Method and apparatus for improved baffle plate
A baffle plate assembly, configured to be coupled to a substrate holder in a plasma processing system, comprises a baffle plate having one or more openings to permit the passage of gas there through, wherein the coupling of the baffle plate to the substrate holder facilitates auto-centering of the baffle plate in the plasma processing system. For example, a centering ring mounted in the substrate holder can comprise a centering feature configured to couple with a mating feature on the baffle plate. After initial assembly of the plasma processing system, the baffle plate can be replaced and centered within the plasma processing system without disassembly and re-assembly of the substrate holder.
1. A baffle plate assembly for surrounding a substrate holder in a plasma processing system comprising:
a centering ring configured to be coupled to said substrate holder, wherein at least a portion of said centering ring extends radially outside a periphery of said substrate holder; and
a removable baffle plate comprising one or more passageways, wherein said baffle plate is configured to be centered within said plasma processing system by removably coupling said baffle plate to said portion of said centering ring extending radially outside said periphery of said substrate holder, and
wherein said centering ring comprises a centering feature configured to center said baffle plate on said centering ring.
2. The baffle plate assembly of claim 1 , wherein said centering feature comprises at least one of a centering pin, a centering receptacle, a centering edge, and radial face gear teeth.
3. The baffle plate assembly of claim 1 , wherein said baffle plate comprises a mating feature configured to be coupled with said centering feature.
4. The baffle plate assembly of claim 3 , wherein said mating feature comprises at least one of a centering pin, a centering receptacle, a centering edge, and radial face gear teeth.
5. A baffle plate assembly for surrounding a substrate holder in a plasma processing system comprising:
a centering ring configured to be coupled to said substrate holder, wherein at least a portion of said centering ring extends radially outside a periphery of said substrate holder; and
a removable baffle plate comprising one or more passageways, wherein said baffle plate is configured to be centered within said plasma processing system by removably coupling said baffle plate to said portion of said centering ring extending radially outside said periphery of said substrate holder, and
wherein said centering ring is made from aluminum.
6. A baffle plate assembly for surrounding a substrate holder in a plasma processing system comprising:
a centering ring configured to be coupled to said substrate holder, wherein at least a portion of said centering ring extends radially outside a periphery of said substrate holder; and
a removable baffle plate comprising one or more passageways, wherein said baffle plate is configured to be centered within said plasma processing system by removably coupling said baffle plate to said portion of said centering ring extending radially outside said periphery of said substrate holder, and
wherein a surface of said baffle plate comprises a protective barrier.
7. A baffle plate assembly for surrounding a substrate holder in a plasma processing system comprising:
a centering ring configured to be coupled to said substrate holder, wherein at least a portion of said centering ring extends radially outside a periphery of said substrate holder; and
a removable baffle plate comprising one or more passageways, wherein said baffle plate is configured to be centered within said plasma processing system by removably coupling said baffle plate to said portion of said centering ring extending radially outside said periphery of said substrate holder, and
wherein a portion of a surface of said baffle plate comprises a protective barrier.
8. The baffle plate assembly of claim 6 or 7 , wherein said protective barrier comprises at least one of surface anodization, a coating formed using plasma electrolytic oxidation, and a spray coating.
9. The baffle plate assembly of claim 6 or 7 , wherein said protective barrier comprises a layer of at least one of a III-column element and a Lanthanon element.
10. The baffle plate assembly of claim 6 or 7 , wherein said protective barrier comprises at least one of Al 2 O 3 , Yttria (Y 2 O 3 ), Sc 2 O 3 , Sc 2 F 3 , YF 3 , La 2 O 3 , CeO 2 , Eu 2 O 3 , and DyO 3 .
11. A method of replacing a baffle plate disposed adjacent a centering ring with at least a portion of said centering ring extending radially outside a periphery of a substrate holder, said baffle plate surrounding said substrate holder in a plasma processing system, the method comprising:
removing said first baffle plate from said centering ring in said plasma processing system, and
installing a second baffle plate in said plasma processing system by coupling said second baffle plate to said centering ring, wherein said coupling facilitates autocentering of said second baffle plate in said plasma processing system.