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App. No. 10/789,524 · Confirmation No. 9272

Apparatus with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2008-11-12 ABN Abandonment 2 View
2008-04-25 CTNF Non-Final Rejection 5 View
2008-04-25 SRFW Search information including classification, databases and other search related notes 1 View
2008-04-25 FWCLM Index of Claims 1 View
2008-04-25 1449 List of References cited by applicant and considered by examiner 3 View
2004-11-22 CFILE Request for Corrected Filing Receipt 3 View
2004-02-26 TRNA Transmittal of New Application 3 View
2004-02-26 SPEC Specification 41 View
2004-02-26 CLM Claims 7 View
2004-02-26 ABST Abstract 1 View
2004-02-26 DRW Drawings-only black and white line drawings 16 View
2004-02-26 OATH Oath or Declaration filed 2 View
2004-02-26 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2004-02-26 WFEE Fee Worksheet (SB06) 1 View
2004-02-26 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/789,524
Filed
2004-02-26
Pub. No.
US20040177297A1
Art Unit
2121