Granted Patent
Utility
US 6,641,030 · App. 09/253,150
Method and apparatus for placing solder balls on a substrate
Inventors:
Gary T. Freeman, Thomas Nowak, Thomas Purcell, A. Jason Mirabito, Thomas M. Sullivan, Richard F. Foulke, Richard F. Foulke, Cord W. Ohlenbusch
Patented Case
View Patent ↗
Granted: Nov 4, 2003
Filed: Feb 19, 1999
Inventors
Gary T. Freeman
Thomas Nowak
Thomas Purcell
A. Jason Mirabito
Thomas M. Sullivan
Richard F. Foulke
Richard F. Foulke
Cord W. Ohlenbusch
Assignee (at issue)
Speedline Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.