Hexagonal array structure for ball grid array packages
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the hexagonal array may be utilized under the die shadow and an orthogonal array may be used outbound thereof.
1. A semiconductor integrated circuit device comprising:
an integrated circuit;
an integrated circuit package; and
a plurality of solder balls coupled to said integrated circuit and said package, said balls being more dense under said integrated circuit and less dense around said integrated circuit, wherein solder balls under the integrated circuit are arranged in a hexagonal array.
2. The device of claim 1 wherein solder balls outbound of the region underneath the integrated circuit arc arranged in an orthogonal array.
3. The device of claim 1 including providing some solder balls on said package in an orthogonal array and some solder balls in a hexagonal array.
4. The device of claim 1 including via pads that are substituted for solder pads.
5. The device of claim 1 wherein the solder balls under said integrated circuit have a density of about 1.15 balls per unit of area and the balls not under said integrated circuit have a density of about 1 ball per unit area.
6. An electronic device comprising:
an integrated circuit;
an integrated circuit package; and
a plurality of solder balls coupled to said integrated circuit and said package, said solder balls between said package and said circuit being arranged in a hexagonal array and said solder balls not between the package and the circuit being arranged in an orthogonal array.
7. The device of claim 6 wherein via pads are provided in place of solder pads.
8. The device of claim 6 wherein said bails between the circuit and the board have a density of about 1.15 balls per unit area and said balls not between said circuit and said board having a density of about 1 ball per unit area.