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App. No. 10/776,477 · Confirmation No. 4062

Method for applying downward force on wafer during CMP

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2008-04-10 ABN Abandonment 2 View
2007-11-16 CTAV Advisory Action (PTOL-303) 2 View
2007-10-26 A.NE Response After Final Action 1 View
2007-10-26 CLM Claims 5 View
2007-10-26 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2007-10-26 WFEE Fee Worksheet (SB06) 1 View
2007-08-22 CTFR Final Rejection 6 View
2007-08-22 1449 List of References cited by applicant and considered by examiner 1 View
2007-08-22 892 List of references cited by examiner 1 View
2007-08-22 FWCLM Index of Claims 1 View
2007-08-22 BIB Bibliographic Data Sheet 1 View
2007-04-27 A... Amendment/Request for Reconsideration-After Non-Final Rejection 2 View
2007-04-27 CLM Claims 5 View
2007-04-27 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2007-04-27 WFEE Fee Worksheet (SB06) 1 View
2007-01-17 CTNF Non-Final Rejection 5 View
2007-01-17 892 List of references cited by examiner 1 View
2007-01-17 FWCLM Index of Claims 1 View
2007-01-17 SRFW Search information including classification, databases and other search related notes 1 View
2007-01-17 BIB Bibliographic Data Sheet 1 View
2004-02-10 TRNA Transmittal of New Application 2 View
2004-02-10 SPEC Specification 18 View
2004-02-10 CLM Claims 5 View
2004-02-10 ABST Abstract 1 View
2004-02-10 DRW Drawings-only black and white line drawings 5 View
2004-02-10 OATH Oath or Declaration filed 3 View
2004-02-10 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2004-02-10 WFEE Fee Worksheet (SB06) 1 View
2004-02-10 WFEE Fee Worksheet (SB06) 1 View
2004-02-10 136A Authorization for Extension of Time all replies 2 View
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Quick Facts
App. No.
10/776,477
Filed
2004-02-10
Pub. No.
US20040161939A1
Art Unit
3723