Electrolytic processing apparatus and substrate processing method
The present invention provides an electrolytic processing apparatus which is capable of increasing an in-plane uniformity of a film thickness of a plated film by making more uniform an electric field distribution over an entire surface to be processed of a substrate even if the substrate has a large area, and controlling more uniformly a speed, over the entire surface to be processed of the substrate. The electrolytic processing apparatus of this invention includes: a substrate holder for holding a substrate, a first electrode for being brought into contact with the substrate to supply current to a surface, to be processed, of the substrate; a second electrode disposed substantially parallel to the surface, to be processed, of the substrate in a position facing the surface, to be processed, of the substrate held by the substrate holder; a high resistance structure disposed between the substrate held by the substrate holder and the second electrode; an electrolytic solution introducing portion for introducing an electrolytic solution into a region across which the substrate held by the substrate holder and the high resistance structure face each other, from laterally of the high resistance structure; and a power source for applying a voltage between the first electrode and the second electrode.
1. An electrolytic processing apparatus comprising:
a substrate holder for holding a substrate such that a surface, to be processed, of the substrate faces upwardly;
a first electrode for being brought into contact with the substrate so as to supply current to the surface of the substrate;
a second electrode disposed above said substrate holder such that when the substrate is held by said substrate holder said second electrode is substantially parallel to the surface of the substrate;
a resistance structure between said substrate holder and said second electrode such that when the substrate is held by said substrate holder said resistance structure is between the substrate and said second electrode;
an electrolytic solution introducing portion for introducing an electrolytic solution, from laterally of said resistance structure, into a region across which the substrate and said resistance structure face each other when the substrate is held by said substrate holder, so as to allow the electrolytic solution to flow along the surface of the substrate;
a power source for applying a voltage between said first electrode and said second electrode; and
another electrolytic solution introducing portion for introducing the electrolytic solution, from laterally of said resistance structure, into the region across which the substrate and said resistance structure face each other when the substrate is held by said substrate holder,
wherein said electrolytic solution introducing portion and said another electrolytic solution introducing portion are in positions facing one another other across the substrate when held by said substrate holder, and
wherein said resistance structure is a high resistance structure by virtue of being constituted to have lower electric conductivity than that of the electrolytic solution by causing the electrolytic solution to enter into said resistance structure.
2. An electrolytic processing apparatus comprising:
a substrate holder for holding a substrate such that a surface, to be processed, of the substrate faces upwardly;
a first electrode for being brought into contact with the substrate so as to supply current to the surface of the substrate;
a second electrode disposed above said substrate holder such that when the substrate is held by said substrate holder said second electrode is substantially parallel to the surface of the substrate;
a resistance structure between said substrate holder and said second electrode such that when the substrate is held by said substrate holder said resistance structure is between the substrate and said second electrode;
an electrolytic solution introducing portion for introducing an electrolytic solution, from laterally of said resistance structure, into a region across which the substrate and said resistance structure face each other when the substrate is held by said substrate holder, so as to allow the electrolytic solution to flow along the surface of the substrate;
a power source for applying a voltage between said first electrode and said second electrode;
another electrolytic solution introducing portion for introducing the electrolytic solution, from laterally of said resistance structure, into the region across which the substrate and said resistance structure face each other when the substrate is held by said substrate holder;
a first liquid delivery pump, connected to said electrolytic solution introducing portion, for delivering the electrolytic solution from said electrolytic solution introducing portion at spaced time intervals; and
a second liquid delivery pump, connected to said another electrolytic solution introducing portion, for delivering the electrolytic solution from said another electrolytic solution introducing portion at spaced time intervals,
wherein said resistance structure is a high resistance structure by virtue of being constituted to have lower electric conductivity than that of the electrolytic solution by causing the electrolytic solution to enter into said resistance structure.