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App. No. 10/033,671 · Confirmation No. 7920

METHOD AND APPARATUS FOR APPLYING DOWNWARD FORCE ON WAFER DURING CMP

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2004-02-17 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-02-17 LET. Miscellaneous Incoming Letter 1 View
2004-02-17 DRW Drawings-only black and white line drawings 6 View
2003-11-28 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2001-12-27 TRNA Transmittal of New Application 3 View
2001-12-27 SPEC Specification 17 View
2001-12-27 CLM Claims 4 View
2001-12-27 ABST Abstract 1 View
2001-12-27 DRW Drawings-only black and white line drawings 7 View
2001-12-27 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
10/033,671
Filed
2001-12-27
Granted
2004-03-30
Pub. No.
US20030139115A1
Art Unit
3723
PTA
-45 days