Patent Assignment
Reel/Frame 020951/0935
Assignment of Assignor's Interest
Recorded: 2008-05-18
Received: 2008-05-18
Pages: 44
Assignor
LAM RESEARCH CORPORATION
Executed: 2008-01-08
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CA, 95054-3299, UNITED STATES
Covered Properties
(97)
Method and System for Chemical Mechanical Polishing Pad Cleaning
Application:
11/256,293 →
Method and Apparatus for Minimizing Agglomerate Particle Size in a Polishing Fluid
Application:
10/991,669 →
System and Method for in Situ Characterization and Maintenance of Polishing Pad Smoothness in Chemical Mechanical Polishing
Application:
10/955,044 →
Methods of and Apparatus for Controlling Polishing Surface Characteristics for Chemical Mechanical Polishing
Application:
10/952,608 →
Semiconductor Wafer Material Removal Apparatus and Method for Operating the Same
Application:
10/948,510 →
Apparatus and Method for Distributing a Polishing Fluid
Application:
10/892,428 →
Method of and Platen for Controlling Removal Rate Characteristics in Chemical Mechanical Planarization
Application:
10/816,431 →
Compliant Wafer Chuck
Application:
10/816,418 →
Multiple-Conditioning Member Device for Chemical Mechanical Planarization Conditioning
Application:
10/816,444 →
Polishing Pad Conditioning System
Application:
10/813,294 →
Polishing Pad Conditioning and Polishing Liquid Dispersal System
Application:
10/812,824 →
Relative Lateral Motion in Linear Cmp
Application:
10/813,754 →
Method and Apparatus of Arrayed, Clustered or Coupled Eddy Current Sensor Configuration for Measuring Conductive Film Properties
Application:
10/749,531 →
Chemical Mechanical Planarization (Cmp) System and Method for Preparing a Wafer in a Cleaning Module
Application:
10/743,963 →
Chemical Mechanical Planarization System with Replaceable Pad Assembly
Application:
10/744,280 →
Linear Chemical Mechanical Planarization (Cmp) System and Method for Planarizing a Wafer in a Single Cmp Module
Application:
10/743,923 →
System and Method of Broad Band Optical End Point Detection for Film Change Indication
Application:
10/721,136 →
System, Method and Apparatus for Applying Liquid to a Cmp Polishing Pad
Application:
10/676,388 →
Apparatus and Associated Method for Conditioning in Chemical Mechanical Planarization
Application:
10/674,941 →
Method and Apparatus of a Variable Height and Controlled Fluid Flow Platen in a Chemical Mechanical Polishing System
Application:
10/674,319 →
Assembly and Method for Generating a Hydrodynamic Air Bearing
Application:
10/641,914 →
Methods for Monitoring and Controlling Chemical Mechanical Planarization
Application:
10/611,143 →
Neural Network Control of Chemical Mechanical Planarization
Application:
10/609,357 →
Platen with Diaphragm and Method for Optimizing Wafer Polishing
Application:
10/607,613 →
Method and Apparatus for Real Time Metal Film Thickness Measurement
Application:
10/463,525 →
Pad Conditioner Control Using Feedback from a Measured Polishing Pad Roughness Level
Application:
10/465,731 →
Apparatus and Method for Providing a Signal Port in a Polishing Pad for Optical Endpoint Detection
Application:
10/460,502 →
Electrochemical Assisted Cmp
Application:
10/345,775 →
Chemical Mechanical Planarization (Cmp) Apparatus
Application:
10/345,694 →
Molded End Point Detection Window for Chemical Mechanical Planarization
Application:
10/330,519 →
Method and Apparatus for Metrological Process Control Implementing Complimentary Sensors
Application:
10/328,884 →
Method and Apparatus for an Air Bearing Platen Witth Raised Topography
Application:
10/327,565 →
System for Wafer Carrier in-Process Clean and Rinse
Application:
10/319,758 →
Methods and Systems for Controlling Belt Surface Temperature and Slurry Temperature in Linear Chemical Mechanical Planarization
Application:
10/261,568 →
System and Method for Metal Residue Detection and Mapping Within a Multi-Step Sequence
Application:
10/251,033 →
Afferent-Based Polishing Media for Chemical Mechanical Planarization
Application:
10/206,749 →
Interlocking Chemical Mechanical Polishing System
Application:
10/202,053 →
300MM Platen and Belt Configuration
Application:
10/186,930 →
Partial-Membrane Carrier Head
Application:
10/186,888 →
Method and Apparatus of Arrayed Sensors for Metrological Control
Application:
10/186,932 →
Profiled Retaining Ring for Chemical Mechanical Planarization
Application:
10/186,944 →
Fluid Venting Platen for Optimizing Wafer Polishing
Application:
10/186,909 →
Integration of Sensor Based Metrology into Semiconductor Processing Tools
Application:
10/186,472 →
Method for Reducing or Eliminating De-Lamination of Semiconductor Wafer Film Layers During a Chemical Mechanical Planarization Process
Application:
10/186,912 →
Carrier Head Having Location Optimized Vacuum Holes
Application:
10/187,228 →
Belt Wiper for a Chemical Mechanical Planarization System
Application:
10/184,163 →
Method for Making Reinforced Belt Pad for Linear Chemical Mechanical Planarization
Application:
10/184,152 →
Byproduct Control in Linear Chemical Mechanical Planarization System
Application:
10/132,096 →
Liquid Dispense Manifold for Chemical-Mechanical Polisher
Application:
10/112,421 →
Fluid Conserving Platen for Optimizing Edge Polishing
Application:
10/112,424 →
Gimballed Conditioning Apparatus
Application:
10/112,399 →
Method and Apparatus for Heating Polishing Pad
Application:
10/112,628 →
System and Method of Broad Band Optical End Point Detection for Film Change Indication
Application:
10/112,425 →
Chemical Mechanical Planarization (Cmp) System and Method for Determining an Endpoint in a Cmp Operation
Application:
10/109,902 →
System and Method for Spindle Drive Downforce Calibration
Application:
10/113,755 →
Method and Apparatus for Conditioning Fixed-Abrasive Polishing Pads
Application:
10/100,740 →
Reinforced Chemical Mechanical Planarization Belt
Application:
10/097,337 →
Apparatus and Method for Qualifying a Chemical Mechanical Planarization Process
Application:
10/078,941 →
Methods and Apparatus for Conditioning and Temperature Control of a Processing Surface
Application:
10/041,027 →
Grooved Rollers for a Linear Chemical Mechanical Planarization System
Application:
10/040,501 →
Method and Apparatus for Applying Downward Force on Wafer During Cmp
Application:
10/033,671 →
Active Gimbal Ring with Internal Gel and Methods for Making Same
Application:
10/033,479 →
Cmp Belt Stretch Compensation Apparatus and Methods for Using the Same
Application:
10/033,501 →
Apparatus and Methods for Controlling Wafer Temperature in Chemical Mechanical Polishing
Application:
10/033,455 →
Integrated Planarization and Clean Wafer Processing System
Application:
10/033,615 →
Chemical Mechanical Polishing Apparatus and Methods with Porous Vacuum Chuck and Perforated Carrier Film
Application:
10/029,515 →
Method and Apparatus for Reducing Compressed Dry Air Usage During Chemical Mechanical Planarization
Application:
10/029,742 →
Porous Material Air Bearing Platen for Chemical Mechanical Planarization
Application:
10/029,457 →
Apparatus for Edge Polishing Uniformity Control
Application:
10/029,958 →
Air Platen for Leading Edge and Trailing Edge Control
Application:
10/037,452 →
Apparatus for Removal/Remaining Thickness Profile Manipulation
Application:
10/027,947 →
Method and Apparatus for Chemical Mechanical Planarization
Application:
10/029,192 →
Apparatus and Method for Providing a Signal Port in a Polishing Pad for Optical Endpoint Detection
Application:
10/016,883 →
Low Friction Gimbaled Substrate Holder for Cmp Apparatus
Application:
10/013,429 →
System for in-Situ Monitoring of Removal Rate/Thickness of Top Layer During Planarization
Application:
10/002,575 →
Method and Apparatus for Controlling Cmp Pad Surface Finish
Application:
10/039,749 →
Polishing Head Assembly in an Apparatus for Chemical Mechancial Planarization
Application:
09/999,066 →
In-Situ Detection of Thin-Metal Interface Using High Resolution Spectral Analysis of Optical Interference
Application:
09/976,579 →
In-Situ Detection of Thin-Metal Interface Using Optical Interference via a Dynamically Updated Reference
Application:
09/976,442 →
Platen Assembly Having a Topographically Altered Platen Surface
Application:
09/925,254 →
Apparatus and Method for Conditioning Polishing Pad in a Chemical Mechanical Planarization Process
Application:
09/876,451 →
Projected Gimbal Point Drive
Application:
09/877,459 →
Spherical Cap-Shaped Polishing Head in a Chemical Mechanical Polishing Apparatus for Semiconductor Wafers
Application:
09/843,323 →
Method for Optimizing the Planarizing Length of a Polishing Pad
Application:
09/825,643 →
Apparatus for Accurate Endpoint Detection in Supported Polishing Pads
Application:
09/823,685 →
Apparatus for Controlling Leading Edge and Trailing Edge Polishing
Application:
09/823,722 →
Active Retaining Ring Support
Application:
09/823,800 →
Adjustable Force Applying Air Platen and Spindle System, and Methods for Using the Same
Application:
09/823,593 →
Polishing Pad Ironing System and Method for Implementing the Same
Application:
09/823,788 →
Method and Apparatus for End Point Triggering with Integrated Steering
Application:
09/823,198 →
Apparatus and Methods for Aligning a Surface of an Active Retainer Ring with a Wafer Surface for Chemical Mechanical Polishing
Application:
09/823,169 →
Apparatus and Methods with Resolution Enhancement Feature for Improving Accuracy of Conversion of Required Chemical Mechanical Polishing Pressure to Force to Be Applied by Polishing Head to Wafer
Application:
09/823,151 →
In-Situ Detection of Thin-Metal Interface Using Optical Interference
Application:
09/812,535 →
Method and Apparatus for Conditioning a Polishing Pad with Sonic Energy
Application:
09/796,955 →
Chemical Mechanical Planarization Belt Assembly and Method of Assembly
Application:
09/757,452 →
System and Method for Polishing and Planarizing Semiconductor Wafers Using Reduced Surface Area Polishing Pads and Variable Partial Pad-Wafer Overlapping Techniques
Application:
09/754,480 →
Method and Apparatus for Conditioning a Polishing Pad with Sonic Energy
Application:
09/754,702 →