IP Library Granted Patent US 7,109,655
Granted Patent B2
US 7,109,655 · App. 10/744,296 · Granted Sep 19, 2006

Light emitting device and method for manufacturing the same

Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 7,109,655
App. No.
10/744,296
Granted
Sep 19, 2006
Kind
B2
Abstract

When attaching a substrate with an EL element formed thereon and a transparent sealing substrate, the periphery of a pixel portion is surrounded with a first sealing agent that maintains a gap between the two pieces of substrates, an entire surface of the pixel portion is covered with a second transparent sealing agent so that the two pieces of substrate is fixed with the first sealing agent and the second sealing agent. Consequently, the EL element can be encapsulated by curing the first sealing agent and the second sealing agent without enclosing a drying agent and doing damage to the EL element due to UV irradiation even when a sealing device only having a function of UV irradiation is used.

Claims (44)

1. A method of manufacturing a light emitting device, comprising:

forming a pair of first patterns and a second pattern so as to surround the pair of first patterns by a first sealing agent over a first substrate;

dropping a second sealing agent having a light transmitting property after being cured and a lower viscosity than that of the first sealing agent, between the pair of first patterns;

attaching the first substrate and a second substrate with a pixel portion having an EL element formed thereon so that the pixel portion is arranged between the pair of first patterns;

spreading out the second sealing agent so as to cover an entire surface of the pixel portion when attaching the first substrate and the second substrate; and

curing the first sealing agent and the second sealing agent.

2. A method of manufacturing a light emitting device according to claim 1 ,

wherein the second pattern is formed so as to have a plurality of gaps in the vicinity of each midpoint on two sides of the second pattern that is formed along the pair of first patterns; and

wherein the second sealing agent is completely shielded from an outside air with the first sealing agent by filling the gap when attaching the first substrate and the second substrate.

3. A method of manufacturing a light emitting device according to claim 1 , wherein the first sealing agent is cured by UV irradiation and subsequently the second sealing agent is cured by heating.

4. A method of manufacturing a light emitting device according to claim 1 , wherein after curing the first sealing agent and the second sealing agent, the first substrate and the second substrate are sectioned along the second pattern.

5. A method of manufacturing a light emitting device, comprising:

forming a pair of first patterns and a second pattern so as to surround the pair of first patterns by a first sealing agent over a first substrate;

dropping a second sealing agent having a light transmitting property after being cured and a lower viscosity than that of the first sealing agent, between the pair of first patterns;

attaching the first substrate and a second substrate with a pixel portion having an EL element formed thereon so that the pixel portion is arranged between the pair of first patterns;

spreading out the second sealing agent so as to protrude from openings between each end of the pair of first patterns and the second pattern when attaching the first substrate and the second substrate; and

curing the first sealing agent and the second sealing agent.

6. A method of manufacturing a light emitting device according to claim 5 ,

wherein the second pattern is formed so as to have a plurality of gaps in the vicinity of each midpoint on two sides of the second pattern that is formed along the pair of first patterns; and

wherein the second sealing agent is completely shielded from an outside air with the first sealing agent by filling the gap when attaching the first substrate and the second substrate.

7. A method of manufacturing a light emitting device according to claim 5 , wherein the first sealing agent is cured by UV irradiation and subsequently the second sealing agent is cured by heating.

8. A method of manufacturing a light emitting device according to claim 5 , wherein after curing the first sealing agent and the second sealing agent, the first substrate and the second substrate are sectioned along the second pattern.

9. A method of manufacturing a light emitting device, comprising:

forming two linear patterns and a square pattern having curved corners so as to surround the two linear patterns by using a first sealing agent over a first substrate;

dropping a second sealing agent having a light transmitting property after being cured and a lower viscosity than that of the first sealing agent, between the two linear patterns;

attaching the first substrate and a second substrate with a pixel portion having an EL element formed thereon so that the pixel portion is arranged between the two linear patterns;

spreading out the second sealing agent so as to cover an entire surface of the pixel portion when attaching the first substrate and the second substrate; and

curing the first sealing agent and the second sealing agent.

10. A method of manufacturing a light emitting device according to claim 9 ,

wherein the square pattern having the curved corners is formed so as to have a gap in the vicinity of each midpoint on two sides of the square pattern having the curved corners that is formed along the two linear patterns, and

wherein the second sealing agent is completely shielded from an outside air with the first sealing agent by filling the gap when attaching the first substrate and the second substrate.

11. A method of manufacturing a light emitting device according to claim 9 , wherein after curing the first sealing agent and the second sealing agent, the first substrate and the second substrate are sectioned along the square pattern having the curved corners.

12. A method of manufacturing a light emitting device according to claim 9 , wherein the first sealing agent is cured by UV irradiation and subsequently the second sealing agent is cured by heating.

13. A method of manufacturing a light emitting device, comprising:

forming two linear patterns and a square pattern having curved corners so as to surround the two linear patterns by using a first sealing agent over a first substrate;

dropping a second sealing agent having a light transmitting property after being cured and a lower viscosity than that of the first sealing agent, between the two linear patterns;

attaching the first substrate and a second substrate with a pixel portion having an EL element formed thereon so that the pixel portion is arranged between the two linear patterns;

spreading out the second sealing agent so as to protrude from an opening between each end of the two linear patterns and the square pattern having the curved corners when attaching the first substrate and the second substrate; and

curing the first sealing agent and the second sealing agent.

14. A method of manufacturing a light emitting device according to claim 13 ,

wherein the square pattern having the curved corners is formed so as to have a gap in the vicinity of each midpoint on two sides of the square pattern having the curved corners that is formed along the two linear patterns, and

wherein the second sealing agent is completely shielded from an outside air with the first sealing agent by filling the gap when attaching the first substrate and the second substrate.

15. A method of manufacturing a light emitting device according to claim 13 , wherein the first sealing agent is cured by UV irradiation and subsequently the second sealing agent is cured by heating.

16. A method of manufacturing a light emitting device according to claim 13 , wherein after curing the first sealing agent and the second sealing agent, the first substrate and the second substrate are sectioned along the square pattern having the curved corners.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2003
From: KURIHARA, TOMOYUKI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 014841/0646 →
Priority Claims (1)
JP 2002-378668 · Dec 26, 2002 · national
Continuity (1)
Related Publication 20050040762A1 · Feb 24, 2005