit board.
12. The system of claim 1 , wherein the second stage of the dual-stage pre-heater is movably positionable with respect to the first stage of the dual-stage pre-heater.
13. A dual-stage pre-heater for heating a printed circuit board with an electronic component positioned thereon, comprising:
a first forced air convection stage configured to uniformly heat a printed circuit board, and
a second forced air convection stage configured to heat a focused region of the printed circuit board, wherein the first and second forced air convention stages direct air in the same direction.
14. The system of claim 13 , wherein the first and second stages of the pre-heater are positioned to supply heated air flow concentric to one another.
15. The system of claim 14 , further comprising:
a focusing chamber connected to the output of the second stage of the pre-heater.
16. The system of claim 15 , wherein the focusing chamber is conical shaped.
17. The system of claim 13 , wherein each of the first and second stages of the dual-stage pre-heater have dedicated heating elements and blowers.
18. A dual-stage pre-heater for heating a printed circuit board with an electronic component positioned thereon, comprising:
a first forced air convection stage configured to uniformly heat a printed circuit board, and
a second forced air convection stage configured to heat a focused region of the printed circuit board, wherein the dual-stage pre-heater is configured to be connected to a component process assembly and re-work platform such that the dual-stage pre-heater directs air flow towards the bottom of the printed circuit board.
19. The dual-stage pre-heater of claim 18 , wherein the first stage of the dual-stage pre-heater uniformly heats the bottom of the printed circuit board, and wherein the second stage of the dual-stage pre-heater heats a focused region of the printed circuit board directly below an electronic component positioned on the printed circuit board.
20. A dual-stage pre-heater for heating a printed circuit board with an electronic component positioned thereon, comprising:
a first forced air convection stage configured to uniformly heat a printed circuit board, and
a second forced air convection stage configured to heat a focused region of the printed circuit board, wherein the dual-stage pre-heater further comprises:
a bowl, wherein each of the first and second stages of the pre-heater supply air flow into the bowl such that air flows in a vortex in the bowl.
21. The system of claim 20 , wherein the bowl has two chambers, and wherein each of the first and second stages of the pre-heater supply air flow into the one of the chambers of the bowl.
22. A method of soldering or de-soldering an electronic component on a printed circuit board, comprising:
positioning an electronic component on top of a printed circuit board;
pre-heating the bottom of the printed circuit board with a dual-stage pre-heater by:
uniformly heating the bottom of the printed circuit board with a first stage of the pre-heater, and
heating a focused region of the printed circuit board directly below the electronic component with the second stage of the pre-heater, and then
heating the top of the electronic component with a heat source positioned above the electronic component.
23. The method of claim 22 , wherein the electronic component is positioned on top of a printed circuit board by a moveable tool head, and wherein the beat source positioned above the electronic component comprises a heat source disposed in the moveable tool head.
24. The method of claim 22 , wherein the first stage of the pre-heater provides uniform heating of the printed circuit board, and wherein the heat source positioned above the electronic component and the second stage of the pre-heater provides focused top and bottom heating of the electronic component, respectively.
25. The method of claim 24 , wherein the focused top and bottom heating of the electronic component causes solder between the electronic component and the printed circuit board to reflow.
26. The method of claim 25 , wherein the solder is a lead free solder.
27. The method of claim 22 , wherein heating with each stage of the dual-stage pre-heater comprises heating with a forced air convection system.
28. The method of claim 22 , wherein the heat source positioned above the electronic component supplies less than 60% of the total heat directed towards the printed circuit board.
29. A kit for soldering or de-soldering an electronic component on a printed circuit board, comprising:
the system for component process re-work and assembly set forth in claim 1 ; and
instructions for use setting forth the method of claim 22 .
30. A system for electronic component processing, comprising:
a frame configured to hold a printed circuit board;
a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board;
a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and
a dual-stage pre-heater connected to the flame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises:
a first heating stage; and
a second heating stage, and wherein the first heating stage and the second heating stage are independently operable.
31. A system for electronic component processing, comprising:
a frame configured to hold a printed circuit board;
a tool head connected to the frame, the tool head being configured to position an electronic component on top of the printed circuit board;
a heater disposed in the tool head, the heater being configured to direct heat towards the electronic component; and
a dual-stage pre-heater connected to the frame, the dual-stage pre-heater being configured to direct heat towards the printed circuit board, wherein the pre-heater comprises:
a first stage configured to distribute heat over a wide area; and
a second stage configured to distribute heat over a focused area.
32. A dual-stage pre-heater for heating a printed circuit board with an electronic component positioned thereon, comprising:
a first forced air convection stage configured to distribute heat over a wide area, and
a second forced air convection stage configured to distribute heat over a focused area, wherein the first and second forced air convention stages direct air in the same direction.
33. A method of soldering or de-soldering an electronic component on a printed circuit board, comprising:
positioning an electronic component on top of a printed circuit board;
pre-heating the bottom of the printed circuit board with a dual-stage pre-heater by:
uniformly heating the bottom of the printed circuit board, and
heating a focused region of the printed circuit board directly below the electronic component; and then
heating the top of the electronic component with a heat source positioned above the electronic component.