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App. No. 09/823,151 · Confirmation No. 8663

APPARATUS AND METHODS WITH RESOLUTION ENHANCEMENT FEATURE FOR IMPROVING ACCURACY OF CONVERSION OF REQUIRED CHEMICAL MECHANICAL POLISHING PRESSURE TO FORCE TO BE APPLIED BY POLISHING HEAD TO WAFER

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2004-03-01 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-03-01 LET. Miscellaneous Incoming Letter 1 View
2004-03-01 DRW Drawings-only black and white line drawings 16 View
2001-03-29 TRNA Transmittal of New Application 3 View
2001-03-29 SPEC Specification 41 View
2001-03-29 CLM Claims 19 View
2001-03-29 ABST Abstract 1 View
2001-03-29 DRW Drawings-only black and white line drawings 16 View
2001-03-29 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
09/823,151
Filed
2001-03-29
Granted
2004-04-20
Pub. No.
US20020192965A1
Art Unit
2125
PTA
-73 days