IP Library › Granted Patent US 7,002,100
Granted Patent B2
US 7,002,100 · App. 10/717,945 · Granted Feb 21, 2006

Laser assisted machining method and device

Assignee: Industrial Technology Research Institute
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Quick Facts
Patent No.
US 7,002,100
App. No.
10/717,945
Granted
Feb 21, 2006
Kind
B2
Abstract

A laser assisted machining method and device comprise a tool mount on which a laser head is disposed. A digital thermometer is disposed in a machining tool or on the tool mount for feeding data to a system controller. A laser is used to enable the blade of the machining tool to heat and soften a workpiece instantaneously. As the machining process is in progress, the chip is rapidly removed. The temperature of the tool tip is monitored by the digital thermometer for automatic control of the temperature of heating the workpiece by the laser, thereby keeping the temperature of the tool tip in a specific allowable range. The efficiency of the machining process and the surface precision are thus enhanced.

Claims (18)

1. A pulse laser assisted machining method comprising a fine machining process, said fine machining process comprising the following steps of:

(a) focusing a laser beam in such a manner that a focal point is located on a workpiece, and that the focal point is separated from a front of the blade of a machining tool by a microdistance;

(b) moving the workpiece and the machining tool in relation to each other;

(c) softening a focused area by an instantaneous laser heating;

(d) advancing the machining tool such that the machined material and the softened material are removed together, and that the same machining mechanism is repeated until a subsequent laser emission;

wherein the laser beam is brought into focus such that the focal point is separated from the front of the blade of the machining tool by a distance ranging from several μm to more than 10 μm.

2. The method as defined in claim 1 , wherein each pulse time of the laser is measured in unit of microsecond or nanosecond.

3. The method as defined in claim 1 , wherein the focal heating range of the laser has a width of several μm to more than 10 μm, and a length of more than 10 μm to several hundred μm.

4. A laser assisted machining device comprising:

a tool mount;

a machining tool mounted on the tool mount;

a laser head mounted on the tool mount such that the laser beam of the laser head can be focused on a workpiece for instantaneously heating and softening the workpiece;

a chip spray mounted on the tool mount for removing chip by a high-pressure fluid emission;

a digital thermometer disposed in a handle of the machining tool or on the tool mount for monitoring the temperature of a tool tip of the machining tool; and

a system controller for receiving data of the tool tip temperature so as to control automatically laser.

5. The device as defined in claim 4 , wherein the chip spray removes the chip by a high-pressure gas or liquid.

6. The device as defined in claim 4 , wherein the laser head emits pulsed or continuous laser beam.

7. The device as defined in claim 4 , wherein the digital thermometer is a thermocouple or infrared digital thermometer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2003
From: WU, JINN-FA; GUU, YEOU-BIN
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 014739/0939 →
Priority Claims (1)
TW 91134563 A · Nov 28, 2002 · national
Continuity (1)
Related Publication 20040104207A1 · Jun 3, 2004