IP Library Granted Patent US 7,028,391
Granted Patent B2
US 7,028,391 · App. 10/394,814 · Granted Apr 18, 2006

Method and apparatus for supporting a substrate

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Quick Facts
Patent No.
US 7,028,391
App. No.
10/394,814
Granted
Apr 18, 2006
Kind
B2
Abstract

An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface includes a frame, a transportation system that moves the substrate through the apparatus, a substrate support system, coupled to the frame, having a non-rigid portion that contacts and supports the substrate during an operation on the substrate, wherein the non-rigid portion allows flexure of the substrate before and during the performance of an operation on the substrate, and a device coupled to the frame that performs an operation on a surface of the substrate.

Claims (8)

1. An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface, the apparatus comprising:

a frame;

a transportation system that moves the substrate through the apparatus;

a substrate support system, coupled to the frame, having a supporting housing and a non-rigid portion comprising a low durometer gel that contacts and supports one of the first surface and the second surface of the substrate during an operation on the substrate, wherein the low durometer gel is contained in the supporting housing and conforms to the one of the first surface and the second surface of the substrate during the performance of an operation on the substrate and resumes to a relaxed state after performance of an operation on the substrate upon transferring the substrate from the apparatus; and

a device coupled to the frame that performs an operation on the other of the one of the first surface and the second surface of the substrate.

2. The apparatus of claim 1 wherein the support system is movable from a lowered position to a raised position, wherein the low durometer gel contacts the one of the first surface and the second surface of the substrate.

3. The apparatus of claim 1 , wherein the device is a stencil and the substrate is a circuit board.

4. The apparatus of claim 3 , wherein the low durometer gel contacts an underside of the circuit board and conforms to a topography of the circuit board.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2006
From: SPEEDLINE HOLDINGS I, LLC
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 018480/0775 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2004
From: SPEEDLINE TECHNOLOGIES, INC.
To: KPS SPECIAL SITUATIONS FUND II L.P.
Reel/Frame 015460/0737 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 6, 2004
From: SPEEDLINE TECHNOLOGIES, INC.
To: SPEEDLINE HOLDINGS I, LLC
Reel/Frame 014943/0593 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2003
From: PHAM-VAN-DIEP, GERALD; MORINI, JOHN E.
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 013905/0581 →