Heater-equipped pusher, electronic component handling apparatus, and temperature control method for electronic component
View Patent ↗A pusher is constituted by a pusher main body, which is capable of direct contact with an electronic component to be tested, a heat absorbing and radiating body provided on the pusher main body, a heater provided on the pusher main body to enable direct or indirect contact with the electronic component to be tested, and a thermal insulating material provided between the pusher main body and the heater. According to such a pusher, temperature control of an electronic component can be performed such that the electronic component nears a target set temperature for testing.
1. A heater-equipped pusher for pushing a terminal of an electronic component to be tested in an electronic component handling apparatus into a contact portion of a test head, comprising:
a pusher main body which is capable of direct contact with the electronic component to be tested;
a heat absorbing and radiating body provided on said pusher main body;
a heater provided on said pusher main body to enable direct or indirect contact with the electronic component to be tested without intervention of said pusher main body; and
a thermal insulating material provided between said pusher main body and said heater,
wherein the heater is disposed on a lower portion of the pusher main body so as to be exposed on a same plane as a lower surface of the pusher main body.
2. A heater-equipped pusher for pushing a terminal of an electronic component to be tested in an electronic component handling apparatus into a contact portion of a test head, comprising:
a pusher main body which is capable of direct contact with the electronic component to be tested;
a heat absorbing and radiating body provided on said pusher main body;
a heater provided on said pusher main body to enable direct or indirect contact with the electronic component to be tested without intervention of said pusher main body; and
a thermal insulating material provided between said pusher main body and said heater,
wherein the heat absorbing and radiating body is a heat sink.
3. The heater-equipped pusher of claim 2 , wherein the heat sink includes a plurality of radiator fins.
4. The heater-equipped pusher of claim 2 , wherein the heat sink includes a plurality of heat pipes.
5. A temperature control method for controlling the temperature of an electronic component to be tested during the testing of the electronic component in an electronic component handling apparatus, comprising:
cooling of the electronic component to be tested, performed by cooling a heat absorbing and radiating body to which the heat of the electronic component is transferred through a pusher main body, the pusher main body being in contact with the electronic component; and
heating of the electronic component to be tested, performed by a heater, and
preventing heat conduction from the heater to the pusher main body and the heat absorbing and radiating body by a thermal insulating material provided between the pusher main body and the heater,
wherein the heater is disposed on a lower portion of the pusher main body so as to be exposed on a same plane as a lower surface of the pusher main body.