Selective wave solder system
View Patent ↗The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.
1. A selective wave solder system comprising:
a plurality of processing modules for processing a circuit board;
a process program identifying a sequence of a plurality of process points on a circuit board and one of a plurality of processing modules corresponding to each process point;
a gantry system moving a circuit board to align each process point, in sequence, with the corresponding processing module;
a process point adjustment mechanism for adjusting the process points, the process point adjustment mechanism including
a memory storing a stored location of at least one fiducial,
a vision system for capturing at least one image of at least one portion of a circuit board,
location determining means for determining an actual location for the at least one fiducial based upon the at least one image, and
offset means for determining at least one offset value for each of the process points based upon the stored location and the actual location of the at least one fiducial, the offset means determining the offset value based upon a difference, in x and y dimensions, between the actual location and stored location of the one fiducial wherein the memory stores a stored location of two fiducials; and
wherein the offset means includes:
means for determining a rotation offset;
means for determining a dimension offset; and
means for determining the offset value by combining a translation offset based on the difference in x and y dimensions, the rotation offset and the dimension offset.
2. The wave solder system according to claim 1 , wherein means for determining a rotation offset includes:
means for determining a stored angle between the stored locations of the fiducials;
means for determining an actual angle between the actual locations of the fiducials;
means for determining a rotation error as the difference between the stored angle and the actual angle; and
means for determining a rotational offset for each process point based upon the rotation error and a distance between each process point and the stored location of one of the fiducials.
3. The wave solder system according to claim 1 , wherein the means for determining a dimension offset includes:
means for determining a ratio between a vector distance of the stored location of the fiducials and a vector distance of the actual location of the fiducials; and
means for determining a dimensional offset for each process point based upon the ratio and a vector distance between the process point and the stored location of one of the fiducials.
4. The wave solder system according to claim 1 , wherein at least one process point corresponds to a rotational position of the gantry; and
wherein the offset means includes:
means for determining an adjusted actual position of the at least one fiducial based upon the actual position of the at least one fiducial and the rotational position of the gantry; and
means for determining the at least one offset value based upon the process points and the adjusted actual position of the at least one fiducial.
5. A selective wave solder system comprising:
a plurality of processing modules for processing a circuit board;
a process program identifying a sequence of a plurality of process points on a circuit board and one of the plurality of processing modules corresponding to each process point;
a gantry system moving a circuit board to align each process point, in sequence, with the corresponding processing module;
a calibration system, the calibration system comprising
a vision system attached to the gantry system for capturing at least one image of at least one portion of the plurality of processing modules, and
process module locating means for determining a location of each of the processing modules based upon the at least one image; and
a rotational calibration system including
two fiducials at known locations relative to the gantry system,
a vision system for capturing at least one image of the two fiducials,
means for determining the location of the two fiducials based upon the at least one image, and
means for determining a rotation of the gantry system to align the two fiducials to a reference angle.
6. The selective wave solder system according to claim 5 , further comprising a plurality of fiducials, each fiducial associated with one of the plurality of processing modules; and
wherein the process module locating means includes means for locating each of the plurality of fiducials in the at least one image.
7. The selective wave solder system according to claim 5 , wherein the gantry system moves to align the process point with the location of the corresponding processing module determined by the calibration system.
8. The selective wave solder system according to claim 5 , further comprising a teaching system, the teaching system comprising:
a vision system for displaying to a user at least a portion of a circuit board;
a control system for moving the gantry system over the vision system; and
process point entry means for storing a process point and corresponding process module when a process point is displayed on a predetermined portion of the vision system.
9. The selective wave solder system according to claim 5 ,
wherein the rotational calibration system further includes:
means for rotating the gantry system a known distance;
means for determining the location of the two fiducials based upon the at least one image following rotation of the gantry system; and
means for determining a center of rotation based upon a difference in position between the locations of the fiducials before and after rotation of the gantry system.
10. A wave solder system comprising:
at least one processing module to perform a procedure on a circuit board;
a gantry system to move at least one of a circuit board and the at least one processing module to align a process point of the printed circuit board with the at least one processing module; and
a process point adjustment mechanism to adjust the process point, the process point adjustment mechanism including
a vision system to capture at least one image of at least one portion of a circuit board to include an actual location of at least one fiducial,
a control system to determine an actual location for the at least one fiducial based upon the at least one image, to determine at least one offset value for the process point based upon the stored location and the actual location of the at least one fiducial, and to control the gantry system to adjust the process point, the control system comprising a translation control system to determine a translational offset value based upon a difference, in x and y dimensions, between the actual location and stored location of the one fiducial, and
a rotational control system to determine a rotational offset value, wherein the one offset value is determined by combining the translational offset value and the rotational offset value, the rotational control system including:
means for determining a stored angle between the stored location of the fiducial;
means for determining an actual angle between the actual location of the fiducial;
means for determining a rotation error as the difference between the stored angle and the actual angle; and
means for determining a rotational offset for each process point based upon the rotation error and a distance between each process point and the stored location of the fiducial.
11. A wave solder system comprising:
at least one processing module to perform a procedure on a circuit board;
a gantry system to move at least one of a circuit board and the at least one processing module to align a process point of the printed circuit board with the at least one processing module; and
a process point adjustment mechanism to adjust the process point, the process point adjustment mechanism including
a vision system to capture at least one image of at least one portion of a circuit board to include an actual location of at least one fiducial, and
a control system to determine an actual location for the at least one fiducial based upon the at least one image, to determine at least one offset value for the process point based upon the stored location and the actual location of the at least one fiducial, and to control the gantry system to adjust the process point, the control system including:
means for determining a ratio between a vector distance of the stored location of the fiducial and a vector distance of the actual location of the fiducial; and
means for determining a dimensional offset for each process point based upon the ratio and a vector distance between the process point and the stored location of the fiducial.
12. A wave solder system comprising:
at least one processing module to perform a procedure on a circuit board;
a gantry system to move at least one of a circuit board and the at least one processing module to align a process point of the printed circuit board with the at least one processing module; and
a process point adjustment mechanism to adjust the process point, the process point adjustment mechanism including
a vision system to capture at least one image of at least one portion of a circuit board to include an actual location of at least one fiducial, and
a control system to determine an actual location for the at least one fiducial based upon the at least one image, to determine at least one offset value for the process point based upon the stored location and the actual location of the at least one fiducial, and to control the gantry system to adjust the process point,
wherein at least one process point corresponds to a rotational position of the gantry; and
wherein the control system includes:
means for determining an adjusted actual position of the at least one fiducial based upon the actual position of the at least one fiducial and the
rotational position of the gantry; and means for determining the at least one offset value based upon the process points and the adjusted actual position of the at least one fiducial.