IP Library Granted Patent US 7,323,363
Granted Patent B1
US 7,323,363 · App. 10/770,192 · Granted Jan 29, 2008

Contact load profile modification for a compression socketed CPU

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,323,363
App. No.
10/770,192
Granted
Jan 29, 2008
Kind
B1
Abstract

A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.

Claims (20)

1. A method for creating load uniformity comprising:

determining a first load distribution within a stack;

obtaining a pressure imprint of the first load distribution;

analyzing the pressure imprint of the first load distribution to obtain a configuration of the shim;

designing a shim based on the first load distribution using the configuration of the shim; and

placing the shim in the stack, in between a printed circuit board and an insulator, to create a second load distribution, wherein the second load distribution improves load balance,

wherein the first and second load distributions represent a distribution across a plurality of contacts of the load imparted on the stack from a device that places pressure on the stack.

2. The method of claim 1 , wherein analyzing the integrated circuit housing the profile comprises using the profile as input into at least one selected from the group consisting of an analytical model and an empirical model.

3. The method of claim 2 , wherein the configuration profile comprises at least one parameter having an effect on load distribution of a contact.

4. The method of claim 2 , wherein the configuration profile is stored in a data repository.

5. The method of claim 1 , further comprising:

placing a pressure film between a ceramic land grid array package and the contact; and

applying pressure to the contact.

6. The method of claim 1 , further comprising:

viewing the pressure imprint.

7. The method of claim 1 , wherein analyzing the pressure imprint comprises:

digitizing the pressure imprint to produce a digitized image;

analyzing the digitized image to produce a graphic illustration of load distribution using a color intensity scheme;

analyzing the graphic illustration of load distribution to determine a region of low load; and

defining the configuration of the shim using the region of low load.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037302/0899 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2004
From: KEARNS, DONALD A.; ZACHARISEN, GEORGE C.; MCELFRESH, DAVID K.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 014954/0226 →