IP Library Granted Patent US 6,903,600
Granted Patent B2
US 6,903,600 · App. 10/772,312 · Granted Jun 7, 2005

Capacitor charge sharing charge pump

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Quick Facts
Patent No.
US 6,903,600
App. No.
10/772,312
Granted
Jun 7, 2005
Kind
B2
Abstract

A multiphase charge pump including first and second phase charge pump circuits. Each of the first and second phase charge pump circuits includes a bootstrap capacitor. The bootstrap capacitors are switchingly connected by an equalization circuit that periodically transfers charge from a discharging capacitor to a charging capacitor, thereby reducing the charge that must be externally supplied to charge the charging capacitor.

Claims (80)

1. A charge pump circuit comprising:

four circuits, each of said circuits including:

a primary phase circuit;

a respective ancillary phase circuit, said respective ancillary phase circuit serving to control a transistor of said primary phase circuit; and

a plurality of charge transfer circuits for transferring charge among said four circuits;

wherein said four primary phase circuits are operated out of phase with one another.

2. The charge pump circuit of claim 1 , wherein said respective ancillary phase circuits each operate out of phase with one another.

3. A charge pump, comprising:

a plurality of single phase charge pump circuits, each comprising a bootstrap capacitor;

a plurality of ancillary charge pump circuits, each respectively associated with one of said plurality of single phase charge pump circuits, and each comprising an ancillary capacitor coupled to the bootstrap capacitor of the associated single phase charge pump circuit; and

a plurality of charge transfer circuits for transferring charge between said plurality of single phase charge pump circuits.

4. The charge pump of claim 3 , wherein at least two of said plurality of single phase charge pump circuits are operated in offset phase from another.

5. The charge pump of claim 3 , wherein at least two of said plurality of ancillary charge pump circuits are operated in offset phase from another.

6. The charge pump of claim 3 , wherein said plurality of single phase charge pump circuits comprises four single phase charge pump circuits each operated at an offset phase with respect to the others of said plurality of four single phase charge pump circuits.

7. The charge pump of claim 5 , wherein said plurality of single phase charge pump circuits comprises:

a first single phase charge pump circuit operating at an initial phase;

a second single phase charge pump circuit operating at a phase angle of 90° relative to said initial phase;

a third single phase charge pump circuit operating at a phase angle of 180° relative to said initial phase; and

a fourth single phase charge pump circuit operating at a phase angle of 270° relative to said initial phase.

8. An integrated circuit, comprising:

a semiconductor substrate;

a charge pump, disposed on said substrate, said charge pump comprising:

a plurality of single phase charge pump circuits, each comprising a bootstrap capacitor and a single phase charge pump output;

a plurality of ancillary charge pump circuits, each respectively associated with one of said plurality of single phase charge pump circuits, and each comprising an ancillary capacitor coupled to the bootstrap capacitor of the associated single phase charge pump circuit;

a plurality of charge transfer circuits for transferring charge among said plurality of single phase charge pump circuits; and

a charge pump output, coupled to each of said single phase charge pump outputs; and

a first circuit, disposed on said substrate, and coupled to said charge pump output.

9. The integrated circuit of claim 8 , wherein at least two of said plurality of single phase charge pump circuits are operated in offset phase from another.

10. The integrated circuit of claim 8 , wherein at least two of said plurality of ancillary charge pump circuits are operated in offset phase from another.

11. The integrated circuit of claim 8 , wherein said plurality of single phase charge pump circuits comprises four single phase charge pump circuits each operated at an offset phase with respect to the others of said plurality of four single phase charge pump circuits.

12. The integrated circuit of claim 11 , wherein said four single phase charge pump circuits comprise:

a first one of said four single phase charge pump circuits operating at an initial phase;

a second one of said four single phase charge pump circuits operating at a phase angle of 90° relative to said initial phase;

a third one of said four single phase charge pump circuits operating at a phase angle of 180° relative to said initial phase; and

a fourth one of said four single phase charge pump circuits operating at a phase angle of 270° relative to said initial phase.

13. A memory device, comprising:

a semiconductor substrate;

a charge pump, disposed on said substrate, said charge pump comprising:

a plurality of single phase charge pump circuits, each comprising a bootstrap capacitor and a single phase charge pump output;

a plurality of ancillary charge pump circuits, each respectively associated with one of said plurality of single phase charge pump circuits, and each comprising an ancillary capacitor coupled to the bootstrap capacitor of the associated single phase charge pump circuit;

a plurality of charge transfer circuits for transferring charge between said plurality of single phase charge pump circuits; and

a charge pump output, coupled to each of said single phase charge pump outputs; and

a memory circuit, disposed on said substrate, and coupled to said charge pump output.

14. The memory device of claim 13 , wherein at least two of said plurality of single phase charge pump circuits are operated in offset phase from another.

15. The memory device of claim 13 , wherein at least two of said plurality of ancillary charge pump circuits are operated in offset phase from one another.

16. The memory device of claim 13 , wherein said plurality of single phase charge pump circuits comprises four single phase charge pump circuits each operated at an offset phase with respect the others of said plurality of four single phase charge pump circuits circuits.

17. The memory device of claim 16 , wherein said four single phase charge pump circuits comprise:

a first single phase charge pump circuit operating at an initial phase;

a second single phase charge pump circuit operating at a phase angle of 90° relative to said initial phase;

a third single phase charge pump circuit operating at a phase angle of 180° relative to said initial phase; and

a fourth single phase charge pump circuit operating at a phase angle of 270° relative to said initial phase.

18. An integrated circuit comprising:

charge pump circuit including,

a first charge pump phase circuit including a first bootstrap capacitor containing stored energy;

a second charge pump phase circuit including a second bootstrap capacitor; and

a circuits including a flip-flop, for transferring energy from said first bootstrap capacitor to said second bootstrap capacitor to enable said second bootstrap capacitor to utilize energy previously stored in said first bootstrap capacitor to elevate a potential on said second bootstrap capacitor, said transferring occurring in response to a control signal generated by toggling said flip-flop.

19. A memory device comprising:

a memory circuit;

a charge pump circuit, coupled to said memory circuit, said charge pump circuit including:

four circuits, each of said circuits including:

a primary phase circuit;

a respective ancillary phase circuit, said respective ancillary phase circuit serving to control a transistor of said primary phase circuit; and

a plurality of charge transfer circuits for transferring charge among said four circuits;

wherein said four primary phase circuits are operated out of phase with one another.

20. The memory device according to claim 19 , wherein said respective ancillary phase circuits each operate out of phase with one another.

21. A memory device comprising:

a memory circuit; and

a multi-phase charge pump circuit, coupled to said memory circuit, said multi-phase charge pump circuit comprising:

a plurality of single phase charge pump circuits, including at least:

a first single phase charge pump circuit operating at an initial phase angle;

a second single phase charge pump circuit operating at a phase angle 90 degrees offset from said initial phase angle;

a third single phase charge pump circuit operating at a phase angle 180 degrees offset from said initial phase angle; and

a fourth single phase charge pump circuit operating at a phase angle 270 degrees offset from said initial phase angle; and

a charge transfer circuit, adapted to transfer charge between at least two of said single phase charge pump circuits.

22. A memory device comprising:

a memory circuit; and

a charge pump circuit, coupled to said memory circuit, said charge pump circuit comprising:

a first charge pump phase circuit including a first bootstrap capacitor containing stored energy;

a second charge pump phase circuit including a second bootstrap capacitor; and

a circuit, including a flip-flop, for transferring energy from said first bootstrap capacitor to said second bootstrap capacitor to enable said second bootstrap capacitor to utilize energy previously stored in said first bootstrap capacitor to elevate a potential on said second bootstrap capacitor, said transferring occurring in response to a control signal generated by toggling said flip-flop.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →