Ceramic embedded wireless antenna
Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.
1. A method of fabricating an antenna package, comprising:
providing at least one unfired ceramic layer;
disposing an antenna on said unfired ceramic layer;
disposing an unfired, powder ceramic material adjacent said antenna, wherein a top surface of the antenna substantially free of said unfired ceramic material; and
firing said unfired ceramic layer and said unfired ceramic material.
2. The method of claim 1 , wherein providing said at least one unfired ceramic layer comprises providing at least one layer of an unfired ceramic tape.
3. The method of claim 1 , wherein providing said at least one unfired ceramic layer comprises providing at least one unfired ceramic layer selected from the group comprising calcium titanate, magnesium titanate, barium titanate, forsterite, and magnesium calcium titanate.
4. The method of claim 1 , wherein said disposing an unfired, powder ceramic material comprises disposing an unfired, powder ceramic layer selected from the group comprising calcium titanate, magnesium titanate, barium titanate, forsterite, and magnesium calcium titanate.
5. The method of claim 1 , further comprising providing at least one conductive via contacting said antenna through said at least one unfired ceramic layer.
6. A method of fabricating an antenna-containing heat dissipation device, comprising:
providing at least one unfired ceramic layer having a first surface and a second surface;
disposing an antenna on one of said unfired ceramic layer first surface and said unfired ceramic layer second surface;
disposing an unfired, powder ceramic material adjacent said antenna, wherein a top surface of the antenna substantially free of said unfired ceramic material;
forming at least one thermal via through said at last one unfired ceramic layer and said unfired, powder ceramic material; and
firing said unfired ceramic layer and said unfired ceramic material.
7. The method of claim 6 , wherein providing said at least one unfired ceramic layer comprises providing at least one layer of an unfired ceramic tape.
8. The method of claim 6 , wherein providing said at least one unfired ceramic layer comprises providing at least one unfired ceramic layer selected from the group comprising calcium titanate, magnesium titanate, barium titanate, forsterite, and magnesium calcium titanate.
9. The method of claim 6 , wherein said disposing an unfired, powder ceramic material comprises disposing an unfired, powder ceramic layer selected from the group comprising calcium titanate, magnesium titanate, barium titanate, forsterite, and magnesium calcium titanate.
10. The method of claim 6 , further comprising providing at least one conductive via extending through said at least one unfired ceramic layer and contacting said antenna.
11. The method of claim 6 , further comprising disposing a stand-off on said at least one of said providing at least one conductive via extending through said at least one unfired ceramic layer and contacting said antenna.
12. A microelectronic device assembly, comprising:
a microelectronic die having an active surface and a back surface;
a substrate having a first surface, wherein said microelectronic die is attached to said substrate first surface by said microelectronic die active surface; and
an antenna package attached to said substrate and in electrical contact with said microelectronic die, comprising,
an antenna having a top surface; and
a ceramic material surrounding at least a portion of said antenna, wherein said antenna top surface is substantially free of said ceramic material.
13. The microelectronic device assembly of claim 12 , wherein said antenna top surface is in electrical contact with the microelectronic die.
14. The microelectronic device assembly of claim 12 , further including at least one conductive via contacting said antenna through said ceramic material, and wherein said at least one conductive via is in electrical contact with the microelectronic die.
15. A microelectronic device assembly, comprising:
a microelectronic die having an active surface and a back surface;
a substrate having a first surface, wherein said microelectronic die is attached to said substrate first surface by said microelectronic die active surface; and
an antenna-containing heat dissipation device abutting said microelectronic die back surface, comprising:
an antenna having a top surface, wherein said antenna is in electronic contact with said microelectronic die;
a ceramic material surrounding at least a portion of said antenna, wherein said antenna top surface is substantially free of said ceramic material; and
at least one thermal via extending through said ceramic material.
16. The microelectronic device assembly of claim 15 , whether said antenna-containing heat dissipation device further includes a stand-off attached to said substrate.