Method of forming a non-continuous conductive layer for laminated substrates
View Patent ↗A method of fabricating a circuit board is provided that includes forming a first layer of conductive material over an insulating layer, removing portions of the conductive material to define a first circuit pattern and a first rail area that is electrically isolated from the first circuit pattern, and removing portions of the conductive material from the first rail area. Optionally, the first rail area is positioned generally adjacent to a first edge of the circuit board and spans at least a portion of the length of the first edge. Optionally, portions of the conductive material of the first layer are removed to define a second rail area that is electrically isolated from the first circuit pattern and the first rail area, and portions of the conductive material of the first layer are also removed from the second rail area.
1. A method of fabricating a circuit board comprising:
forming a first layer of conductive material over an insulating layer;
removing portions of said conductive material of said first layer to define a first circuit pattern and a first rail area that is electrically isolated from said first circuit pattern; and,
removing portions of said conductive material of said first layer from said first rail area such that no continuous lengths of conductive material remain within said first rail area.
2. The method of claim 1 , wherein said first rail area is positioned generally adjacent to a first edge of said circuit board, and spans at least a portion of the length of said first edge.
3. A method of fabricating a circuit board comprising:
forming a first layer of conductive material over an insulating layer;
removing portions of said conductive material of said first layer to define a first circuit pattern and a first rail area that is electrically isolated from said first circuit pattern;
removing portions of said conductive material of said first layer from said first rail area such that no continuous lengths of conductive material remain within said first rail area;
removing portions of said conductive material of said first layer to define a second rail area that is electrically isolated from said first circuit pattern and said first rail area; and,
removing portions of said conductive material of said first layer from said second rail area.
4. The method of claim 3 , wherein said second rail area is positioned generally adjacent to a second edge of said circuit board, and spans at least a portion of the length of said second edge.
5. The method of claim 3 , further comprising:
forming second layer of conductive material over said insulating layer opposite said first layer;
removing portions of said conductive material of said second layer to define a second circuit pattern and a third rail area that is electrically isolated from said second circuit pattern; and,
removing portions of said conductive material of said second layer from said third rail area.
6. The method of claim 5 , further comprising:
removing portions of said conductive material of said second layer to define a fourth rail area that is electrically isolated from said second circuit pattern and said third rail area; and,
removing portions of said conductive material of said second layer from said fourth rail area.
7. A method of fabricating a circuit board comprising:
forming a first layer of conductive material over an insulating layer;
removing portions of said conductive material of said first layer to define a first circuit pattern and a first rail area that is electrically isolated from said first circuit pattern; and,
removing portions of said conductive material of said first layer from said first rail area such that no continuous lengths of conductive material remain within said first rail area;
forming second layer of conductive material over said insulating layer opposite said first layer;
removing portions of said conductive material of said second layer to define a second circuit pattern and a second rail area that is electrically isolated from said second circuit pattern; and,
removing portions of said conductive material of said second layer from said second rail area.