Method for forming flowable dielectric layer in semiconductor device
The method for forming a flowable dielectric layer without micro-voids therein in a semiconductor device is employed to utilize a ultra-violet (UV) bake process. The method includes steps of: forming a plurality of patterns on a semiconductor substrate, wherein narrow and deep gaps are formed therebetween; forming a flowable dielectric layer so as to fill the gaps between the patterns; carrying out a baking process for densifying the flowable dielectric layer from a bottom face thereof; forming a plurality of contact holes by selectively etching the flowable dielectric layer; carrying out a pre-cleaning process in order to remove native oxide and impurity substances on the contact holes; and forming a plurality of contact plugs by filling a conductive material into the contact holes.
1. A method for forming a flowable dielectric layer in a semiconductor device, the method comprising the steps of:
a) forming a plurality of patterns on a semiconductor substrate, wherein narrow and deep gaps are formed therebetween;
b) forming a flowable dielectric layer so as to fill the gaps between the patterns;
c) carrying out a ultra-violet (UV) baking process for densifying the flowable dielectric layer from a bottom face thereof, wherein the UV bake process is carried out while supplying a cooling gas over the flowable dielectric layer;
d) forming a plurality of contact holes by selectively etching the flowable dielectric layer;
e) carrying out a pre-cleaning process in order to remove native oxide and impurity substances on the contact holes; and
f forming a plurality of contact plugs by filling a conductive material into the contact holes.
2. The method as recited in claim 1 , wherein the cooling gas uses an inert gas such as argon gas, helium gas or the like.
3. The method as recited in claim 1 , wherein the UV bake process is carried out under a pressure in a range of about 1 mTorr to about 100 Torr by supplying the inert gas.
4. The method as recited in claim 1 , wherein the UV bake process is carried out at a temperature in the range of about 300° C. to about 800° C.
5. The method as recited in claim 1 , after the step c), further comprising the step of carrying out a thermal process for densifying the flowable dielectric layer from a top face thereof.
6. The method as recited in claim 5 , wherein the step of carrying out the thermal process after the step c) is performed at the temperature ranging from about 300° C. to about 800° C.
7. The method as recited in claim 1 , wherein the step b) is carried out by means of a spin on dielectric (SOD) technique by using a material selected from the group consisting of a silicate, a siloxane, a methyl SilsesQuioxane (MSQ), a hydrogen SisesQuioxane(HSQ), a MSQ/HSQ, a perhydrosilazane (TCPS) and polysilazane.
8. The method as recited in claim 1 , wherein the step b) is carried out by using a low temperature dielectrics at a temperature in a range of about −10° C. to about 150° C. under a pressure ranging from about 10 mTorr to about 100 Torr, wherein a reaction source uses a mixture gas of SiH x (CH 3 ) Y (1x≦4, 1≦y≦4), H 2 O 2 , O 2 , H 2 O and N 2 O.
9. The method as recited in claim 1 , wherein the step b) is carried out by using a low temperature dielectrics at a temperature in a range of about −10° C. to about 150° C. under a pressure ranging from about 10 mTorr to about 100 Torr, wherein a reaction source uses a mixture gas of SiH 4 , H 2 O 2 , O 2 , H 2 O and N 2 O.