Shaped non-contact capacitive displacement sensors for measuring shaped targets
An improved non-contact capacitive displacement sensor that may be employed for accurately measuring small distances between the sensor and shaped targets. The non-contact capacitive displacement sensor includes a probe having a sensor element and a guard element. The guard element substantially surrounds the sensor element. At least the sensor element has a shape that substantially matches the shape of a target element.
1. A non-contact capacitive displacement sensor for measuring a distance to at least one target element, said target element having at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic, said non-contact capacitive displacement sensor comprising:
at least one conductive sensor element, said conductive sensor element having at least one of a non-linear shaped surface and a non-planar shaped surface configured to conform to a contour of said at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic of said target element to be measured,
thereby allowing a uniform distance to be maintained between the shaped surface of the sensor element and the shaped surface characteristic of the target element while the sensor element is disposed proximate to the target element.
2. The sensor of claim 1 further including a conductive guard element configured to substantially surround the sensor element.
3. The sensor of claim 2 further including a ground element configured to substantially surround the guard element.
4. The sensor of claim 2 further including at least one non-conductive element disposed between the sensor element and the guard element surrounding the sensor element.
5. The sensor of claim 4 wherein at least the sensor element has at least one of a non-linear shaped surface and a non-planar shaped surface configured to conform to the contour of said at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic of said target element to be measured.
6. The sensor of claim 1 further including a ground element configured to substantially surround the sensor element.
7. The sensor of claim 1 further including a substrate, the sensor element being disposed on the substrate.
8. The sensor of claim 7 wherein the sensor element comprises a conductive layer disposed on the substrate, the conductive layer being patterned to conform to the contour of said at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic of said target element to be measured.
9. A method of fabricating a non-contact capacitive displacement sensor, said non-contact capacitive displacement sensor being operative to measure a distance to at least one target element, said target element having at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic, said method comprising the steps of:
providing a conductive sensor element;
applying at least one non-conductive layer to a surface of the sensor element,
thereby substantially surrounding the sensor element with the non-conductive layer;
applying at least one conductive layer to a surface of the non-conductive layer,
thereby substantially surrounding the non-conductive layer with the conductive layer; and
shaping at least one surface of at least the sensor element to form at least one of a non-linear shaped surface and a non-planar shaped surface configured to conform to a contour of said at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic of said target element to be measured,
thereby allowing a uniform distance to be maintained between the shaped surface of the sensor element and the shaped surface characteristic of the target element while the sensor element is disposed proximate to the target element.
10. The method of claim 9 wherein the first applying step includes laminating the at least one non-conductive layer to the surface of the sensor element.
11. The method of claim 9 wherein the second applying step includes laminating the at least one conductive layer to the surface of the non-conductive layer.
12. The method of claim 9 wherein the at least one non-conductive layer comprises a dielectric layer.
13. The method of claim 9 wherein the first applying step includes laminating the at least one non-conductive layer to the surface of the sensor element, and wherein the second applying step includes laminating the at least one conductive layer to the surface of the non-conductive layer, thereby forming a stack of conductive layers separated by at least one non-conductive layer.
14. A method of fabricating a non-contact capacitive displacement sensor, said non-contact capacitive displacement sensor being operative to measure a distance to at least one target element, said target element having at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic, said method comprising the steps of:
providing a substrate; and
disposing at least one conductive layer on the substrate,
wherein the at least one conductive layer is patterned to form at least one sensor element on the substrate, and
wherein the at least one sensor element has at least one of a non-linear shaped surface and a non-planar shaped surface configured to conform to a contour of said at least one of a non-linear shaped surface characteristic and a non-planar shaped surface characteristic of said target element to be measured,
thereby allowing a uniform distance to be maintained between the shaped surface of the sensor element and the shaped surface characteristic of the target element while the sensor element is disposed proximate to the target element.
15. The method of claim 14 wherein the at least one conductive layer includes a first conductive layer comprising a guard element and a second conductive layer comprising the sensor element, the guard element substantially surrounding the sensor element, the guard element being disposed between the substrate and the sensor element.
16. The method of claim 14 wherein the disposing step includes applying the at least one conductive layer to a surface of the substrate by a silk-screening technique.
17. The method of claim 14 further including the step of patterning the at least one conductive layer by a laser cutting technique.
18. The method of claim 14 wherein the disposing step includes applying the at least one conductive layer to a surface of the substrate by a photolithography technique.