Triple gate device having strained-silicon channel
View Patent ↗A three-dimensional Triple-Gate (Tri-gate) device having a three-sided strained silicon channel and superior drive current is provided. The Tri-gate device includes a composite fin structure consisting of a silicon germanium core and a three-sided strained silicon epitaxy layer grown from surface of said silicon germanium core. A gate strip wraps a channel portion of the composite fin structure. Two distal end portions of the composite fin structure not covered by the gate strip constitute source/drain regions of the Tri-gate device. A high quality gate insulating layer is interposed between the composite fin structure and the gate strip.
1. A three dimensional Triple Gate (Tri-gate) device comprising:
a composite fin structure consisting of a silicon germanium core and a strained silicon epitaxy layer grown from surface of said silicon germanium core;
a gate strip wrapping a portion of said composite fin structure, wherein portions of said composite fin structure not covered by said gate strip constitute source/drain regions of said Tri-gate device; and
a gate insulating layer interposed between said composite fin structure and said gate strip.
2. The Tri-gate device of claim 1 wherein said composite fin structure has a substantially flat top surface and vertical sidewalls.
3. The Tri-gate device of claim 2 wherein said composite fin structure has a width of said flat top surface that is approximately equal to its height.
4. The Tri-gate device of claim 1 wherein said strained silicon epitaxy layer has a thickness of about 50˜300 angstroms.
5. The Tri-gate device of claim 1 wherein said gate strip is made of polysilicon or metal gate.
6. A Tri-gate device comprising:
a composite fin structure consisting of a semiconductor core and a strained epitaxy layer grown from surface of said semiconductor core, said semiconductor core having a first lattice constant that miss-matches a second lattice constant of said strained epitaxy layer;
a gate strip wrapping a portion of said composite fin structure, wherein portions of said composite fin structure not covered by said gate strip constitute source/drain regions of said Tri-gate device; and
a gate insulating layer interposed between said composite fin structure and said gate strip.
7. The Tri-gate device of claim 6 wherein said semiconductor core consists of silicon germanium.
8. The tri-gate device of claim 6 wherein said strained epitaxy layer is a strained silicon epitaxy layer.
9. The tri-gate device of claim 8 wherein said strained silicon epitaxy layer has thickness of about 50˜300 angstroms.
10. The Tri-gate device of claim 6 wherein said gate strip is made of polysilicon or metal gate.