IP Library Granted Patent US 7,071,501
Granted Patent B2
US 7,071,501 · App. 10/747,057 · Granted Jul 4, 2006

Image sensor having integrated single large scale pixel and pixel separation pattern

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,071,501
App. No.
10/747,057
Granted
Jul 4, 2006
Kind
B2
Abstract

An image sensor is disclosed where individual photo diodes of the respective unit cells separated by an element isolating layer are physically integrated into a single large scale pixel formed widely on a semiconductor substrate so as to hold the pixels in common. A pixel separation pattern is additionally formed on a portion of the large scale photo diode formed so as to electrically separate them. An optimization of the light receiving area of the photo diode, a minimization of the intrusion area of an element isolating layer, and so on are achieved, so that the photo diode recovers an area occupied by an intrusion of the element isolating layer, thus maximizing the light receiving area in an optimal scale and easily preventing electrical impacts between the respective unit cells.

Claims (9)

1. An image sensor comprising:

a photo diode formed on an active region of a semiconductor substrate, wherein said photo diode consists of a plurality of pixels and is formed by integrating the pixels into one pixel without being separated by an element isolating layer;

a pixel separation pattern formed on said photo diode and selectively driven depending upon input voltage, thus defining said photo diode into unit pixels; and

transistors for individually resetting the respective unit pixels defined by said pixel separation pattern, and individually transferring electron-hole pair stored in said respective unit pixels.

2. The image sensor according to claim 1 , wherein said pixel separation pattern consists of a first pattern for vertically separating said photo diode and a second pattern for horizontally separating said photo diode.

3. The image sensor as claimed in claim 2 , wherein said first pattern and said second pattern are electrically connected with each other.

4. The image sensor according to claim 2 , wherein said first pattern and second pattern are electrically disconnected with each other.

5. The image sensor according to claim 2 , wherein said pixel separation pattern is composed of poly silicon material.

6. The image sensor according to claim 1 , wherein said input voltage applied to said pixel separation pattern has negative electric potential.

Assignments (6)
CHANGE OF NAME Recorded Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
MERGER AND CHANGE OF NAME Recorded Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
RE-RECORD TO REMOVE 10/476,499 PREVIOUSLY RECORDED ON REEL 017274 FRAME 0027. Recorded Aug 3, 2006
From: DONGBU ELECTRONICS CO. LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 018150/0415 →
CHANGE OF NAME Recorded Jul 13, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018099/0256 →
MERGER Recorded Nov 28, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017274/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2004
From: JANG, JAMES
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015534/0867 →