Patent Assignment
Reel/Frame 016026/0230
Assignment of Assignor's Interest
Recorded: 2005-04-01
Pages: 6
Assignor
COOKSON CANADA, INC.
Executed: 2005-03-17
Assignee
SPEEDLINE TECHNOLOGIES, INC.
16 FORGE PARK, FRANKLIN, MASSACHUSETTS, 02038
Covered Properties
(27)
Wave-Soldering of Printed Circuit Boards
Patent:
4,530,457 →
Application:
06/338,952 →
Vibratory Wave Soldering
Patent:
4,684,056 →
Application:
06/830,962 →
Multi Stage Heater
Patent:
4,775,776 →
Application:
06/880,798 →
Foam Fluxer
Patent:
4,796,558 →
Application:
07/157,959 →
Restriction of Dross Formation in a Soldering Apparatus
Patent:
4,802,617 →
Application:
07/158,308 →
Vibratory Wave Soldering
Patent:
33,197 →
Application:
07/182,479 →
Method for Cleaning Electronic and Other Devices
Patent:
5,045,120 →
Application:
07/319,505 →
Cooling and Exhaust Unit for Solder Reflow System
Patent:
4,912,857 →
Application:
07/378,856 →
A Method of Making a Metallic Core Assembly
Patent:
5,173,237 →
Application:
07/469,164 →
Flux Density Control System
Patent:
4,982,755 →
Application:
07/513,998 →
Inerted Ir Soldering System
Patent:
5,069,380 →
Application:
07/537,424 →
Inerted Ir Soldering System
Patent:
5,125,556 →
Application:
07/591,118 →
Liquid Cleaning Process and Apparatus for Circuit Boards and the Like
Patent:
5,205,303 →
Application:
07/624,199 →
Shield Gas Wave Soldering
Patent:
5,121,874 →
Application:
07/626,728 →
Method of and System for Controlling Flow of Molten Liquid to Cast Metal Alloys
Patent:
5,125,450 →
Application:
07/629,666 →
Apparatus for Casting Metal Alloys with Low Melting Temperatures
Patent:
5,090,470 →
Application:
07/657,165 →
Gas Curtain Additives and Zoned Tunnel for Soldering
Patent:
5,090,651 →
Application:
07/733,061 →
Double Acting Cylinder for Filling Dies with Molten Metal
Patent:
5,181,551 →
Application:
07/766,551 →
Electrochemical Reduction Treatment for Soldering
Patent:
5,162,082 →
Application:
07/808,408 →
Solder Apparatus with Dual Hollow Wave Nozzles
Patent:
5,156,324 →
Application:
07/853,068 →
Electrochemical Reduction Treatment for Soldering
Patent:
5,232,562 →
Application:
07/913,674 →
Gas Shrouded Wave Soldering with Gas Knife
Patent:
5,240,169 →
Application:
07/961,781 →
Gas Shrouded Wave Improvement
Patent:
5,292,055 →
Application:
08/013,973 →
Preparation of Surfaces for Solder Joining
Patent:
5,398,865 →
Application:
08/065,273 →
Gas Shrouded Wave Improvement
Patent:
5,361,969 →
Application:
08/164,130 →
Gas Shrouded Solder Wave with Reduced Solder Splatter
Patent:
5,397,049 →
Application:
08/184,457 →
Applying Flux to a Solder Wave for Wave Soldering an Element
Patent:
5,568,894 →
Application:
08/347,606 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Notice of Grant of Security Interest in Patents
Feb 6, 2004
From: SPEEDLINE TECHNOLOGIES, INC.
To: SPEEDLINE HOLDINGS I, LLC
Reel/Frame 014943/0593 →
Assignment of Assignor's Interest
Jul 1, 2004
From: SPEEDLINE TECHNOLOGIES, INC.
To: KPS SPECIAL SITUATIONS FUND II L.P.
Reel/Frame 015460/0737 →
Merger
May 22, 2006
From: ELECTROVERT LTD.
To: COOKSON CANADA, INC.
Reel/Frame 017649/0001 →
Release of Security Interest
Nov 7, 2006
From: SPEEDLINE HOLDINGS I, LLC
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 018480/0775 →
Executive Order 9424, Confirmatory License
Jun 2, 2008
From: NEW YORK SOCIETY FOR THE RELIEF OF THE RUPTURED AND CRIPPLED, MAINTAING THE HOSPITAL FOR SPECIAL SURGERY
To: NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT
Reel/Frame 021030/0813 →
Assignment of Assignor's Interest
Feb 10, 2020
From: LAVANIA, UMESH CHANDRA; LAVANIA, SESHU; YERRAMILLI, VIMALA; DUBEY, BASANT KUMAR
To: COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH
Reel/Frame 051764/0395 →