Multiple-conditioning member device for chemical mechanical planarization conditioning
View Patent ↗A multiple-conditioning member device for chemical mechanical planarization conditioning is described. The multiple conditioning members may be used in a chemical mechanical planarization apparatus which further includes a movably mounted polishing member, a wafer holder, and a slurry dispenser. The multiple conditioning members may be independently movable with respect to one another and configured to contact the polishing member. Specifically, a conditioning member may be independently movable with respect to another conditioning member based on x-axis control, y-axis control, z-axis control, alignment, speed of rotation, direction of rotation, amount of pressure of conditioning member on polishing member.
1. A CMP system comprising:
a movably mounted polishing member;
a wafer holder for holding a wafer relative to the polishing member;
a slurry dispenser for dispensing slurry onto the polishing member; and
a conditioner having an arm, with at least two conditioning members being operably connected to the arm, the conditioning members being independently alignable along an axis substantially perpendicular to a surface of the conditioning member with respect to one another and configured to contact the polishing member.
2. The CMP system of claim 1 , wherein the polishing member comprises a polishing belt and wherein the polishing member is linearly movable.
3. The CMP system of claim 1 , wherein the polishing member comprises a rotary polisher.
4. The CMP system of claim 1 , wherein each conditioning member comprises a conditioning disc which contacts the polishing member; and
wherein the conditioning discs are gimbaled independent of one another.
5. The CMP system of claim 4 , wherein the conditioning members comprise a main body with a contact surface, the contact surface being pre-shaped based on expected deformation of at least a portion of the polishing member during operation of the CMP apparatus.
6. The CMP system of claim 1 , wherein the conditioning members are independently adjustable along a z-axis.
7. The CMP system of claim 1 , wherein the conditioning members are independently adjustable based on amounts of pressure of the conditioning members on polishing member.
8. The CMP system of claim 7 , wherein each conditioning member has associated with it a pressure sensor; and
wherein the conditioning members are independently movable based on data from the pressure sensors.
9. The CMP system of claim 1 , wherein the conditioner further comprises a second arm with at least one conditioning member.
10. The CMP system of claim 1 , wherein the conditioning members rotate at different speeds.
11. The CMP system of claim 1 , wherein the conditioning members rotate at a same speed.
12. The CMP system of claim 1 , wherein the conditioning members rotate in different directions.
13. The CMP system of claim 1 , wherein the conditioning members rotate in a same direction.
14. The CMP system of claim 1 , wherein each conditioning member comprises a conditioning disc.
15. The CMP system of claim 1 , wherein the conditioning members are configured to concurrently contact the polishing element.
16. The CMP system of claim 1 , wherein pressure applied by each of the conditioning members on the polishing member is substantially uniform.
17. The CMP system of claim 1 , wherein the conditioner consists of a single arm with the conditioning members operably connected to the single arm.