IP Library Granted Patent US 6,866,881
Granted Patent B2
US 6,866,881 · App. 10/196,571 · Granted Mar 15, 2005

Dispensing system and method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,866,881
App. No.
10/196,571
Granted
Mar 15, 2005
Kind
B2
Abstract

A dispensing system and method for dispensing material onto a substrate. The dispensing system includes a frame, a support, coupled to the frame, that supports the substrate at a dispensing position in the dispensing system, and a dispensing head, coupled to the frame, that dispenses the material onto the substrate. The dispensing head includes a motor unit having a first motor coupled to an output drive mechanism, and a dispensing unit, removably coupled to the motor unit, having a material outlet from which the dispensing material is dispensed, the dispensing unit having a dispensing mechanism coupled to the material outlet and coupled to the output drive mechanism of the motor unit such that operation of the first motor causes the dispensing mechanism to dispense material through the outlet. The dispensing head may be controlled for deposition of dots of material having diameters smaller than a dispensing needle of the dispensing unit.

Claims (24)

1. A method of dispensing a dot of material on an electronic substrate, the method comprising:

loading the material into a dispenser, the dispenser having a dispensing needle with an outlet having an inner diameter at an end of the needle;

positioning the dispenser over the electronic substrate;

forming a meniscus of material on the end of the needle;

lowering the dispenser towards the electronic substrate to contact the meniscus with the electronic substrate; and

raising the dispenser from the electronic substrate to release a dot of material on the electronic substrate;

wherein the dot of material has a contact surface area on the electronic substrate, the contact surface area having a diameter less than or equal to the inner diameter of the outlet of the needle.

2. The method of claim 1 , wherein the material is one of silver epoxy, surface mount adhesive, flux and solder paste.

3. The method of claim 2 , wherein forming a meniscus of material on the end of the needle includes coupling a motor having an encoder to the dispenser, and coupling a gear reducer between the motor and the encoder.

4. The method of claim 3 , wherein the dispenser includes an auger screw, and wherein forming a meniscus of material on the end of the needle includes rotating the auger screw by a predetermined amount.

5. The method of claim 4 , wherein the step of lowering includes maintaining the motor at a fixed position while the dispenser is lowered.

6. The method of claim 1 , wherein forming a meniscus of material on the end of the needle includes coupling a motor having an encoder to the dispenser, and coupling a gear reducer between the motor and the encoder.

7. The method of claim 6 , wherein the dispenser includes an auger screw, and wherein forming a meniscus of material on the end of the needle includes rotating the auger screw by a predetermined amount.

8. The method of claim 1 , wherein the contact surface area of the dot of material on the substrate has a diameter of about 0.005 inches or less.

9. A method of dispensing a dot of material on an electronic substrate, the method comprising:

loading the material into a dispenser, the dispenser having a dispensing needle with an outlet having an inner diameter at an end of the needle;

positioning the dispenser over the electronic substrate;

forming a meniscus of material on the end of the needle;

contacting the meniscus with the electronic substrate; and

separating the dispenser and the electronic substrate to release a dot of material on the electronic substrate;

wherein the dot of material has a contact surface area on the electronic substrate, the contact surface areas having a diameter less than or equal to the inner diameter of the outlet of the needle.

10. The method of claim 9 , wherein forming a meniscus of material on the end of the needle includes coupling a motor having an encoder to the dispenser, and coupling a gear reducer between the motor and the encoder.

11. The method of claim 10 , wherein the dispenser includes an auger screw, and wherein forming a meniscus of material on the end of the needle includes rotating the auger screw by a predetermined amount.

12. The method of claim 11 , wherein the step of lowering the dispenser includes maintaining the motor at a fixed position while the dispenser is lowered.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2006
From: SPEEDLINE HOLDINGS I, LLC
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 018480/0775 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2004
From: SPEEDLINE TECHNOLOGIES, INC.
To: KPS SPECIAL SITUATIONS FUND II L.P.
Reel/Frame 015460/0737 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 6, 2004
From: SPEEDLINE TECHNOLOGIES, INC.
To: SPEEDLINE HOLDINGS I, LLC
Reel/Frame 014943/0593 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2003
From: KARLINSKI, THOMAS J.
To: SPEEDLINE TECHNOLOGIES, INC.
Reel/Frame 014463/0546 →