Flanged terminal pins for DC/DC converters
A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.
1. A terminal pin comprising:
an elongated pin for insertion into a hole of a printed circuit board; and
a flange having a shoulder to abut the printed circuit board into which the pin is inserted, the flange being chamfered to provide a vent to the hole of the printed circuit board.
2. A terminal pin as claimed in claim 1 comprising two opposed chamfers.
3. A terminal pin as claimed in claim 2 wherein edges of the two opposed chamfers are at about the periphery of the pin.
4. A circuit module comprising:
a circuit substrate having circuitry thereon; and
at least one rigid terminal pin attached to the circuit substrate, the terminal pin including a flange having a shoulder to abut a printed circuit board into which the pin is inserted, the flange being chamfered to provide a vent to a hole of the printed circuit board into which the pin is inserted.
5. A module as claimed in claim 4 comprising two opposed chamfers.
6. A module as claimed in claim 5 wherein edges of the two opposed chamfers are at about the periphery of the pin.
7. A module as claimed in claim 4 wherein the pin is electrically connected to the circuitry.
8. A circuit board assembly comprising:
a printed circuit board;
a circuit module having circuitry thereon; and
at least one rigid terminal pin attached to the circuit module, the terminal pin including a flange having a shoulder to abut the printed circuit board, the flange being chamfered to provide a vent to a hole of the printed circuit board into which the pin is inserted.
9. A circuit board assembly as claimed in claim 8 comprising two opposed chamfers.
10. A circuit board assembly as claimed in claim 9 wherein edges of the two opposed chamfers are at about the periphery of the pin.
11. A circuit board assembly as claimed in claim 8 wherein the pin is electrically connected to the circuitry.
12. A method of soldering a circuit module to a printed circuit board comprising:
providing at least one rigid terminal pin on the circuit module, the terminal pin including a flange having a shoulder to abut a hole in a printed circuit board into which the pin is inserted, the flange having a chamfer facing the printed circuit board;
positioning the module on the printed circuit board with the pin inserted into a hole in the printed circuit board and the flange shoulder abutting the printed circuit board, the chamfer providing a vent to the hole; and
causing solder to flow through an opening between the chamfer and printed circuit board.
13. A method as claimed in claim 12 wherein the solder is applied in a wave soldering process.
14. A method as claimed in claim 12 wherein the solder is applied in a reflow soldering process.
15. A method as claimed in claim 12 comprising two opposed chamfers.
16. A method as claimed in claim 15 wherein edges of the two opposed chamfers are at about the periphery of the pin.