Semiconductor device with folded film substrate and display device using the same
View Patent ↗A semiconductor device to be mounted on an external electronic device includes a film substrate on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and a semiconductor chip mounted on the film substrate. In this semiconductor device, the film substrate is folded so that at least one edge of the film substrate is on a side opposite to a side on which the semiconductor chip is mounted, and portions of the wiring electrodes exposed from the covering member on a surface of the film substrate on which the semiconductor chip is mounted are to be connected to electrodes of an external electronic device.
1. A semiconductor device to be mounted on an external electronic device comprising:
a film substrate having a first surface on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and
a semiconductor chip mounted on the first surface of the film substrate,
wherein the film substrate is folded so that a second surface of the film substrate and portions of the wiring electrodes exposed from the covering member on the first surface face and are to be connected to electrodes of an external electronic device.
2. The semiconductor device according to claim 1 , wherein the semiconductor chip includes protruding electrodes and is connected to the wiring electrodes formed on the film substrate via the protruding electrodes.
3. The semiconductor device according to claim 1 , further comprising an electronic-component-mounting region on which an electronic component is mounted, the electronic component-mounting region being formed on the first surface,
wherein the film substrate is folded so that the electronic-component-mounting region faces the second surface.
4. The semiconductor device according to claim 3 , wherein the electronic component includes at least one of a resistor and a capacitor.
5. The semiconductor device according to claim 1 , wherein a recess or a through hole is formed on an inner peripheral surface of a bent portion of the folded film substrate.
6. The semiconductor device according to claim 1 , further comprising a heat dissipation member that is in intimate contact with the semiconductor chip,
wherein the heat dissipation member is provided on a side of the semiconductor chip opposite to a film substrate side of the semiconductor chip.
7. The semiconductor device according to claim 1 , further comprising a cooling device that is in intimate contact with the semiconductor chip,
wherein the cooling device is provided on a side of the semiconductor chip opposite to a film substrate side.
8. The semiconductor device according to claim 1 , wherein a heat insulating layer is formed in a space defined by the inner surface of the folded film substrate.
9. The semiconductor device according to claim 1 , wherein a cooling device is formed in a space defined by the inner surface of the folded film substrate.
10. The semiconductor device according to claim 1 , wherein regions excluding bent portions located on both ends of the film substrate face each other.
11. A display device comprising:
a display substrate;
a transparent substrate provided on a surface of the display substrate;
transparent electrodes formed on the surface of the display substrate, the transparent electrodes being formed on a portion without the transparent substrate on the surface of the display substrate; and
a semiconductor device connected to the transparent electrodes, the semiconductor device comprising:
a film substrate having a first surface on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and
a semiconductor chip mounted on the first surface of the film substrate,
the film substrate is folded so that a second surface of the film substrate that is on a side opposite to the first surface is an inner surface of the folded film substrate and portions of the wiring electrodes exposed from the covering member on the first surface are connected to the transparent electrodes.
12. The display device according to claim 11 , wherein, in a state where the semiconductor device is connected to the transparent electrodes, a mounting height of the semiconductor device as measured from the surface of the display substrate is smaller than a thickness of the transparent substrate.
13. The display device according to claim 11 , wherein, in a state where the semiconductor device is connected to the transparent electrodes, an orthogonal projection of the semiconductor device projected on the surface of the display substrate is in a portion without the transparent substrate on the surface of the display substrate and is accommodated within the display substrate.
14. The display device according to claim 11 , wherein a plurality of the semiconductor devices are provided adjacent to each other, and connection between each two adjacent semiconductor devices is achieved via a connecting wire formed on the display substrate.
15. The display device according to claim 14 , wherein each of the semiconductor devices includes a through wire for transmitting power common to all the semiconductor devices or signals, the through wire being provided in a space between the semiconductor chip and the film substrate in each of the semiconductor devices,
wherein the power common to all the semiconductor devices or the signals transmitted via the through wire are transmitted sequentially to the semiconductor chips of the semiconductor devices adjacent to each other via the connecting wires.
16. The display device according to claim 15 , wherein the through wire is formed on the film substrate of each of the semiconductor devices.
17. The display device according to claim 15 , wherein the through wire is formed on the semiconductor chip of each of the semiconductor devices.