IP Library › Granted Patent US 6,736,720
Granted Patent Utility
US 6,736,720 · Confirmation No. 8360

APPARATUS AND METHODS FOR CONTROLLING WAFER TEMPERATURE IN CHEMICAL MECHANICAL POLISHING

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 Code Description Pages PDF
2003-11-28 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-11-28 A.NA Amendment after Notice of Allowance (Rule 312) 1 View
2003-11-28 CLM Claims 8 View
2003-11-28 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2003-09-12 A.NA Amendment after Notice of Allowance (Rule 312) 1 View
2003-09-12 CLM Claims 8 View
2003-09-12 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2003-09-12 LET. Miscellaneous Incoming Letter 1 View
2002-04-24 TRNA Transmittal of New Application 4 View
2002-04-24 DRW Drawings-only black and white line drawings 9 View
2002-04-24 OATH Oath or Declaration filed 2 View
2001-12-26 TRNA Transmittal of New Application 3 View
2001-12-26 SPEC Specification 33 View
2001-12-26 CLM Claims 11 View
2001-12-26 ABST Abstract 1 View
2001-12-26 DRW Drawings-only black and white line drawings 11 View
2001-12-26 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,736,720
App. No.
10/033,455
Filed
2001-12-26
Granted
2004-05-18
Pub. No.
US20030119429A1
Art Unit
3723
PTA
-210 days