Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography
The present invention is directed to a method of forming a layer on a substrate comprising forming a plurality of flowable regions on the substrate and contacting the flowable regions with a plurality of molds disposed on a template. Thereafter, the plurality of flowable regions is solidified. In a further embodiment, the method further includes spreading each of the plurality of flowable regions to an area.
1 . A method of forming a layer on a substrate, said method comprising:
forming a plurality of flowable regions on said substrate;
contacting said flowable regions with a plurality of molds disposed on a template; and
solidifying said plurality of flowable regions.
2 . The method as recited in claim 1 , wherein forming further includes forming said plurality of flowable regions as an integer multiple of said plurality of molds.
3 . The method as recited in claim 1 further including spreading a material in said plurality of flowable regions over said substrate while confining said material associated with each of said plurality of flowable regions to an area.
4 . The method as recited in claim 1 , wherein contacting further includes flexing said template to conform to a topography of said substrate.
5 . The method as recited in claim 1 , wherein solidifying further includes applying electromagnetic activation energy to said plurality of flowable regions.
6 . The method as recited in claim 1 , wherein contacting further includes flexing said template at a region between adjacent molds of said plurality of molds.
7 . The method as recited in claim 1 , wherein forming further includes forming said plurality of flowable regions concurrently.
8 . The method as recited in claim 1 , wherein forming further includes forming each of said plurality of flowable regions to be spaced-apart from adjacent flowable regions of said plurality of flowable regions.
9 . A method of forming a layer on a substrate, said method comprising:
forming a plurality of flowable regions on a surface of said substrate;
providing each of said plurality of flowable regions with a surface having a desired shape; and
solidifying said plurality of flowable regions.
10 . The method as recited in claim 9 , wherein providing further includes contacting said plurality of flowable regions with a plurality of molds disposed on a template.
11 . The method as recited in claim 10 , wherein forming further includes forming said plurality of flowable regions as an integer multiple of said plurality of molds.
12 . The method as recited in claim 10 , wherein contacting further includes flexing said template to conform to a topography of said substrate.
13 . The method as recited in claim 9 , wherein solidifying further includes applying electromagnetic activation energy to said plurality of flowable regions.
14 . The method as recited in claim 10 , wherein contacting further includes flexing said template at a region between adjacent molds of said plurality of molds.
15 . The method as recited in claim 9 further including spreading a material in said plurality of flowable regions over said substrate while confining said material associated with each of said plurality of flowable regions to an area.
16 . A method of forming a layer on a substrate, said method comprising:
forming a plurality of flowable regions on said substrate;
spreading a material in said plurality of flowable regions over said substrate while confining said material associated with each of said plurality of flowable regions to an area;
contacting said flowable regions with a plurality of molds disposed on a template; and
solidifying said plurality of flowable regions.
17 . The method as recited in claim 16 , wherein forming further includes forming said plurality of flowable regions as an integer multiple of said plurality of molds.
18 . The method as recited in claim 16 , wherein contacting further includes flexing said template to conform to a topography of said substrate.
19 . The method as recited in claim 16 , wherein solidifying further includes applying electromagnetic activation energy to said plurality of flowable regions.
20 . The method as recited in claim 16 , wherein contacting further includes flexing said template at a region between adjacent molds of said plurality of molds.