IP Library Granted Patent US 7,264,641
Granted Patent B2
US 7,264,641 · App. 10/705,533 · Granted Sep 4, 2007

Polishing pad comprising biodegradable polymer

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Quick Facts
Patent No.
US 7,264,641
App. No.
10/705,533
Granted
Sep 4, 2007
Kind
B2
Abstract

The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydroxybutyric acid, hydroxyvaleric acid, caprolactone, p-dioxanone, trimethylene carbonate, butylene succinate, butylene adipate, monosaccharides, dicarboxylic acid anhydrides, enantiomers thereof, and combinations thereof. The invention is further directed to methods of its use.

Claims (6)

1. A polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer, wherein the biodegradable polymer comprises (a) a repeat unit selected from the group consisting of L-lactic acid, D-lactic acid, or a combination thereof; or (b) a polymer selected from the group consisting of polyglycolide, polycaprolactone, poly(dioxanone), poly(trimethylene carbonate), polyglyconate, polybydroxybutyrate, polyhydroxyvalerate, poly(1,4-butylene succinate), poly(1,4-butylene adipate), polyanbydrides, polyorthoesters, DL-polylactide, D-polylactide, L-polylactide, poly(DL-lactide-co-glycolide), poly(ethylene glycol-co-lactide), poly(L-lactide-co-caprolactone-co-glycolide), and combinations thereof; and wherein the polishing pad has a polishing surface and is in the form of micropellets of the biodegradable polymer dispersed in a non-biodegradable polymer resin.

2. The polishing pad of claim 1 , wherein the biodegradable polymer is cross-linked.

3. The polishing pad of claim 1 , wherein the polishing pad further comprises abrasive particles.

4. The polishing pad of claim 3 , wherein the abrasive particles are selected from metal oxide particles, boron nitride particles, diamond particles, ceramic particles, and combinations thereof.

5. The polishing pad of claim 3 , wherein the abrasive particles are disposed on a polishing surface of the polishing pad or are dispersed throughout the body of the polishing pad.

6. The polishing pad of claim 1 , wherein the non-biodegradable polymer resin is selected from the group consisting of thermoplastic elastomers, thermoplastic polyurethanes, thermoplastic polyolefins, polycarbonates, polyvinylalcohols, nylons, elastomeric rubbers, elastomeric polyethylenes, polytetrafluoroethylenes, polyethyleneterephthalates, polyimides, polyaramides, polyarylens, polystyrenes, polymethylmethacrylic acids, polyethylene oxides, rubbers, copolymers thereof, and mixtures thereof.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2003
From: PRASAD, ABANESHWAR
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 014207/0267 →