IP Library Granted Patent US 7,420,217
Granted Patent B2
US 7,420,217 · App. 10/795,287 · Granted Sep 2, 2008

Thin film LED

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Quick Facts
Patent No.
US 7,420,217
App. No.
10/795,287
Granted
Sep 2, 2008
Kind
B2
Abstract

Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a tinted thin film layer over the LED chip that changes the color of the emitted light. For example, a blue-light emitting LED chip can be used to produce white light. The tinted thin film layer beneficially consists of ZnSe, CeO 2 , Al 2 O 3 , or Y 2 O 3 :Ce that is deposited using a chemical vapor deposition process, such as metal organic chemical vapor deposition (MOCVD), atomic layer chemical vapor deposition (ALD), plasma enhanced MOCVD, plasma enhanced ALD, and/or photo enhanced CVD. Suitable CVD precursors include Alkoxide, β-dikeonate, Metalloscene, Alkys, DMZn, DEZe, H 2 Se, DMSe, TbuSe, and DESe.

Claims (14)

1. On-chip light emitting diode (LED), comprising:

an LED chip having a first electrical contact and a second electrical contact, the LED chip emitting blue light having a first wavelength in response to an applied electrical power; and

a yellow tinted film layer over the LED chip,

wherein the yellow tinted film layer interacts with the first wavelength light to produce light having a second wavelength, and the yellow tinted film layer has openings corresponding to the first and second electrical contacts to expose thereof, wherein the yellow tinted film layer is formed uniformly in thickness over at least a top surface of the LED chip.

2. The LED of claim 1 , further comprising a first bonding wire and a second bonding wire, the first and second bonding wires being connected to the first and second electrical contacts respectively through the openings of the yellow tinted film layer without any contact with the yellow tinted film layer.

3. The LED of claim 1 , wherein the yellow tinted film layer is selected from a group including ZnSe, CeO 2 , Al 2 O 3 , and Y 2 O 3 :Ce.

4. The LED of claim 1 , further comprising an inner passivation layer between the yellow tinted film layer and the LED chip.

5. The LED of claim 1 , wherein the first wavelength light and the second wavelength light combine to produce white light.

6. The LED of claim 1 , wherein the first wavelength light and the second wavelength light combine to produce light in a visible spectrum.

7. The LED of claim 1 , wherein the LED chip emits blue light and the yellow tinted film layer interacts with the blue light to produce light having the second wavelength.

8. The LED of claim 7 , wherein the LED chip's emitted blue light and the yellow tinted film layer's produced secondary wavelength light combine to produce white light.

9. The LED of claim 1 , wherein the LED chip has a lateral topology structure.

10. The LED of claim 1 , wherein the LED chip has a vertical topology structure.

11. The LED of claim 1 , further comprising an outer passivation layer over the yellow tinted film layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2013
From: LG ELECTRONICS, INC.
To: LG INNOTEK CO. LTD.
Reel/Frame 031410/0169 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2005
From: ORIOL, INC. (CAROL W. WU, TRUSTEE IN BANKRUPTCY OF THE ESTATE OF ORIOL, INC.)
To: LG ELECTRONICS
Reel/Frame 017444/0616 →