Airdome enclosure for components
View Patent ↗A component having an airdome enclosure that protects the component from its external environment. An airdome enclosure according to the present techniques avoids the high costs of employing special materials and/or specialized process steps in the manufacture of a component. An electronic component according to the present techniques includes a set of substructures formed on a substrate and an airdome enclosure over the substructures that protects the substructures and that hinders the formation of parasitic capacitances among the substructures.
1. A method for forming a component, comprising:
forming a set of substructures for the component;
forming an airdome structure that encloses the substructures and that provides a set of air spaces for providing isolation among the substructures wherein forming an airdome structure includes forming an overcoat for the airdome structure by filling the air spaces with a gas while depositing the overcoat.
2. The method of claim 1 , wherein forming an airdome structure includes forming the air spaces in the airdome structure.
3. The method of claim 2 , wherein forming the air spaces includes:
depositing a layer of dielectric material;
forming a top substructure onto the layer of dielectric material;
forming a set of gaps in the top substructure;
removing the layer of dielectric material underneath the top substructure.
4. The method of claim 3 , wherein forming an overcoat includes depositing the overcoat on the top substructure such that the overcoat seals the gaps and encloses the air spaces.
5. The method of claim 4 , wherein depositing the overcoat includes depositing a dielectric material.
6. The method of claim 4 , wherein depositing the overcoat includes depositing a plastic material.
7. The method of claim 4 , wherein depositing the overcoat includes depositing an organic material.
8. The method of claim 4 , wherein forming a top substructure includes shaping the top substructure to impede the overcoat from entering the air spaces.
9. The method of claim 8 , wherein shaping the top substructure includes shaping the layer of dielectric material.
10. A method for forming a component, comprising:
forming a set of substructures for the component;
forming an airdome structure that encloses the substructures and that provides a set of air spaces for providing isolation among the substructures wherein forming an airdome structure includes forming a set of valleys in the airdome structure and depositing an overcoat on the airdome structure such that the valleys impede the overcoat from entering the air spaces.
11. The method of claim 10 , wherein forming an airdome structure comprises:
depositing a layer of dielectric material;
forming a top substructure onto the layer of dielectric material;
forming a set of gaps in the top substructure;
removing the layer of dielectric material underneath the top substructure.
12. The method of claim 11 , wherein forming a set of valleys in the airdome structure includes forming a set of V-shaped valleys in the top substructure.
13. The method of claim 12 , wherein forming a set of V-shaped valleys in the top substructure includes shaping the layer of dielectric material.
14. The method of claim 11 , wherein depositing an overcoat on the airdome structure includes depositing the overcoat on the top substructure such that the overcoat seals the gaps and encloses the air spaces.
15. The method of claim 11 , wherein forming a set of gaps includes forming the gaps in response to a viscosity of the overcoat.
16. The method of claim 11 , wherein forming a set of gaps includes selecting a shape of the gaps to prevent the overcoat from filling the air spaces.
17. The method of claim 10 , wherein depositing an overcoat includes depositing a dielectric material.
18. The method of claim 10 , wherein depositing an overcoat includes depositing a plastic material.
19. The method of claim 10 , wherein depositing an overcoat includes depositing an organic material.