Light emitting diode display device comprising a high temperature resistant overlay
View Patent ↗A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.
1. A light emitting diode display device, comprising:
a substrate comprising a first conductive portion and a second conductive portion;
a light emitting diode die coupled to said first conductive portion;
a wire bond coupled to said light emitting diode die and coupled to said second conductive portion;
a non-gaseous encapsulant coating said light emitting diode die and surrounding said wire bond and extending above said substrate such that said light emitting diode die and said wire bond are encapsulated between said substrate and said non-gaseous encapsulant coating:
an overlay bonded to said light emitting diode display device above said non-gaseous encapsulant coating, said overlay comprising an opaque area and a transparent area, said transparent area and said opaque area both being illuminated by said light emitting diode, while only light from said transparent region leaves said light emitting display device, said overlay having a glass transition temperature of at least 260 degrees Celsius;
wherein said non-gaseous encapsulant coating comprises a color tinting that filters the light passing through said tinting based on the wavelength of said light.
2. The light emitting diode display device as recited in claim 1 further comprising a housing comprising a cavity, said housing coupled to said substrate such that said encapsulant fills at least a portion of said cavity.
3. The light emitting diode display device as recited in claim 2 wherein said overlay is attached to a top surface of said housing.
4. The light emitting diode display device as recited in claim 1 wherein said overlay comprises glass.
5. The light emitting diode display device as recited in claim 1 wherein said overlay comprises a band pass filter.
6. The light emitting diode display device as recited in claim 1 wherein said substrate comprises at least one of a printed circuit board, a flexible circuit, a ceramic substrate, and a lead frame.
7. A method for generating a light emitting diode display device, said method comprising:
coupling a housing to a substrate, said housing comprising at least one cavity and said substrate comprising a first conductive portion and a second conductive portion;
coupling a light emitting diode die to said first conductive portion of said substrate;
coupling a wire bond to said light emitting diode die and said second conductive portion of said substrate;
filling at least a portion of said cavity with a non-gaseous encapsulant, such that said light emitting diode die and said wire bond are encased within said non-gaseous encapsulant or between said encapsulant and said substrate;
coupling an overlay to a top surface of said housing, said overlay comprising an opaque area and a transparent area, said transparent area and said opaque area both being illuminated by said light emitting diode, while only light from said transparent region leaves said light emitting display device, said overlay having a glass transition temperature of at least 260 degrees Celsius;
wherein said non-gaseous encapsulant comprises a color tinting that filters the light passing through said tinting based on the wavelength of said light.
8. The method as recited in claim 7 wherein said overlay comprises glass.
9. A multiple light emitting diode display device, comprising:
a substrate;
a housing coupled to said substrate, said housing comprising a plurality of cavities;
a plurality of light emitting diode digs coupled to said substrate wherein at least one light emitting diode die of said plurality of light emitting diode dies resides within at least one cavity of said plurality of cavities;
a non-gaseous encapsulant that together with said substrate surrounds said at least one of said light emitting diode dies within at least one of said cavities; and
an overlay above a top surface of said housing, said overlay comprising an opaque area and a transparent area, said transparent area and said opaque area both being illuminated by said light emitting diode, while only light from said transparent region leaves said light emitting display device, said overlay having a glass transition temperature of at least 260 degrees Celsius;
a layer of double-sided tape, said overlay being attached to said top surface by said layer of double-sided tape.
10. The multiple light emitting diode display device as recited in claim 9 wherein said overlay comprises glass.
11. The multiple light emitting diode display device as recited in claim 9 wherein said non-gaseous encapsulant comprises at least one of epoxy or silicone.
12. The multiple light emitting diode display device as recited in claim 9 wherein said non-gaseous encapsulant comprises a color tinting that filters the light passing through said tinting based on the wavelength of said light.
13. The multiple light emitting diode display device as recited in claim 9 wherein said housing comprises seven cavities arranged to provide a seven segment digital readout.