IP Library › Assignment 018480/0775
Patent Assignment
Reel/Frame 018480/0775

Release of Security Interest

Recorded: 2006-11-07 Pages: 8
Assignor
SPEEDLINE HOLDINGS I, LLC
Executed: 2006-11-06
Assignee
SPEEDLINE TECHNOLOGIES, INC.
16 FORGE PARK, FRANKLIN, MASSACHUSETTS, 02038
Covered Properties (141)
Wave-Soldering of Printed Circuit Boards
Patent: 4,530,457 →
Application: 06/338,952 →
Automatic Wave Soldering Machine
Patent: 4,632,291 →
Application: 06/470,494 →
Vibratory Wave Soldering
Patent: 4,684,056 →
Application: 06/830,962 →
Multi Stage Heater
Patent: 4,775,776 →
Application: 06/880,798 →
Mass Soldering System Providing a Sweeping Fluid Blast
Patent: 4,679,720 →
Application: 06/922,184 →
Focused Convection Reflow Soldering Method and Apparatus
Patent: 4,771,929 →
Application: 07/017,327 →
Method and Apparatus for Circuit Board Cleaning
Patent: 5,030,293 →
Application: 07/165,904 →
Vibratory Wave Soldering
Patent: 33,197 →
Application: 07/182,479 →
Solder Wave Nozzle Construction
Patent: 4,886,201 →
Application: 07/204,452 →
Method for Cleaning Electronic and Other Devices
Patent: 5,045,120 →
Application: 07/319,505 →
Mass Soldering System Providing an Improved Fluid Blast
Patent: 4,995,411 →
Application: 07/350,544 →
Shield Gas Wave Soldering
Patent: 5,044,542 →
Application: 07/441,009 →
Tunnel for Fluxless Soldering
Patent: 5,048,746 →
Application: 07/448,008 →
Flux Density Control System
Patent: 4,982,755 →
Application: 07/513,998 →
Inerted Ir Soldering System
Patent: 5,069,380 →
Application: 07/537,424 →
Solder Nozzle with Gas Knife Jet
Patent: 5,228,614 →
Application: 07/549,603 →
Viewing and Illuminating Video Probe with Viewing Means for Simultaneously Viewing Object and Device Images Along Viewing Axis and Translating Them Along Optical Axis
Patent: 5,060,063 →
Application: 07/559,622 →
Inerted Ir Soldering System
Patent: 5,125,556 →
Application: 07/591,118 →
Liquid Cleaning Process and Apparatus for Circuit Boards and the Like
Patent: 5,205,303 →
Application: 07/624,199 →
Shield Gas Wave Soldering
Patent: 5,121,874 →
Application: 07/626,728 →
Method of and System for Controlling Flow of Molten Liquid to Cast Metal Alloys
Patent: 5,125,450 →
Application: 07/629,666 →
Gas Curtain Additives and Zoned Tunnel for Soldering
Patent: 5,090,651 →
Application: 07/733,061 →
Flux Applicator System
Patent: 5,226,962 →
Application: 07/789,301 →
Video Probe Aligning of Object to Be Acted Upon
Patent: 34,615 →
Application: 07/829,727 →
Solder Apparatus with Dual Hollow Wave Nozzles
Patent: 5,156,324 →
Application: 07/853,068 →
Gas Shrouded Wave Soldering
Patent: 5,203,489 →
Application: 07/860,316 →
High Volume Convection Preheater for Wave Soldering
Patent: 5,230,460 →
Application: 07/903,070 →
Gas Shrouded Wave Soldering with Gas Knife
Patent: 5,240,169 →
Application: 07/961,781 →
Gas Shrouded Wave Improvement
Patent: 5,292,055 →
Application: 08/013,973 →
Preparation of Surfaces for Solder Joining
Patent: 5,398,865 →
Application: 08/065,273 →
Gas Shrouded Wave Improvement
Patent: 5,361,969 →
Application: 08/164,130 →
Gas Shrouded Solder Wave with Reduced Solder Splatter
Patent: 5,397,049 →
Application: 08/184,457 →
Support Apparatus for Circuit Board
Patent: 5,794,329 →
Application: 08/391,394 →
Stencil Apparatus for Applying Solder Paste
Patent: 5,669,970 →
Application: 08/458,710 →
Gas Knife Cooling System
Patent: 5,577,658 →
Application: 08/493,552 →
Liquid Dispensing System with Controllably Movable Cartridge
Patent: 6,082,289 →
Application: 08/518,986 →
Liquid Dispensing System with Multiple Cartridges
Patent: 5,795,390 →
Application: 08/519,146 →
Liquid Dispensing System with Sealing Augering Screw and Method for Dispensing
Patent: 5,819,983 →
Application: 08/562,068 →
High Speed Jet Soldering System
Patent: 5,938,102 →
Application: 08/583,641 →
Apparatus for Dispensing Flowable Material
Patent: 5,925,187 →
Application: 08/598,288 →
Applying Encapsulating Material to Substrates
Patent: 6,067,709 →
Application: 08/605,874 →
Cleaner for Printing Devices Having Means to Disengage Web from Fluid Source
Patent: 5,918,544 →
Application: 08/632,839 →
Electronic Component Cleaning Apparatus
Patent: 5,924,431 →
Application: 08/691,499 →
A Method and Apparatus for Viewing an Object and for Viewing a Device That Acts Upon Th Object
Patent: 5,943,089 →
Application: 08/702,163 →
Jet Soldering System and Method
Patent: 5,894,980 →
Application: 08/718,607 →
Jet Soldering System and Method
Patent: 5,894,985 →
Application: 08/719,117 →
Jet Soldering System and Method
Patent: 6,276,589 →
Application: 08/724,034 →
Method and Apparatus for Measuring the Size of Drops of a Viscous Material Dispensed from a Dispensing System
Patent: 5,837,892 →
Application: 08/738,093 →
Heater in a Conveyor System
Patent: 6,258,165 →
Application: 08/743,011 →
Circuit Board Support Assembly
Patent: 5,815,912 →
Application: 08/745,082 →
Conveyor System with Lifting Mechanism
Patent: 5,985,029 →
Application: 08/745,787 →
Solder Ball Placement Apparatus
Patent: 6,427,903 →
Application: 08/795,543 →
Positioning System
Patent: 5,903,125 →
Application: 08/796,236 →
Dual Track Stencil/Screen Printer
Patent: 5,873,939 →
Application: 08/802,934 →
High Speed Jet Soldering System
Patent: 6,224,180 →
Application: 08/803,758 →
Apparatus for Measuring the Height of a Substrate in a Dispensing System
Patent: 6,093,251 →
Application: 08/803,994 →
Controllable Liquid Dispensing Device
Patent: 5,957,343 →
Application: 08/885,005 →
Applying Adhesive to Substrates
Patent: 5,807,606 →
Application: 08/904,007 →
Jet Soldier Soldier System and Method
Patent: 6,186,192 →
Application: 08/908,195 →
Monitoring Deposited Pads
Patent: 5,882,720 →
Application: 08/908,770 →
Dual Track Stenciling System with Solder Gathering Head
Patent: 6,066,206 →
Application: 08/920,121 →
Jet Soldering System and Method
Patent: 5,868,305 →
Application: 08/935,525 →
Flux Management System
Patent: 5,993,500 →
Application: 08/951,364 →
Method and Apparatus for Dispensing Material in a Printer
Patent: 5,947,022 →
Application: 08/966,057 →
Positioning System
Patent: 5,886,494 →
Application: 08/967,682 →
Multiple Head Dispensing System and Method
Patent: 6,007,631 →
Application: 09/033,022 →
Method and Apparatus for Transporting Substrates
Patent: 6,032,577 →
Application: 09/033,231 →
Liquid Dispensing System with Improved Sealing Augering Screw and Method for Dispensing
Patent: 5,971,227 →
Application: 09/075,604 →
Liquid Dispensing System with Multiple Cartridges
Patent: 6,017,392 →
Application: 09/080,947 →
Solder Ball Placement Method
Patent: 6,170,737 →
Application: 09/090,120 →
Method and Apparatus for Measuring the Size of Drops of a Viscous Material Dispensed from a Dispensing System
Patent: 6,112,588 →
Application: 09/104,270 →
Controllable Liquid Dispensing Device
Patent: 6,085,943 →
Application: 09/104,457 →
Solder Ball Placement Apparatus
Patent: 6,056,190 →
Application: 09/116,012 →
Dual Track Stencil/Screen Printer
Patent: 6,207,220 →
Application: 09/160,407 →
Method and Apparatus for Dispensing Materials in a Vacuum
Patent: 6,119,895 →
Application: 09/168,536 →
Dual Image Stencil Apparatus Having Stencil Including Sections with Curled Edges
Patent: 6,189,448 →
Application: 09/186,718 →
Multiple Head Dispensing System and Method
Patent: 6,206,964 →
Application: 09/189,014 →
Positioning System
Patent: 6,025,689 →
Application: 09/203,253 →
Method and Apparatus for Dispensing Material in a Printer
Patent: 6,324,973 →
Application: 09/235,034 →
Publication: US 2001/0011506
High Speed Jet Soldering System
Patent: 6,264,090 →
Application: 09/246,229 →
Compact Reflow and Cleaning Apparatus
Patent: 6,446,855 →
Application: 09/252,377 →
Dispensing System and Method
Patent: 6,214,117 →
Application: 09/253,119 →
Method and Apparatus for Placing Solder Balls on a Substrate
Patent: 6,641,030 →
Application: 09/253,150 →
Air Knife Drying System
Patent: 6,260,231 →
Application: 09/253,239 →
Method and Apparatus for Forming Droplets
Patent: 6,260,741 →
Application: 09/253,631 →
Positioning System
Patent: 6,157,157 →
Application: 09/273,876 →
Method and Apparatus for Detecting Solder Paste Deposits on Substrates
Patent: 6,738,505 →
Application: 09/304,699 →
Dispensing System and Method
Patent: 6,216,917 →
Application: 09/351,697 →
Liquid Dispensing System with Improved Sealing Augering Screw and Method for Dispensing
Patent: 6,371,339 →
Application: 09/392,820 →
Compact Reflow and Cleaning Apparatus
Patent: 6,354,481 →
Application: 09/435,650 →
Method and Apparatus for Dispensing Material in a Printer
Patent: 6,453,810 →
Application: 09/435,727 →
Liquid Dispensing System with Multiple Cartridges
Patent: 6,224,671 →
Application: 09/459,702 →
Multiple Head Dispensing System and Method
Patent: 6,224,675 →
Application: 09/459,784 →
Apparatus for Transporting Circuit Boards in a Screen Printer
Patent: 6,374,729 →
Application: 09/460,053 →
Varible Volume Positive Displacement Dispensing System and Method
Patent: 6,514,569 →
Application: 09/483,360 →
Conveyorized Vacuum Injection System
Patent: 6,444,035 →
Application: 09/493,873 →
Method and Apparatus for Measuring the Size of Drops of a Viscous Material Dispensed from a Dispensing System
Patent: 6,412,328 →
Application: 09/496,721 →
Publication: US 2002/0088269
Dual track stenciling system with solder gathering head
Patent: 6,267,819 →
Application: 09/498,239 →
Closed Loop Solder Wave Height Control System
Patent: 6,415,972 →
Application: 09/585,934 →
Controllable Liquid Dispensing Device
Patent: 6,378,737 →
Application: 09/611,502 →
Method for Dispensing Material Onto a Substrate
Patent: 6,391,378 →
Application: 09/624,677 →
Multiple Head Dispensing Method
Patent: 6,395,334 →
Application: 09/643,324 →
Multiple head dispensing method
Patent: 6,322,854 →
Application: 09/643,446 →
Calibration of a Dispensing System
Patent: 6,541,063 →
Application: 09/705,080 →
Solder printers
Application: 09/706,966 →
Conveyorized Vacuum Injection System
Patent: 6,644,238 →
Application: 09/728,175 →
Publication: US 2001/0013316
High Speed Electronic Assembly System and Method
Patent: 6,572,702 →
Application: 09/745,324 →
Automatic Dross Removal Apparatus and Method
Patent: 6,592,017 →
Application: 09/759,506 →
Publication: US 2002/0092897
Apparatus and Methods for Wave Soldering
Patent: 6,431,431 →
Application: 09/802,197 →
Publication: US 2001/0030220
Cleaning Apparatus in a Stencil Printer
Patent: 6,626,106 →
Application: 09/836,899 →
Publication: US 2002/0148374
Heater in a conveyor system
Application: 09/844,491 →
Publication: US 2002/0007782
Liquid Dispensing System with Multiple Cartridges
Patent: 6,540,832 →
Application: 09/845,508 →
Publication: US 2002/0008118
Stirring Mechanism for Viscous-Material Printer and Method of Printing
Patent: 6,571,701 →
Application: 09/849,699 →
Dual Track Stenciling System with Solder Gathering Head
Patent: 6,663,712 →
Application: 09/918,698 →
Publication: US 2002/0020346
Apparatus for Calibrating a Dispensing System
Patent: 6,814,810 →
Application: 09/928,112 →
Publication: US 2002/0020350
Apparatus for Dispensing Material in a Printer
Patent: 6,626,097 →
Application: 09/968,181 →
Publication: US 2002/0007741
System and Method for Controlling a Conveyor System Configuration to Accommodate Different Size Substrates
Patent: 6,688,458 →
Application: 09/973,448 →
Publication: US 2003/0066734
Needle Cleaning System
Patent: 6,775,879 →
Application: 09/974,022 →
Publication: US 2003/0066546
Compact Convection Drying Chamber for Drying Printed Circuit Boards and Other Electronic Assemblies by Enhanced Evaporation
Patent: 6,760,981 →
Application: 10/051,213 →
Publication: US 2003/0136019
Solder-Dross Mixture Separation Method and Apparatus
Patent: 6,666,370 →
Application: 10/051,407 →
Publication: US 2003/0136816
Flux Collection Method and System
Patent: 6,694,637 →
Application: 10/051,408 →
Publication: US 2003/0136020
Dispensing system and method
Application: 10/054,733 →
Publication: US 2003/0000462
Liquid Dispensing System with Improved Sealing Augering Screw and Method for Dispensing
Patent: 6,739,483 →
Application: 10/076,037 →
Publication: US 2002/0195468
Filtration of Flux Contaminants
Patent: 6,749,655 →
Application: 10/125,100 →
Publication: US 2003/0196551
Dispensing system and method
Application: 10/156,715 →
Publication: US 2003/0091727
Method for supporting a substrate
Application: 10/175,131 →
Publication: US 2004/0016113
Closed Loop Solder Wave Height Control System
Patent: 6,726,083 →
Application: 10/190,900 →
Publication: US 2003/0057257
Dispensing System and Method
Patent: 6,866,881 →
Application: 10/196,571 →
Publication: US 2003/0084845
Conveyorized vacuum injection system
Application: 10/233,746 →
Publication: US 2003/0010286
Method and apparatus for releasing materials from stencils
Application: 10/236,108 →
Publication: US 2004/0045458
Reflow Soldering Apparatus and Method for Selective Infrared Heating
Patent: 6,768,083 →
Application: 10/247,402 →
Publication: US 2004/0056068
Method and Apparatus for Dispensing Material in a Printer
Patent: 6,619,198 →
Application: 10/254,348 →
Publication: US 2003/0097941
Selective Gas Knife for Wave Soldering
Patent: 6,913,183 →
Application: 10/260,944 →
Publication: US 2004/0060960
Selective Wave Solder System
Patent: 7,213,738 →
Application: 10/260,980 →
Publication: US 2004/0060963
Electronic Substrate Printing
Patent: 7,293,691 →
Application: 10/346,803 →
Publication: US 2004/0142099
Method and Apparatus for Supporting a Substrate
Patent: 7,028,391 →
Application: 10/394,814 →
Publication: US 2003/0233750
Pressure Control System for Printing a Viscous Material
Patent: 6,955,120 →
Application: 10/402,418 →
Publication: US 2004/0187716
Adjustable Needle Foot for Dispensing System
Patent: 6,932,280 →
Application: 10/428,250 →
Publication: US 2004/0227010
Dross Removal and Solder Reclamation Improvements
Patent: 6,948,650 →
Application: 10/445,787 →
Publication: US 2004/0011851
Stencil cleaner for use in the solder paste print operation
Application: 10/448,761 →
Publication: US 2004/0238003
Dispensing system with multiple partially independent heads
Application: 60/432,483 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 1, 2005
From: COOKSON CANADA, INC.
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 016026/0230 →
Certificate of Amendment to Certificate of Incorporation of Hollis Automation, Inc. Nov 21, 2006
From: HOLLIS AUTOMATION, INC.
To: HOLLIS AUTOMATION CO.
Reel/Frame 018535/0474 →
Memorandum of Assignment - U.S. Patents and Application Nov 21, 2006
From: HOLLIS AUTOMATION CO.
To: ELECTROVERT U.S.A. CORP.
Reel/Frame 018535/0489 →
Certificate of Amendment of Certificate of Incorporation Nov 21, 2006
From: ELECTROVERT U.S.A. CORP.
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 018535/0501 →
Assignment of Assignor's Interest Feb 10, 2020
From: LAVANIA, UMESH CHANDRA; LAVANIA, SESHU; YERRAMILLI, VIMALA; DUBEY, BASANT KUMAR
To: COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH
Reel/Frame 051764/0395 →