Method and apparatus for simultaneous inspection and cleaning of a stencil

1. An apparatus for performing operations on a surface of an electronic substrate, the apparatus comprising:

a frame;

a dispenser, coupled to the frame, to dispense a material onto the electronic substrate;

a stencil translatable on a first gantry system, the stencil having at least one aperture to receive the material as the material is dispensed on the electronic substrate by the dispenser;

a controller that controls dispensing of the material on the electronic substrate when the electronic substrate is in a print position;

a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system; and

an inspecting probe coupled to a second gantry system for inspecting a surface on the electronic substrate, the inspecting probe being movable to a position over the electronic substrate;

wherein the stencil translates over the wiper while the inspecting probe inspects the electronic substrate when the electronic substrate is in the print position.

2. The apparatus of claim 1 , wherein the stencil translates over the wiper substantially simultaneously with the inspecting of the electronic substrate.

3. The apparatus of claim 1 , wherein the wiper is positioned below the position of the stencil.

4. The apparatus of claim 1 , wherein the stencil translates from a first front position, to a second back position, and returns to the first front position upon removal of the material by the wiper.

5. The apparatus of claim 1 , wherein the stencil translates away from the electronic substrate by moving orthogonally to the position of the electronic substrate.

6. The apparatus of claim 1 , wherein the stencil translates in a first direction away from the electronic substrate and translates in a second direction toward the wiper.

7. A method for performing a printing operation on a surface of a substrate, the method comprising:

transporting the substrate into a print position for printing a material onto the substrate;

aligning the substrate and a stencil, the stencil having at least one aperture to receive the material as the material is deposited onto the substrate;

depositing the material through the stencil and onto the substrate;

translating the stencil from a position over the surface of the substrate, over a wiper positioned to remove a residual material from the surface of the stencil as the stencil is translated; and

inspecting the substrate using a video probe inspection system when the substrate is in a print position.

8. The method of claim 7 wherein the steps of inspecting and translating occur substantially simultaneously.

9. The method of claim 7 further comprising transporting a second substrate to a printing position while translating the stencil over the wiper.

10. A method for simultaneously inspecting an electronic substrate and cleaning a stencil in a stencil printer, the method comprising:

positioning the stencil above the electronic substrate;

depositing a material on the electronic substrate;

separating the stencil and the electronic substrate;

translating the stencil to a position removed from the area over the electronic substrate;

inserting an inspecting system in a space between the stencil and the electronic substrate; and

inspecting the electronic substrate while translating the stencil over a wiper for cleaning.