Patent Assignment
Reel/Frame 015460/0737
Assignment of Assignor's Interest
Recorded: 2004-07-01
Received: 2004-07-01
Pages: 70
Assignor
SPEEDLINE TECHNOLOGIES, INC.
Executed: 2004-05-21
Assignee
KPS SPECIAL SITUATIONS FUND II L.P.
200 PARK AVENUE, 38TH FLOOR, NEW YORK, NY, 10016, UNITED STATES
Covered Properties
(43)
Imaging and Inspection System for a Dispenser and Method for Same
Application:
10/831,468 →
Systems and Methods for Detecting Defects in Printed Solder Paste
Application:
10/784,118 →
Methods and Apparatus for Changing Web Material in a Stencil Printer
Application:
10/784,122 →
Self-Contained Vacuum Module for Stencil Wiper Assembly
Application:
10/784,121 →
Methods and Apparatus for Cleaning a Stencil
Application:
10/784,123 →
Method and Apparatus for Simultaneous Inspection and Cleaning of a Stencil
Application:
10/783,123 →
Dispensing system and method
Application:
10/766,285 →
System and Method for Controlling a Conveyor System Configuration to Accommodate Different Size Substrates
Application:
10/740,709 →
Systems and Methods for Detecting Defects in Printed Solder Paste
Application:
10/734,395 →
Stencil cleaner for use in the solder paste print operation
Application:
10/448,761 →
Dross Removal and Solder Reclamation Improvements
Application:
10/445,787 →
Adjustable Needle Foot for Dispensing System
Application:
10/428,250 →
Pressure Control System for Printing a Viscous Material
Application:
10/402,418 →
Method and Apparatus for Supporting a Substrate
Application:
10/394,814 →
Electronic Substrate Printing
Application:
10/346,803 →
Dispensing system with multiple partially independent heads
Application:
60/432,483 →
Selective Wave Solder System
Application:
10/260,980 →
Selective Gas Knife for Wave Soldering
Application:
10/260,944 →
Method and Apparatus for Dispensing Material in a Printer
Application:
10/254,348 →
Reflow Soldering Apparatus and Method for Selective Infrared Heating
Application:
10/247,402 →
Method and apparatus for releasing materials from stencils
Application:
10/236,108 →
Conveyorized vacuum injection system
Application:
10/233,746 →
Dispensing System and Method
Application:
10/196,571 →
Closed Loop Solder Wave Height Control System
Application:
10/190,900 →
Method for supporting a substrate
Application:
10/175,131 →
Dispensing system and method
Application:
10/156,715 →
Filtration of Flux Contaminants
Application:
10/125,100 →
Liquid Dispensing System with Improved Sealing Augering Screw and Method for Dispensing
Application:
10/076,037 →
Dispensing system and method
Application:
10/054,733 →
Compact Convection Drying Chamber for Drying Printed Circuit Boards and Other Electronic Assemblies by Enhanced Evaporation
Application:
10/051,213 →
Flux Collection Method and System
Application:
10/051,408 →
Solder-Dross Mixture Separation Method and Apparatus
Application:
10/051,407 →
Needle Cleaning System
Application:
09/974,022 →
System and Method for Controlling a Conveyor System Configuration to Accommodate Different Size Substrates
Application:
09/973,448 →
Apparatus for Dispensing Material in a Printer
Application:
09/968,181 →
Apparatus for Calibrating a Dispensing System
Application:
09/928,112 →
Dual Track Stenciling System with Solder Gathering Head
Application:
09/918,698 →
Stirring Mechanism for Viscous-Material Printer and Method of Printing
Application:
09/849,699 →
Liquid Dispensing System with Multiple Cartridges
Application:
09/845,508 →
Heater in a conveyor system
Application:
09/844,491 →
Cleaning Apparatus in a Stencil Printer
Application:
09/836,899 →
Apparatus and Methods for Wave Soldering
Application:
09/802,197 →
Automatic Dross Removal Apparatus and Method
Application:
09/759,506 →